Electronic equipment enclosure with passive thermal vent door control

• US 20070171609A1
• Filed: 01/24/2006
• Published: 07/26/2007
• Est. Priority Date: 01/24/2006
• Status: Abandoned Application

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Kehl, Kenyon, Phielix, Tom
• Application Number:
  US11/339,432
• Publication Number:
  US 20070171609A1
• Time in Patent Office: Days
• US Class Current: 361/690
• CPC Class Codes: H05K 7/20181 Filters; Louvers
• CPC Class Codes: H05K 7/20209 Thermal management, e.g. fan control

Abstract

A passive thermal actuator is used to control the position of a vent door mounted on an enclosure, to thereby selectively permit cooling air flow to one or more electronic units disposed within the enclosure. The passive thermal actuator is coupled to the vent door, is at least thermally coupled the electronics unit, and is comprised at least partially of a material, such as a shape memory alloy (SMA), that has a shape or volume that varies with electronics unit temperature variations. The passive thermal actuator, in response to the electronics unit temperature variations, selectively moves the vent door between its open and closed positions.

Claims

1. An electronic equipment assembly, comprising:

an enclosure having an outer surface, an inner volume, and an air flow opening extending between the outer surface and the inner volume, the air flow opening adapted to receive a flow of cooling air;

an electronics unit disposed within the enclosure inner volume and configured, upon being energized, to generate heat;

a vent door rotationally mounted on the enclosure and movable between an open position, in which a portion of the flow of cooling air flows through the air flow opening and into the inner volume to remove the heat generated by the electronics unit, and a closed position, in which the flow of cooling air is at least substantially inhibited from flowing through the air flow opening; and

a passive thermal actuator disposed within the enclosure inner volume, the passive thermal actuator coupled to the vent door and at least thermally coupled the electronics unit, the passive thermal actuator comprised at least partially of a material having a shape or volume that varies with electronics unit temperature variations, the thermal actuator configured, in response to the electronics unit temperature variations, to selectively move the vent door between the open position and the closed position.

2. The assembly of claim 1, wherein:

the vent door is biased toward the closed position; and

the passive thermal actuator is configured to overcome the bias and thereby move the vent door to the open position at a predetermined electronics unit temperature.

3. The assembly of claim 2, wherein the passive thermal actuator is configured to allow the vent door to return to the closed position at a second predetermined electronics unit temperature.

4. The assembly of claim 1, wherein:

the vent door is biased toward the open position; and

the passive thermal actuator is configured to overcome the bias to thereby move the vent door to the closed position at a predetermined electronics unit temperature.

5. The assembly of claim 4, wherein the passive thermal actuator is configured to allow the vent door to return the open position at a second predetermined electronics unit temperature.

6. The assembly of claim 1, wherein the material is comprised of a two-way shape memory metal or a two-way shape memory metal alloy.

7. The assembly of claim 1, wherein the material is a two-way shape memory alloy.

8. The assembly of claim 7, wherein the two-way shape memory alloy is selected from the group consisting of nickel-titanium, copper-zinc-aluminum, and iron-manganese-silicon.

9. The assembly of claim 1, further comprising:

a cooling air source operable to supply the flow of cooling air.

10. The assembly of claim 9, wherein the cooling air source comprises a fan.

11. An electronic equipment assembly, comprising:

an enclosure having an outer surface, an inner volume, and an air flow opening extending between the outer surface and the inner volume, the air flow opening adapted to receive a flow of cooling air;

an electronics unit disposed within the enclosure inner volume and configured, upon being energized, to generate heat;

a vent door rotationally mounted on the enclosure and movable between an open position, in which a portion of the flow of cooling air flows through the air flow opening and into the inner volume to remove the heat generated by the electronics unit, and a closed position, in which the flow of cooling air is at least substantially inhibited from flowing through the air flow opening; and

a shape memory alloy actuator disposed within the enclosure inner volume, the shape memory alloy actuator coupled to the vent door and at least thermally coupled the electronics unit, the shape memory alloy actuator comprised at least partially of a two-way shape memory alloy and configured, in response to the electronics unit temperature variations, to selectively move the vent door between the open position and the closed position.

12. The assembly of claim 11, wherein:

the vent door is biased toward the closed position; and

the passive thermal actuator is configured to overcome the bias and thereby move the vent door to the open position at a predetermined electronics unit temperature.

13. The assembly of claim 12, wherein the passive thermal actuator is configured to allow the vent door to return to the closed position at a second predetermined electronics unit temperature.

14. The assembly of claim 11, wherein:

the vent door is biased toward the open position; and

the passive thermal actuator is configured to overcome the bias to thereby move the vent door to the closed position at a predetermined electronics unit temperature.

15. The assembly of claim 14, wherein the passive thermal actuator is configured to allow the vent door to return the open position at a second predetermined electronics unit temperature.

16. A system comprising:

an airflow source operable to supply a flow of cooling air;

an enclosure having an outer surface, an inner volume, and an air flow opening extending between the outer surface and the inner volume;

an electronics unit disposed within the enclosure inner volume and configured, upon being energized, to generate heat;

a vent door rotationally mounted on the enclosure and movable between an open position, in which at least a portion of the cooling air flows through the air flow opening and into the inner volume to remove the heat generated by the electronics unit, and a closed position, in which the cooling air is at least substantially inhibited from flowing through the air flow opening; and

a passive thermal actuator disposed within the enclosure inner volume, the passive thermal actuator coupled to the vent door and at least thermally coupled the electronics unit, the passive thermal actuator comprised at least partially of a material having a shape or volume that varies with electronics unit temperature variations, the thermal actuator configured, in response to the electronics unit temperature variations, to selectively move the vent door between the open position and the closed position.

17. The assembly of claim 16, wherein:

the vent door is biased toward the closed position; and

the passive thermal actuator is configured to overcome the bias and thereby move the vent door to the open position at a predetermined electronics unit temperature.

18. The assembly of claim 17, wherein the passive thermal actuator is configured to allow the vent door to return to the closed position at a second predetermined electronics unit temperature.

19. The assembly of claim 16, wherein:

the vent door is biased toward the open position; and

the passive thermal actuator is configured to overcome the bias to thereby move the vent door to the closed position at a predetermined electronics unit temperature.

20. The assembly of claim 19, wherein the passive thermal actuator is configured to allow the vent door to return the open position at a second predetermined electronics unit temperature.