Semiconductor device

• US 20070176845A1
• Filed: 03/24/2005
• Published: 08/02/2007
• Est. Priority Date: 03/26/2004
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Akiba, Mai, Yamazaki, Shunpei
• Granted Patent: US 8,049,669 B2
• Time in Patent Office: Days
• US Class Current: 343/895
• CPC Class Codes: G06K 19/07728 the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: G06K 19/07783 the coil being planar
• CPC Class Codes: G06K 19/07784 the inductive antenna consisting of a plurality of coils stacked on top of one another
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2225/06513 Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
• CPC Class Codes: H01L 2225/06541 Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV] manufacturing via connections per se H01L21/76898
• CPC Class Codes: H01L 27/1214 comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
• CPC Class Codes: H01L 27/1266 the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
• CPC Class Codes: H01L 27/13 combined with thin-film or thick-film passive components

Abstract

It is an object of the present invention to provide an ID chip in which gain of an antenna is increased and the mechanical strength of an integrated circuit can be enhanced without suppressing a circuit scale. A semiconductor device typified by an ID chip of the present invention includes an integrated circuit using a semiconductor element formed from a thin semiconductor film and an antenna connected to the integrated circuit. The antenna and the integrated circuit are formed on a substrate, and a conducting wire or a conductive film included in the antenna is divided into two layers and formed so as to sandwich the substrate provided with the integrated circuit.

Claims

1. A semiconductor device comprising:

an antenna including a first conducting wire and a second conducting wire; and

an integrated circuit over a substrate;

wherein the substrate is provided between the first conducting wire and the second conducting wire.

10. The semiconductor device according to any one of claims 1 through 5,

wherein the integrated circuit includes a rectification circuit, a demodulation circuit, and a modulation circuit.

2. A semiconductor device comprising:

an antenna including a first conducting wire and a second conducting wire; and

an integrated circuit over a substrate;

wherein the substrate is provided between the first conducting wire and the second conducting wire, and

wherein the first conducting wire and the second conducting wire are connected in a contact hole formed in the substrate.

3. A semiconductor device comprising:

an antenna including a first conductive film and a second conductive film; and

an integrated circuit over a substrate,

wherein the substrate is provided between the first conductive film and the second conductive film.

4. A semiconductor device comprising:

an antenna including a first conductive film and a second conductive film; and

an integrated circuit over a substrate,

wherein the substrate is provided between the first conductive film and the second conductive film, and

wherein the first conductive film and the second conductive film are connected in a contact hole formed in the substrate.

5. A semiconductor device comprising:

an integrated circuit having a thin film transistor over a front surface of a substrate;

an insulating film over the integrated circuit;

a first conducting wire functioning as an antenna electrically connecting to the integrated circuit through a contact hole in the insulating film;

a second conducting wire functioning as an antenna over a rear surface of the substrate.

13. The semiconductor device according to claim 5,

wherein the first conducting wire and the second conducting wire are electrically connected.

14. The semiconductor device according to claim 5,

wherein the first conducting wire and the second conducting wire are electrically isolated from each other.

6. A semiconductor device comprising:

a first antenna including a first conducting wire;

a second antenna including a second conducting wire; and

an integrated circuit over a substrate,

wherein the substrate is provided between the first conducting wire and the second conducting wire.

11. The semiconductor device according to any one of claims 6 through 9,

wherein the integrated circuit includes a rectification circuit, a demodulation circuit, and a modulation circuit,

wherein the first antenna is connected to the rectification circuit and the demodulation circuit, and

wherein the second antenna is connected to the modulation circuit.

12. The semiconductor device according to any one of claims 6 through 9,

wherein the integrated circuit includes a rectification circuit, a demodulation circuit, and a modulation circuit,

wherein the first antenna is connected to the rectification circuit, and

wherein the second antenna is connected to the modulation circuit and the demodulation circuit.

7. A semiconductor device comprising:

a first antenna including a first conducting wire;

a second antenna including a second conducting wire; and

an integrated circuit over a substrate,

wherein the substrate is provided between the first conducting wire and the second conducting wire,

wherein the first conducting wire and the second conducting wire are electrically isolated from each other,

wherein the first conducting wire is connected to the integrated circuit, and

wherein the second conducting wire is connected to the integrated circuit in a contact hole formed in the substrate.

8. A semiconductor device comprising:

a first antenna including a first conductive film;

a second antenna including a second conductive film; and

an integrated circuit over a substrate;

wherein the substrate is provided between the first conductive film and the second conductive film.

9. A semiconductor device comprising:

a first antenna including a first conductive film;

a second antenna including a second conductive film; and

an integrated circuit over a substrate,

wherein the substrate is provided between the first conductive film and the second conductive film,

wherein the first conductive film and the second conductive film are electrically isolated from each other,

wherein the first conductive film is connected to the integrated circuit, and

wherein the conductive film is connected to the integrated circuit in a contact hole formed in the substrate.

15. A semiconductor device comprising:

a first conducting wire and a second conducting wire; and

an integrated circuit over a substrate;

wherein the substrate is provided between the first conducting wire and the second conducting wire.

20. The semiconductor device according to any one of claims 15 through 19,

wherein the integrated circuit includes a rectification circuit, a demodulation circuit, and a modulation circuit.

16. A semiconductor device comprising:

a first conductive film and a second conductive film; and

an integrated circuit over a substrate,

wherein the substrate is provided between the first conductive film and the second conductive film.

17. A semiconductor device comprising:

an integrated circuit having a thin film transistor over a front surface of a substrate;

an insulating film over the integrated circuit;

a first conducting wire electrically connecting to the integrated circuit through a contact hole in the insulating film;

a second conducting wire functioning as an antenna over a rear surface of the substrate.

18. A semiconductor device comprising:

a first conducting wire;

a second conducting wire; and

an integrated circuit over a substrate,

wherein the substrate is provided between the first conducting wire and the second conducting wire.

19. A semiconductor device comprising:

a first conductive film;

a second conductive film; and

an integrated circuit over a substrate;

wherein the substrate is provided between the first conductive film and the second conductive film.