Organic light emitting display and method of fabricating the same

• US 20070176549A1
• Filed: 09/29/2006
• Published: 08/02/2007
• Est. Priority Date: 01/27/2006
• Status: Active Grant

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Inventors: Park, Jin Woo
• Granted Patent: US 8,125,146 B2
• Time in Patent Office: Days
• US Class Current: 313/512
• CPC Class Codes: C03C 8/02 Frit compositions, i.e. in a powdered or comminuted form
• CPC Class Codes: H10K 50/841 Self-supporting sealing arrangements
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/12 Active-matrix OLED [AMOLED] displays
• CPC Class Codes: H10K 59/17 Passive-matrix OLED displays
• CPC Class Codes: H10K 59/871 Self-supporting sealing arrangements
• CPC Class Codes: H10K 59/8722 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/421 using coherent electromagnetic radiation, e.g. laser annealing

Abstract

An organic light emitting display includes a first substrate including a pixel region in which organic light emitting diodes are formed and a non-pixel region formed on the outer circumference of the pixel region. A second substrate is attached to the first substrate, and a sealing is provided between the first substrate and the second substrate. The sealing includes a first frit layer and a second frit layer which melts substantially more easily than the first frit layer upon irradiation of a laser or infrared beam thereto.

Claims

1. An organic light emitting display device, comprising:

a first substrate made of a single layer or multiple layers;

a second substrate made of a single layer or multiple layers and opposing the first substrate;

an array of organic light emitting pixels interposed between the first and second substrates; and

a frit seal comprising a plurality of elongated segments, which forms a closed loop surrounding the array and interposed between the first and second substrates, wherein the frit seal, the first substrate and the second substrate together define an enclosed space in which the array is located, wherein the frit seal comprises a first frit portion contacting the first substrate and a second frit portion contacting the second substrate, wherein a first one of the plurality of segments comprises the first and second frit portions, wherein the second flit portion is configured to melt substantially easier than the first frit portion upon irradiation of a laser or infrared beam thereto.

2. The device of claim 1, wherein the first and second frit portions contact each other.

3. The device of claim 1, wherein each of the first and second frit portions comprises a light-to-heat conversion material configured to generate heat upon receiving the laser or infrared beam, and wherein the second frit portion comprises an amount of the light-to-heat conversion material substantially more than the first frit portion.

4. The device of claim 1, wherein the second frit portion comprises a light-to-heat conversion material configured to generate heat upon receiving the laser or infrared beam, and wherein the first frit portion is substantially free of the light-to-heat conversion material.

5. The device of claim 1, wherein the first frit portion is substantially transparent.

6. The device of claim 1, wherein the second frit portion is substantially non-transparent.

7. The device of claim 1, wherein one of the first and second frit portions comprises at least one selected from the group consisting of SiO₂, PbO, V₂O₅, ZnO, B₂O₃, and P₂O₅.

8. The device of claim 1, wherein the first frit portion comprises a first end facing the second substrate, the second frit portion comprises a second end facing the first substrate, wherein the first end has a first width perpendicular to the shortest imaginary line interconnecting the first and second substrates in a plane perpendicular to an elongation of the first segment, and wherein the second end has a second width in the same direction, wherein the first width is greater than the second width.

9. The device of claim 8, wherein the second end contacts a peripheral portion of the first end along the direction.

10. The device of claim 8, wherein the second end contacts a central portion of the first end along the direction.

11. The device of claim 1, wherein the first frit portion comprises a first end facing the second substrate, the second frit portion comprises a second end facing the first substrate, wherein the first portion has a first height from the first substrate to the first end in a direction parallel to the shortest imaginary line interconnecting the first and second substrates in a plane perpendicular to an elongation of the first segment, wherein the second portion has a second height from the second substrate to the second end in the same direction, wherein the first height is greater than the second height.

12. The device of claim 1, wherein the array is formed on the second substrate, and wherein the array and the first substrate form a gap therebetween.

13. The device of claim 1, wherein the device is configured to display image through the first substrate.

14. The device of claim 1, wherein the first frit portion has a volume substantially greater than that of the second frit portion.

15. The device of claim 1, wherein the first frit portion is bonded to the first substrate by baking the first substrate and the first frit portion in contact with the first substrate.

16. The device of claim 1, wherein the second frit portion is bonded to the second substrate and the first frit portion by applying a laser or infrared light thereto.

17. The device of claim 1, further comprising at least one supplementary structure extending along the first segment, wherein the at least one supplementary structure is interposed between and interconnects the first and second substrates, wherein the supplementary structure is located inside or outside the enclosed space.

18. The device of claim 17, wherein the supplementary structure is configured to improve sealing of the enclosed space.

19. The device of claim 1, further comprising a first supplementary structure and a second supplementary structure, each of which is interposed between and interconnects the first and second substrates, wherein the first supplementary structure extends along the first segment inside the enclosed space, and wherein the second supplementary structure extends along the first segment outside the enclosed space.

20. The device of claim 1, further comprising a supplementary structure extending along the first segment and located inside or outside the enclosed space, wherein the supplementary structure comprises a portion interposed between and interconnects the first frit portion and the second substrate.

21. The device of claim 20, wherein the supplementary structure comprises another portion that is not interposed between the first frit portion of the frit seal and the first substrates.

22. The device of claim 1, further comprising a first supplementary structure and a second supplementary structure, each of which extends along the first segment inside or outside the enclosed space, wherein the first supplementary structure is interposed between and interconnects the first and second substrates, wherein the second supplementary structure is interposed between and interconnects the first frit portion and the second substrate.

23. The device of claim 1, wherein the frit seal comprises one or more materials selected from the group consisting of magnesium oxide (MgO), calcium oxide (CaO), barium oxide (BaO), lithium oxide (Li₂O), sodium oxide (Na₂O), potassium oxide (K₂O), boron oxide (B₂O₃), vanadium oxide (V₂O₅), zinc oxide (ZnO), tellurium oxide (TeO₂), aluminum oxide (Al₂O₃), silicon dioxide (SiO₂), lead oxide (PbO), tin oxide (SnO), phosphorous oxide (P₂O₅), ruthenium oxide (Ru₂O), rubidium oxide (Rb₂O), rhodium oxide (Rh₂O), ferrite oxide (Fe₂O₃), copper oxide (CuO), titanium oxide (TiO₂), tungsten oxide (WO₃), bismuth oxide (Bi₂O₃), antimony oxide (Sb₂O₃), lead-borate glass, tin-phosphate glass, vanadate glass, and borosilicate.