Structure for integrating LED circuit onto heat-dissipation substrate

• US 20070176182A1
• Filed: 01/27/2006
• Published: 08/02/2007
• Est. Priority Date: 01/27/2006
• Status: Abandoned Application

• Current Assignee: Formosa Epitaxy Incorporated (Epistar Corporation)
• Original Assignee: Formosa Epitaxy Incorporated (Epistar Corporation)
• Inventors: Lin, Yi-Fong, Chu, Yin-Cheng, Pan, Shyi-Ming, Chien, Fen-Ren, Wen, Way-Jze, Tseng, Huan-Che, Chiang, Chih-Wei
• Application Number:
  US11/340,660
• Publication Number:
  US 20070176182A1
• Time in Patent Office: Days
• US Class Current: 257/79
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]

Abstract

A structure for integrating LED circuit onto a heat-dissipation substrate is disclosed. At least an electronic component and a LED chip are integrated on a heat-dissipation substrate. The electronic component can be a passive component, a drive chip, an electrostatic discharge protection device, or a sensing component. Therefore, both wire-bonding area of the LED chip and the series resistance of wires are reduced while the heat dissipation efficiency is enhanced.

Claims

1. A structure for integrating light emitting diode circuit onto a heat dissipation substrate comprising:

a light emitting diode chip; and

a heat dissipation substrate that connects with the light emitting diode chip and includes at least one electronic component;

wherein an insulating layer and a circuit layer are sequentially disposed on the heat dissipation substrate while the circuit layer is electrically connected with the light emitting diode chip as well as the electronic component.

2. The structure as claimed in claim 1, wherein the light emitting diode chip is in flip chip package or surface mounting device (SMD) package.

3. The structure as claimed in claim 1, wherein the heat dissipation substrate is made from conductive material or semiconductor material.

4. The structure as claimed in claim 1, wherein the heat dissipation substrate is made from metal.

5. The structure as claimed in claim 1, wherein the electronic component is a passive component.

6. The structure as claimed in claim 1, wherein the electronic component is a drive chip.

7. The structure as claimed in claim 1, wherein the electronic component is an electrostatic discharge protection device.

8. The structure as claimed in claim 1, wherein the electronic component is a sensing component.

9. The structure as claimed in claim 1, wherein the LED chip is a LED chip with a horizontal electrode or a vertical electrode.

10. The structure as claimed in claim 1, wherein a first electrode and a second electrode of the light emitting diode chip are electrically connected with the heat dissipation substrate and the circuit layer respectively.

11. The structure as claimed in claim 1, wherein a first electrode and a second electrode of the light emitting diode chip are electrically connected with the circuit layer.

12. The structure as claimed in claim 1, wherein a first electrode and a second electrode of the electronic component are electrically connected with the heat dissipation substrate and the circuit layer respectively.

13. The structure as claimed in claim 1, wherein a first electrode and a second electrode of the electronic component are electrically connected with the circuit layer.

14. A structure for integrating light emitting diode circuit onto a heat dissipation substrate comprising:

a light emitting diode chip; and

a heat dissipation substrate connected with the light emitting diode chip and disposed with at least one electronic component.

15. The structure as claimed in claim 14, wherein the light emitting diode chip is in flip chip package or surface mounting device (SMD) package.

16. The structure as claimed in claim 14, wherein the heat dissipation substrate is made from conductive material or semiconductor material.

17. The structure as claimed in claim 14, wherein the heat dissipation substrate is made from metal.

18. The structure as claimed in claim 14, wherein the electronic component is a passive component.

19. The structure as claimed in claim 14, wherein the electronic component is a drive chip.

20. The structure as claimed in claim 14, wherein the electronic component is an electrostatic discharge protection device.

21. The structure as claimed in claim 14, wherein the electronic component is a sensing component.

22. The structure as claimed in claim 14, wherein the LED chip is a LED chip with a horizontal electrode or a vertical electrode.