SYSTEM APPARATUS AND METHODS FOR PROCESSING SUBSTRATES USING ACOUSTIC ENERGY

• US 20070170812A1
• Filed: 01/22/2007
• Published: 07/26/2007
• Est. Priority Date: 01/20/2006
• Status: Abandoned Application

• Current Assignee: Naura Akrion Inc.
• Original Assignee: Naura Akrion Inc.
• Inventors: Fani, Pejman, Rouillard, Mark
• Application Number:
  US11/625,651
• Publication Number:
  US 20070170812A1
• Time in Patent Office: Days
• US Class Current: 310/311
• CPC Class Codes: B06B 1/0648 of rectangular shape
• CPC Class Codes: B06B 1/0655 of cylindrical shape
• CPC Class Codes: B08B 3/12 by sonic or ultrasonic vibrations washing or rinsing machines for crockery or tableware using sonic or ultrasonic waves A47L15/13; of natural teeth, of prostheses using ultrasonic techniques similar to those used for natural teeth A61C17/20; application of ultrasonic vibrations to chemical, physical or physico-chemical processes in general B01J19/10
• CPC Class Codes: H01L 21/67051 using mainly spraying means, e.g. nozzles
• CPC Class Codes: H01L 21/67057 with the semiconductor substrates being dipped in baths or vessels
• CPC Class Codes: H01L 2924/01012 Magnesium [Mg]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/0102 Calcium [Ca]
• CPC Class Codes: H01L 2924/01021 Scandium [Sc]
• CPC Class Codes: H01L 2924/01025 Manganese [Mn]
• CPC Class Codes: H01L 2924/01057 Lanthanum [La]
• CPC Class Codes: H01L 2924/01067 Holmium [Ho]
• CPC Class Codes: H01L 2924/01068 Erbium [Er]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/3011 Impedance

Abstract

A wafer cleaning system having a crystal or ceramic transducer assembly. The transducer assembly is adapted to convert electrical energy into sonic energy. The crystal or ceramic has a first conductive surface. The transducer assembly also has a transmitter made of an inert non-reactive plastic that transmits the sonic energy generated by the crystal or ceramic. The transmitter has a surface bonded directly to the conductive surface of the crystal or ceramic.

Claims

1. A transducer assembly for processing substrates comprising:

a crystal or ceramic adapted to convert electrical energy into sonic energy, the crystal or ceramic having a first conductive surface; and

a transmitter made of an inert non-reactive plastic for transmitting sonic energy generated by the crystal or ceramic, the transmitter having a first surface bonded directly to the first conductive surface of the crystal or ceramic.

2. The transducer assembly of claim 1 wherein the inert non-reactive plastic is a fluoropolymer.

3. The transducer assembly of claim 2 wherein the non-reactive plastic is selected from a group consisting of PTFE, PVDF, ETFE, TFE, FEP and PFA.

4. The transducer assembly of claim 1 wherein the inert non-reactive plastic is polypropylene, polyethylene, polyvinylchloride or polyimide.

5. The transducer assembly of claim 1 wherein the first surface of the transmitter is chemically and/or mechanically altered to increase cohesion between the first surface of the transmitter and the first conductive surface of the crystal or ceramic.

6. The transducer assembly of claim 1 wherein the first surface of the transmitter is etched to increase cohesion between the first surface of the transmitter and the first conductive surface of the crystal or ceramic.

7. The transducer assembly of claim 6 wherein the first surface of the transmitter is etched with a gaseous plasma or a liquid-based solution.

8. The transducer assembly of claim 1 wherein the inert non-reactive plastic is a fluoropolymer and the first surface of the transmitter is etched so that fluorine atoms on the first surface of the transmitter are replaced with a functional group.

9. The transducer assembly of claim 8 wherein the functional group is selected from a group consisting of a hydroxyl functional group, a carbonyl functional group, and a carboxyl functional group.

10. The transducer assembly of claim 1 wherein the first surface of the transmitter is mechanically roughened to increase cohesion between the first surface of the transmitter and the first conductive surface of the crystal or ceramic.

11. The transducer assembly of claim 1 further comprising an adhesive bonding the first surface of the transmitter directly to the first conductive surface of the crystal or ceramic.

12. The transducer assembly of claim 11 wherein the adhesive is selected from a group consisting of epoxy and cyanoacrylate-based adhesives.

13. The transducer assembly of claim 11 wherein the adhesive is sufficiently thin so that the adhesive does not substantially affect transmission of the sonic energy from the crystal or ceramic to the transmitter.

14. The transducer assembly of claim 13 wherein the adhesive has a thickness in a range between about 0.003 inches to about 0.007 inches.

15. The transducer assembly of claim 1 wherein the transmitter further comprises a second surface for coupling to a substrate process fluid, the sonic energy created by the crystal or ceramic being transmitted from the first surface of the transmitter to the second surface.

16. The transducer assembly of claim 1 wherein the first conductive surface of the crystal or ceramic is a metal coating or a conductive adhesive.

17. The transducer assembly of claim 1 wherein the inert non-reactive plastic is selected from a group consisting of PVDF, PFA, FEP, ETFE, PTFE, PP, PE, HPE, PVC and PI.

18. The transducer assembly of claim 1 comprising a plurality of the ceramic or crystals bonded to the transmitter.

19. The transducer assembly of claim 1 further comprising:

an adhesive that bonds the first surface of the transmitter to the first conductive surface of the crystal or ceramic, the adhesive having a thickness that does not substantially affect transmission of the sonic energy from the crystal or ceramic to the transmitter;

wherein the inert non-reactive plastic is selected from a group consisting of PVDF, PFA, FEP, ETFE, PTFE and TFE;

wherein the first surface of the transmitter is etched so that fluorine atoms on the first surface of the transmitter are replaced with a functional group; and

wherein the transmitter further comprises a second surface for coupling to a substrate process fluid, the sonic energy created by the crystal or ceramic being transmitted from the first surface of the transmitter to the second surface.

20. The transducer assembly of claim 1 further comprising an electrical energy source operably coupled to the ceramic or crystal.

21. The transducer assembly of claim 20 wherein the electrical energy source is adapted to supply electricity to the crystal or ceramic at a megasonic frequency.

22. The transducer assembly of claim 1 wherein the transmitter has a thickness in a range between about 0.02 inches to about 0.3 inches.

23. The transducer assembly of claim 22 wherein the transmitter has a thickness in a range between about 0.03 inches to about 0.08 inches.

24. The transducer assembly of claim 1 wherein the transmitter is a structure separate from a tank wall or tank floor.

25. The transducer assembly of claim 1 wherein the first surface of the transmitter is thermally fused to the first conductive surface of the crystal or ceramic.

26. A system for processing a substrate comprising:

means for supporting at least one substrate;

means for supplying a process fluid to the at least one substrate; and

a transducer assembly comprising a crystal or ceramic adapted to convert electrical energy into sonic energy, the crystal or ceramic having a first conductive surface, and a transmitter made of an inert non-reactive plastic for transmitting sonic energy generated by the crystal or ceramic, the transmitter having a first surface bonded directly to the first conductive surface of the crystal or ceramic and a second surface in contact with the process fluid.

27. The system of claim 26 wherein the support means is a rotatable support that supports a substrate in a substantially horizontal orientation, and wherein the process fluid supply means applies a film of process fluid to a surface of a substrate on the rotary support, the transducer assembly positioned so that at least a portion of the second surface of the transmitter is in contact with the film of the process fluid.

28. A method for processing a substrate comprising:

a) supporting a substrate;

b) contacting a first surface of a substrate with a process fluid;

c) providing a transducer assembly comprising a crystal or ceramic adapted to convert electrical energy into sonic energy, the crystal or ceramic having a first conductive surface, and a transmitter made of an inert non-reactive plastic for transmitting sonic energy generated by the crystal or ceramic, the transmitter having a first surface bonded directly to the first conductive surface of the crystal or ceramic and a second surface;

d) positioning the transducer assembly so that at least a portion of the second surface of the transmitter is in contact with the process fluid; and

e) applying an electrical signal to the crystal or ceramic so that sonic energy is created by the crystal or ceramic and transmitted by the transmitter into the process fluid and to the first surface of the substrate.