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Electronic equipment enclosure with passive thermal vent door control

  • US 20070171609A1
  • Filed: 01/24/2006
  • Published: 07/26/2007
  • Est. Priority Date: 01/24/2006
  • Status: Abandoned Application
First Claim
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1. An electronic equipment assembly, comprising:

  • an enclosure having an outer surface, an inner volume, and an air flow opening extending between the outer surface and the inner volume, the air flow opening adapted to receive a flow of cooling air;

    an electronics unit disposed within the enclosure inner volume and configured, upon being energized, to generate heat;

    a vent door rotationally mounted on the enclosure and movable between an open position, in which a portion of the flow of cooling air flows through the air flow opening and into the inner volume to remove the heat generated by the electronics unit, and a closed position, in which the flow of cooling air is at least substantially inhibited from flowing through the air flow opening; and

    a passive thermal actuator disposed within the enclosure inner volume, the passive thermal actuator coupled to the vent door and at least thermally coupled the electronics unit, the passive thermal actuator comprised at least partially of a material having a shape or volume that varies with electronics unit temperature variations, the thermal actuator configured, in response to the electronics unit temperature variations, to selectively move the vent door between the open position and the closed position.

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