Organic light-emitting display device with frit seal and reinforcing structure

• US 20070170839A1
• Filed: 09/29/2006
• Published: 07/26/2007
• Est. Priority Date: 01/20/2006
• Status: Active Grant

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Inventors: Lee, Jong, Lee, Jae, Lee, Ung, Park, Jin, Lim, Dae, Choi, Dong, Sin, Sang
• Granted Patent: US 8,415,880 B2
• Time in Patent Office: Days
• US Class Current: 313/500
• CPC Class Codes: C03C 17/40 all coatings being metal coatings
• CPC Class Codes: C03C 2217/252 Al
• CPC Class Codes: C03C 2217/253 Cu
• CPC Class Codes: C03C 2218/34 Masking
• CPC Class Codes: C03C 27/06 Joining glass to glass by processes other than fusing fusing C03B23/20; units for use as elements for closing wall or like openings and comprising two or more parallel glass panes in spaced relationship, the panes being permanently secured together E06B3/66
• CPC Class Codes: C03C 8/24 Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
• CPC Class Codes: H05B 33/04 Sealing arrangements , e.g. against humidity
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/12 Active-matrix OLED [AMOLED] displays
• CPC Class Codes: H10K 59/17 Passive-matrix OLED displays
• CPC Class Codes: H10K 59/8722 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/421 using coherent electromagnetic radiation, e.g. laser annealing
• CPC Class Codes: H10K 71/851 Division of substrate

Abstract

Disclosed is an organic light-emitting display device in which the substrate and the encapsulation substrate are attached to each other by using a frit. The organic light-emitting display device includes a first substrate including a pixel region in which an organic light-emitting diode is formed, and a non-pixel region. The organic light-emitting diode includes an organic light-emitting layer between a first electrode and a second electrode. A second substrate attached to the first substrate. A frit is provided between the non-pixel region of the first substrate and the second substrate to attach the first substrate and the second substrate. A reinforcement material of resin is formed outside the frit.

Claims

1. An organic light-emitting display device, comprising:

a first substrate;

a second substrate placed over the first substrate;

an array of organic light-emitting pixels interposed between the first and second substrates;

a frit seal interposed between the first substrate and the second substrate while surrounding the array, wherein the frit seal, the first substrate and the second substrate in combination define an enclosed space in which the array is located; and

a structure comprising a portion interposed between the first and second substrates, wherein the structure is located outside the enclosed space.

2. The device of claim 1, wherein the structure improves structural strength of the device.

3. The device of claim 1, wherein the portion of the structure contacts the frit seal.

4. The device of claim 1, wherein the portion of the structure does not contact the frit seal.

5. The device of claim 1, wherein the structure comprises another portion that is not interposed between the first and second substrates.

6. The device of claim 1, wherein the structure comprises a cured polymeric resin.

7. The device of claim 1, wherein the structure comprises at least one selected from the group consisting of cyanoacrylate, acrylate, epoxy, acrylate, urethane acrylate and cured polymers of two or more of the foregoing.

8. The device of claim 1, wherein the structure substantially surrounds the frit seal.

9. The device of claim 1, wherein the structure is configured to improve sealing of the enclosed space.

10. The device of claim 1, wherein the frit seal is connected to the first substrate via a material formed between the frit seal and the first substrate.

11. The device of claim 1, wherein the structure contacts the first substrate.

12. The device of claim 1, wherein the structure is connected to the first substrate via another material between the structure and the first substrate.

13. The device of claim 1, wherein the first substrate comprises a first edge and the second substrate comprises a second edge extending generally along the first edges, and wherein the frit seal extends along the first and second edge while apart from the first and second edges, wherein the structure contacts the first and second substrates and extends along the first and second edges.

14. The device of claim 13, wherein the structure contacts first and second edges.

15. The device of claim 1, wherein the first substrate comprises a first edge and the frit seal is apart from the first edge from about 0.3 to about 0.7 mm.

16. The device of claim 1, wherein the first substrate comprises a front surface of the device, the front surface facing away from the second substrate, and wherein the structure provides a side surface of the device.

17. The device of claim 16, wherein the side surface is substantially planar.

18. The device of claim 1, wherein the frit seal comprises one or more materials selected from the group consisting of magnesium oxide (MgO), calcium oxide (CaO), barium oxide (BaO), lithium oxide (Li₂O), sodium oxide (Na₂O), potassium oxide (K₂O), boron oxide (B₂O₃), vanadium oxide (V₂O₅), zinc oxide (ZnO), tellurium oxide (TeO₂), aluminum oxide (Al₂O₃), silicon dioxide (SiO₂), lead oxide (PbO), tin oxide (SnO), phosphorous oxide (P₂O₅), ruthenium oxide (Ru₂O), rubidium oxide (Rb₂O), rhodium oxide (Rh₂O), ferrite oxide (Fe₂O₃), copper oxide (CuO), titanium oxide (TiO₂), tungsten oxide (WO₃), bismuth oxide (Bi₂O₃), antimony oxide (Sb₂O₃), lead-borate glass, tin-phosphate glass, vanadate glass, and borosilicate.

19. A method of making an organic light-emitting display device, the method comprising:

providing an unfinished device comprising;

a first substrate,

a second substrate placed over the first substrate,

an array of organic light-emitting pixels interposed between the first and second substrates, and

a frit seal interposed between the first substrate and the second substrate while surrounding the array, wherein the frit seal, the first substrate and the second substrate in combination define an enclosed space, in which the array is located; and

forming a structure outside the enclosed space such that the structure comprises a portion interposed between the first and second substrates.

20. The method of claim 19, wherein forming comprises:

placing a curable liquid material in the vicinity of the frit seal while not contacting the frit seal, whereby at least part of the curable liquid material spontaneously moves toward the frit seal by capillary action; and

solidifying the curable liquid material, thereby forming the structure.

21. The method of claim 19, wherein the first substrate comprises a first surface and the second substrate comprises a second surface facing the first surface, wherein the first surface, second surface and the frit seal together define a gap outside the enclosed space, and wherein forming the structure comprises applying a curable material into the gap.

22. The method of claim 21, wherein the curable material is liquid, and the curable material spontaneously moves toward the frit seal when being applied into the gap.

23. The method of claim 21, wherein forming the structure further comprises curing the curable material by activating a curing process of the curable material.

24. The method of claim 21, wherein the gap is formed throughout the periphery of the unfinished device, and wherein forming the structure comprises applying the curable material into the gap substantially throughout the periphery of the unfinished device.

25. The method of claim 19, wherein forming the structure comprises:

placing a curable material in vicinity of the frit seal; and

curing the curable material.

26. The method of claim 19, wherein forming the structure comprises:

providing a dispenser containing the curable material;

applying the curable material onto a surface of the unfinished device using the dispenser, whereby a portion of the curable material is formed between the first and second substrates; and

curing the curable material.

27. The method of claim 19, wherein forming the structure comprises:

providing a medium retaining the curable material;

applying the curable material on a surface of the unfinished device using the medium, whereby a portion of the curable material is formed between the first and second substrates; and

curing the curable material.

28. The method of claim 19, wherein forming the structure comprises:

providing a curable material in liquid;

dipping a periphery of the unfinished device into the liquid curable material, whereby a portion of the liquid curable material is formed between the first and second substrates; and

curing the curable material.