Organic light-emitting display device and method of manufacturing the same

• US 20070170857A1
• Filed: 09/29/2006
• Published: 07/26/2007
• Est. Priority Date: 01/25/2006
• Status: Abandoned Application

• Current Assignee: Samsung Mobile Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Samsung Mobile Display Company Limited (Samsung Electronics Co. Ltd.)
• Inventors: Park, Jin Woo, Lee, Jong Woo, Choi, Dong Soo
• Application Number:
  US11/529,914
• Publication Number:
  US 20070170857A1
• Time in Patent Office: Days
• US Class Current: 313/512
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/131 Interconnections, e.g. wiring lines or terminals
• CPC Class Codes: H10K 59/179 Interconnections, e.g. wiring lines or terminals
• CPC Class Codes: H10K 59/8722 Peripheral sealing arrangements, e.g. adhesives, sealants

Abstract

Disclosed is an organic light-emitting display device and method of manufacturing the same. Embodiments provide an organic light-emitting display device including a first substrate comprising a pixel region wherein an organic light-emitting display device comprised of a first electrode, an organic thin layer and a second electrode is formed. The first substrate also includes a non-pixel region encompassing the pixel region, where the non-pixel region includes a pad for receiving a signal from an external driver circuit. The non-pixel region also includes a metal line for transferring the signal provided through the pad to the organic light-emitting device. A second substrate is disposed over the first substrate to overlap the pixel region and a portion of the non-pixel region. A frit is provided between the first substrate and the second substrate in the non-pixel region, and a protective film is formed between the metal line and the frit, wherein the first substrate is bonded to the second substrate with the frit. Since the metal line is separated from the frit by the protective film the metal line is not directly exposed to heat generated from a laser beam and is not degraded by the heat from the laser beam. Preferably, the protective film is made of an inorganic material with heat-resistance. Also, the adhesion between the frit and the first substrate is improved, effectively preventing an infiltration of hydrogen and oxygen or moisture.

Claims

1. An organic light emitting device comprising:

a first substrate;

an array of organic light emitting pixels formed over the first substrate;

a second substrate placed over the first substrate, the array being interposed between the first and second substrate;

a frit seal interposed between the first and second substrates and surrounding the array such that the first substrate, the second substrate and the frit seal form an enclosed space where the array is located;

an electrically conductive line electrically connecting between a first circuit within the enclosed space and a second circuit outside the enclosed space, wherein the electrically conductive line comprises a portion interposed between the frit seal and the first substrate; and

a protective layer interposed between the frit seal and the portion of the electrically conductive line, the protective layer comprises a material having thermal conductivity less than about 150 W/mK.

2. The device of claim 1, wherein the material of the protective layer comprises an inorganic material.

3. The device of claim 1, wherein the material of the protective layer has thermal conductivity from about 50 W/mK to about 150 W/mK.

4. The device of claim 1, wherein the protective layer comprises one or more selected from the group consisting of Si_xN_y, SiO_xN_y and SiO₂.

5. The device of claim 1, wherein the protective layer is interposed between the frit seal and the entire portion of the electrically conductive line.

6. The device of claim 1, wherein the frit seal does not contact the portion of the electrically conductive line.

7. The device of claim 1, wherein the protective layer is substantially electrically nonconductive.

8. The device of claim 1, further comprising one or more additional layers between the frit seal and the portion of the electrically conductive line.

9. The device of claim 1, wherein there is substantially no organic material between the frit seal and the portion of the electrically conductive line.

10. The device of claim 1, wherein the electrically conductive material further comprises a portion that is not interposed between the frit seal and the first substrate.

11. The device of claim 1, wherein the protective layer is interposed between the frit seal and the first substrate substantially throughout where the frit seal extends.

12. The device of claim 1, wherein the frit seal contacts the protective layer and connects to the first substrate via the protective layer.

13. The device of claim 1, further comprising additional electrically conductive lines connecting between circuits within the enclosed space and circuits outside the enclosed space, wherein each additional electrically conductive line comprises a portion interposed between the frit seal and the first substrate, and wherein the protective layer is further interposed between the frit seal and the portions of the additional electrically conductive lines.

14. The device of claim 1, wherein the electrically conductive line comprises metal.

15. The device of claim 1, further comprising a planarization layer interposed between the array and the first substrate, and wherein the planarization layer comprises the same material as the protective layer.

16. The device of claim 1, further comprising a plurality of thin film transistors interposed between the first substrate and the array, wherein the electrically conductive line is made of a material used in the plurality of thin film transistors.

17. The device of claim 1, wherein the frit seal comprises one or more materials selected from the group consisting of magnesium oxide (MgO), calcium oxide (CaO), barium oxide (BaO), lithium oxide (Li2O), sodium oxide (Na2O), potassium oxide (K2O), boron oxide (B2O3), vanadium oxide (V2O5), zinc oxide (ZnO), tellurium oxide (TeO2), aluminum oxide (Al2O3), silicon dioxide (SiO2), lead oxide (PbO), tin oxide (SnO), phosphorous oxide (P2O5), ruthenium oxide (Ru2O), rubidium oxide (Rb2O), rhodium oxide (Rh2O), ferrite oxide (Fe2O3), copper oxide (CuO), titanium oxide (TiO2), tungsten oxide (WO3), bismuth oxide (Bi2O3), antimony oxide (Sb2O3), lead-borate glass, tin-phosphate glass, vanadate glass, and borosilicate.

18. A method of making an organic light emitting device, the method comprising:

providing an unfinished device comprising a first substrate, an array of organic light emitting pixels, an electrically conductive line and a protective layer, wherein the electrically conductive line electrically connecting between a first circuit and a second circuit, wherein the protective layer comprising a material having thermal conductivity less than about 150 W/mK;

placing a second substrate over the unfinished device such that the array is interposed between the first and second substrates;

interposing a frit between the first and second substrates such that the frit contacts the first and second substrates while surrounding the array, wherein the first substrate, the second substrate and the frit forms an enclosed space, and wherein the first circuit is located within the enclosed space, while the second circuit is located outside the enclosed space, wherein the frit overlaps a portion of the protective layer and a portion of the electrically conductive line, whereby the portion of the protective layer is interposed between the frit and the portion of the electrically conductive line; and

melting and resolidifying at least part of the frit so as to interconnect the unfinished device and the second substrate via the frit, wherein the frit connects to the protective layer with or without a material therebetween, and wherein the frit connects to the second substrate with or without a material therebetween.

19. The method of claim 18, wherein melting comprises applying heat to at least part of the frit by irradiating a laser beam or infrared ray thereto.

20. The method of claim 19, wherein at least part of the heat is transferred to the electrically conductive line through the protective layer.

21. The method of claim 19, wherein melting further comprises irradiating from a side of the second substrate facing away from the first substrate.

22. The method of claim 18, wherein the protective layer has thermal conductivity in a range from about 50 W/mK to about 150 W/mK.

23. The method of claim 18, wherein the protective layer comprises one or more selected from the group consisting of Si_xN_y, SiO_xN_y and SiO₂.

24. The method of claim 18, wherein the unfinished device further comprises a planarization layer between the array and the first substrate, and wherein the planarization layer comprises the same material.