THERMAL INTERCONNECTION FOR CAPACITOR SYSTEMS
First Claim
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1. A method of reducing a double-layer capacitor temperature, comprising the steps of:
- providing one or more double-layer capacitor;
coupling the one or more double-layer capacitor to an interconnection;
passing a current through the interconnection and the double-layer capacitors; and
using the interconnection to reduce a temperature of the double-layer capacitors based on a temperature external to the double-layer capacitor.
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Abstract
Thermal protection is provided in systems utilizing high-current double-layer capacitors.
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3 Claims
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1. A method of reducing a double-layer capacitor temperature, comprising the steps of:
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providing one or more double-layer capacitor;
coupling the one or more double-layer capacitor to an interconnection;
passing a current through the interconnection and the double-layer capacitors; and
using the interconnection to reduce a temperature of the double-layer capacitors based on a temperature external to the double-layer capacitor. - View Dependent Claims (2, 3)
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Specification