THICKNESS DISTRIBUTION CONTROL FOR ELECTROPLATING

• US 20070175762A1
• Filed: 01/10/2007
• Published: 08/02/2007
• Est. Priority Date: 01/11/2006
• Status: Active Grant

• Current Assignee: E Ink Corporation (E Ink Holdings Incorporated)
• Original Assignee: SiPix Imaging, Inc. (E Ink Holdings Incorporated)
• Inventors: Chaug, Yi-Shung, Kang, Gary
• Granted Patent: US 8,114,262 B2
• Time in Patent Office: Days
• US Class Current: 205/81
• CPC Class Codes: C25D 17/007 Current directing devices
• CPC Class Codes: C25D 17/008 Current shielding devices
• CPC Class Codes: C25D 17/10 Electrodes , e.g. composition, counter electrode
• CPC Class Codes: C25D 21/12 Process control or regulation controlling or regulating in general G05
• CPC Class Codes: C25D 5/04 Electroplating with moving electrodes

Abstract

The invention is directed to an assembly for electroplating comprising an electroplating bath and non-conductive plates. The invention is also directed to an assembly for electroplating comprising an electroplating bath, elements with electrically adjustable resistance, and ampere-hour meters. The invention is further directed to methods for monitoring, controlling and adjusting the thickness distribution of an electroplated material on an object. The object can be of any shape as long as it can electrically charged.

Claims

1. An assembly for electroplating, which assembly comprises:

a) an electroplating bath in which an object to be electroplated and multiple anodes are immersed wherein said object acts as a cathode; and

b) non-conductive plates placed between said object and said anode(s) wherein the position of said non-conductive plates is individually adjustable to control the area of coverage of said anodes.

2. The assembly of claim 1 further comprising a controller which sends signals to adjust the position of each of said non-conductive plates.

3. The assembly of claim 2 further comprising ampere-hour meters through which said anodes are connected to said controller and a rectifier.

4. The assembly of claim 3 wherein said object is connected directly, or through a main ampere-hour meter, to the rectifier.

5. An assembly for electroplating, which assembly comprises:

a) an electroplating bath in which an object to be electroplated and multiple anodes are immersed and said object acts as a cathode;

b) elements with electrically adjustable resistance which are individually and directly or indirectly connected to each of said anodes; and

c) ampere-hour meters which are individually connected to the elements with electrically adjustable resistance.

6. The assembly of claim 5 wherein each of said elements is connected directly, or through an ampere-hour meter, to said anodes.

7. The assembly of claim 5 wherein said element with electrically adjustable resistance is a rheostat or variable resistor.

8. A method for monitoring, controlling and adjusting the thickness distribution of an electroplated material on an object in an electroplating process, which method comprises:

a) immersing in an electroplating bath multiple anodes and an object to be electroplated and to act as a cathode;

b) providing non-conductive plates placed between said object and said anodes; and

c) adjusting individually the position of said non-conductive plates to control the area of coverage of said anodes.

9. The method of claim 8 wherein said step (c) is carried out according to signals sent by a controller.

10. The method of claim 9 wherein said controller compiles deposition data received from ampere-hour meters.

11. The method of claim 10 wherein each of said anodes is connected to an individual ampere-hour meter.

12. A method for monitoring, controlling and adjusting the thickness distribution of an electroplated material on an object in an electroplating process, which method comprises:

a) immersing in an electroplating bath multiple anodes and an object to be electroplated and to act as a cathode; and

b) providing elements with electrically adjustable resistance which are individually connected to each of said anodes.

13. The method of claim 12 wherein each of said elements with electrically adjustable resistance is individually connected to said anode through an ampere-hour meter or is located between said anode and an ampere-hour meter.

14. The method of claim 12 wherein said element with electrically adjustable resistance is a rheostat or variable resistor.

15. The method of claim 12 wherein the element with electrically adjustable resistance has electrical resistance which is adjusted according to signals sent by a controller.

16. The method of claim 15 wherein said controller compiles deposition data received from ampere-hour meters.