Micromechanical Getter Anchor

• US 20070177246A1
• Filed: 04/07/2007
• Published: 08/02/2007
• Est. Priority Date: 11/30/2000
• Status: Abandoned Application

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Liu, Jwei, Fisher, Edward, Smith, Jack, Robbins, Roger, Holton, Joyce
• Application Number:
  US11/697,720
• Publication Number:
  US 20070177246A1
• Time in Patent Office: Days
• US Class Current: 359/291
• CPC Class Codes: B81B 2203/0307 Anchors
• CPC Class Codes: B81B 7/0038 using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
• CPC Class Codes: G02B 26/0833 the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD G02B26/0825 takes precedence; micromechanical devices in general B81B
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/484 Connecting portions
• CPC Class Codes: H01L 2224/48599 Principal constituent of the connecting portion of the wire connector being Gold (Au)
• CPC Class Codes: H01L 2224/48997 Reinforcing structures
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 23/13 characterised by the shape
• CPC Class Codes: H01L 23/26 including materials for absorbing or reacting with moisture or other undesired substances , e.g. getters
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H04N 5/7458 : the modulator being an array of deformable mirrors, e.g. digital micromirror device [DMD]

Abstract

One embodiment provides an anchor to hold getter materials in place within a micromechanical device package substrate, said anchor comprising: a first cavity face; and a second cavity face. The cavity faces define an anchor cavity and mechanically retain a getter away from a region holding the micromechanical device. Another embodiment provides an anchor to hold a getter in place within a micromechanical device package. The anchor comprises: a package substrate; and a member attached to the package substrate, the member shaped to provide mechanical retention of the getter material formed over said member. Another embodiment provides a micromechanical device package comprising: a package substrate; a package lid enclosing a package cavity; a micromechanical device in the package cavity; and a getter anchor in the package cavity. Other embodiments provide methods of packaging and forming packages having a getter anchor. One getter anchor is formed in a substrate 906 comprised of at least three layers. The layers form a cavity in the substrate 906 with a wide bottom portion—formed in the middle layer 902 and a relatively narrower top portion—formed by the top layer 904. The narrow portion helps to retain the getter in the cavity by creating a mechanical lock on the wide portion of getter in the bottom of the cavity. The preceding abstract is submitted with the understanding that it will only be used to assist in determining, from a cursory inspection, the nature and gist of the technical disclosures as described in 37 C.F.R. §1.72(b). In no case should this abstract be used for interpreting the scope of any patent claims.

Claims

1-27. -27. (canceled)

28. A micromechanical device package comprising:

a package substrate;

a package lid enclosing a package cavity;

a micromechanical device in said package cavity; and

a getter anchor in said package cavity.

29. The micromechanical device package of claim 28, wherein said getter anchor comprises at least one member attached to said package substrate.

30. The micromechanical device package of claim 28, wherein said member is attached to said package substrate by one point.

31. The micromechanical device package of claim 28, wherein said member is attached to said package substrate by one end.

32. The micromechanical device package of claim 28, wherein said member is attached to said package substrate by at least two points.

33. The micromechanical device package of claim 28, wherein said member is attached to said package substrate by at least two ends.

34. The micromechanical device package of claim 28, wherein said member is attached to said package substrate though an intermediate bond pad.

35. The micromechanical device package of claim 28, wherein said member is a wire.

36. The micromechanical device package of claim 28, wherein said member is a bond wire.

37. The micromechanical device package of claim 28, wherein said anchor is a cavity anchor.

38. The micromechanical device package of claim 28, wherein said cavity anchor is formed in said package substrate.

39. The micromechanical device package of claim 28, wherein said cavity anchor is a slot formed in said package substrate.

40. The micromechanical device package of claim 28, wherein said slot has a narrow top and a wider bottom portion.

41. The micromechanical device package of claim 28, wherein said cavity anchor formed to provide mechanical retention of a getter material.

42-67. -67. (canceled)