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THICKNESS DISTRIBUTION CONTROL FOR ELECTROPLATING

  • US 20070175762A1
  • Filed: 01/10/2007
  • Published: 08/02/2007
  • Est. Priority Date: 01/11/2006
  • Status: Active Grant
First Claim
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1. An assembly for electroplating, which assembly comprises:

  • a) an electroplating bath in which an object to be electroplated and multiple anodes are immersed wherein said object acts as a cathode; and

    b) non-conductive plates placed between said object and said anode(s) wherein the position of said non-conductive plates is individually adjustable to control the area of coverage of said anodes.

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