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THERMAL INTERCONNECTION FOR CAPACITOR SYSTEMS

  • US 20070177334A1
  • Filed: 04/06/2007
  • Published: 08/02/2007
  • Est. Priority Date: 11/07/2003
  • Status: Abandoned Application
First Claim
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1. A method of reducing a double-layer capacitor temperature, comprising the steps of:

  • providing one or more double-layer capacitor;

    coupling the one or more double-layer capacitor to an interconnection;

    passing a current through the interconnection and the double-layer capacitors; and

    using the interconnection to reduce a temperature of the double-layer capacitors based on a temperature external to the double-layer capacitor.

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