THERMAL INTERCONNECTION FOR CAPACITOR SYSTEMS

• US 20070177335A1
• Filed: 04/06/2007
• Published: 08/02/2007
• Est. Priority Date: 11/07/2003
• Status: Active Grant

• Current Assignee: UCAP Power, Inc.
• Original Assignee: Maxwell Technologies Incorporated (Tesla Inc.)
• Inventors: Thrap, Guy
• Granted Patent: US 7,511,942 B2
• Time in Patent Office: Days
• US Class Current: 361/502
• CPC Class Codes: H01G 2/14 Protection against electric or thermal overload by cooling H01G2/08
• CPC Class Codes: H01G 9/0003 Protection against electric or thermal overload; cooling arrangements; means for avoiding the formation of cathode films H01G9/12 takes precedence
• CPC Class Codes: H01G 9/26 Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices with each other
• CPC Class Codes: Y02E 60/13 Energy storage using capacitors
• CPC Class Codes: Y02T 10/70 Energy storage systems for electromobility, e.g. batteries

Abstract

Thermal protection is provided in systems utilizing hi-current double-layer capacitors.

Claims

1. A system, comprising:

at least one double-layer capacitor; and

an interconnection, the interconnection coupled to the at least one double-layer capacitor, the interconnection for carrying capacitor current to or from the a least one double-layer capacitor, the interconnection functionally coupled to the at least one double-layer capacitor to reduce a temperature of the at least one double-layer capacitor.

2. The system of claim 1, wherein the interconnection comprises a low temperature alloy.

3. The system of claim 1, wherein the interconnection comprises a thermal fuse.

4. The system of claim 1, wherein the interconnection comprises a thermal contactor.

5. The system of claim 1, wherein the temperature is above about 85 degrees Celsius.

6. The system of claim 1, wherein the temperature is reduced independent of the current.

7. The system of claim 1, wherein the interconnection comprises an increased surface area.

8. The system of claim 2, wherein the low temperature alloy is selected from a group consisting of Bismuth-Lead, Tin, Cadmium, and Indium.

9. The system of claim 1, wherein the current comprises a current of at least 275 amps.

10. The system of claim 1, wherein the at least one double-layer capacitor is coupled to an electrical device.

11. The system of claim 10, wherein the electrical device is a vehicular electrical device.

12. The system of claim 11, wherein the electrical device comprises an engine.

13. The system of claim 10, wherein the system utilizes a voltage above 40 volts.

14. The system of claim 1, comprising a balancing circuit, wherein the first capacitor comprises a third terminal and the second capacitor comprises a fourth terminal, and wherein the balancing circuit is connected to the third and fourth terminal a balancing circuit connected to the first terminal of the first double-layer capacitor and the fourth terminal of the second double-layer capacitor.

15. The system of claim 3, wherein the thermal fuse comprises a bus bar.

16. The system of claim 3, further comprising a source of external heat removal.

17. The system of claim 16, wherein the source of external heat removal comprises a fluid, and wherein the at least one double-layer capacitor is immersed in the fluid.

18. The system of claim 17, wherein the fluid is disposed in a sealed container.

19. The system of claim 18, wherein the fluid comprises an oil.

20. The system of claim 18, wherein the fluid comprises an alcohol.

21. The system of claim 18, wherein the fluid comprises a colored fluid.

22. The system of claim 12, wherein the system utilizes a voltage above 40 volts.

23. The system of claim 14, wherein the at least one double-layer capacitor is coupled to an electrical device.

24. The system of claim 23, wherein the electrical device is a vehicular electrical device.

25. The system of claim 24, wherein the electrical device comprises an engine.

26. The system of claim 25, wherein the system utilizes a voltage above 40 volts.

27. The system of claim 14, wherein the interconnection comprises a low temperature alloy.