THREE-DIMENSIONAL COLD PLATE AND METHOD OF MANUFACTURING SAME

• US 20070177356A1
• Filed: 01/25/2007
• Published: 08/02/2007
• Est. Priority Date: 02/01/2006
• Status: Abandoned Application

• Current Assignee: Cool Shield, Inc.
• Original Assignee: Cool Shield, Inc.
• Inventors: Panek, Jeffrey
• Application Number:
  US11/626,894
• Publication Number:
  US 20070177356A1
• Time in Patent Office: Days
• US Class Current: 361/712
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/367 Cooling facilitated by shape of device H01L23/38, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence
• CPC Class Codes: H01L 23/3737 Organic materials with or without a thermoconductive filler
• CPC Class Codes: H01L 23/433 Auxiliary members in containers characterised by their shape, e.g. pistons
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 7/20463 Filling compound, e.g. potted resin

Abstract

A three-dimensional cold plate assembly and method of manufacturing the same is disclosed. The cold plate assembly includes a metallic substrate having a top side and a bottom side and a three-dimensional molded contoured plastic body having a top side and a bottom side. The bottom side of the metallic substrate is bonded to the top side of the plastic body. The bottom side of the plastic body is contoured to substantially complementarily mate with a profile of heat generating components in an electronic device. The method of manufacturing the cold plate includes the steps of pretreating and cleaning the metallic substrate, etching the metallic substrate and overmolding the plastic body onto the bottom side of the metallic substrate to provide a bottom contoured side of the plastic body that substantially complementarily mates with the profile of heat generating components in an electronic device.

Claims

1. A three-dimensional cold plate assembly for an electronic device with heat generating components, comprising:

a metallic substrate having a top side and a bottom side;

a three-dimensional molded contoured plastic body having a top side and a bottom side;

the bottom side of the metallic substrate being bonded to the top side of the plastic body;

the bottom side of the plastic body being contoured to substantially complementarily mate with a profile of heat generating components in an electronic device.

2. The assembly of claim 1, further comprising:

a first thermal interface layer formed on the bottom side of the plastic body.

3. The assembly of claim 2, wherein said first thermal interface layer is a thermally conductive tape.

4. The assembly of claim 1, further comprising:

a second thermal interface layer formed on the top of the metallic substrate.

5. The assembly of claim 1, wherein the metallic substrate is selected from the group consisting essentially of metals and metal alloys.

6. The assembly of claim 1, wherein the plastic body is formed from a thermoplastic polymer.

7. The assembly of claim 6, wherein said thermoplastic polymer is a dielectric material.

8. The assembly of claim 1, wherein the plastic body is formed from a thermoplastic polymer selected from the group consisting essentially of polycarbonates, polyethylene, polypropylene, acrylics, vinyls, fluorocarbons, polyamides, polyesters, polyphenylene sulfide, and liquid crystal polymers.

9. The assembly of claim 1, wherein said plastic body further comprises a thermally conductive filler.

10. The assembly of claim 9, wherein said thermally conductive filler is selected from the group consisting essentially of ceramics, metal oxides, and carbon materials.

11. The assembly of claim 2, wherein said first thermal interface layer further comprises a thermally conductive filler selected from the group consisting of silicon nitride, boron nitride, alumina, magnesium oxide, and carbon graphite.

12. The assembly of claim 4, wherein said second thermal interface layer further comprises a thermally conductive filler selected from the group consisting of silicon nitride, boron nitride, alumina, magnesium oxide, and carbon graphite.

13. The assembly of claim 9, wherein the thermally conductive filler is selected from the group consisting of silicon nitride, boron nitride, alumina, magnesium oxide, and carbon graphite.

14. The assembly of claim 1, further comprising at least one heat transfer device in thermal communication with the metallic substrate.

15. The assembly of claim 1, further comprising at least one heat transfer device in thermal communication with the plastic body.

16. A method of manufacturing a three-dimensional cold plate for an electronic device having heat generating components, comprising the steps of:

Providing a metallic substrate with a top side and a bottom side;

pretreating and cleaning the metallic substrate;

etching the metallic substrate;

overmolding a three-dimensional molded contoured plastic body onto the bottom side of the metallic substrate to provide a bottom contoured side of the plastic body that substantially complementarily mates with a profile of heat generating components in an electronic device.

17. The method of claim 16 further comprising the step of:

overmolding a mechanically compliant and thermally conductive plastic material over the metallic substrate and plastic body without first sealing the metallic substrate and prior to substantial corrosion of the metallic substrate.

18. The method of claim 16, wherein the step of overmolding a mechanically complaint plastic material over the metallic substrate is carried out without first sealing the metallic substrate and prior to substantial corrosion of the metallic substrate.

19. The method of claim 16, further comprising the step of:

anodizing the metallic substrate.