PROCESSING DEVICE

• US 20070177357A1
• Filed: 03/12/2007
• Published: 08/02/2007
• Est. Priority Date: 05/20/1992
• Status: Active Grant

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Shiozaki, Tadashi, Wakabayashi, Kenichi, Takayama, Chitoshi
• Granted Patent: US 7,345,883 B2
• Time in Patent Office: Days
• US Class Current: 361/719
• CPC Class Codes: B41J 29/377 Cooling or ventilating arrangements
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07735 the record carrier comprising means for protecting against electrostatic discharge
• CPC Class Codes: G06K 19/07741 comprising a first part operating as a regular record carrier and a second attachable part that changes the functional appearance of said record carrier, e.g. a contact-based smart card with an adapter part which, when attached to the contact card makes the contact card function as a non-contact card
• CPC Class Codes: G06K 19/07743 External electrical contacts
• CPC Class Codes: H05K 5/0208 Interlock mechanisms; Means for avoiding unauthorised use or function, e.g. tamperproof
• CPC Class Codes: H05K 5/0256 of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
• CPC Class Codes: H05K 7/20445 the coupling element being an additional piece, e.g. thermal standoff

Abstract

A processing device is disclosed. It includes a heat dissipation plate structure with a thermally conductive material, and a processor with a major surface. The processor generates heat when energized, and the heat dissipation plate structure is adapted to dissipate heat from the processor. A heat dissipating material is in contact with the processor and the heat dissipation plate structure. Pins in an array of pins are substantially parallel to each other and are substantially perpendicular to the major surface of the processor. The pins may be received in a socket assembly that is on a circuit board.

Claims

1-3. -3. (canceled)

4. A processing device comprising:

a heat conductive element;

a processor coupled to said heat conductive element, wherein said processor generates heat when energized, and wherein said heat conductive element dissipates heat generated by said processor;

a circuit board comprising a mounting area, wherein said processor is mounted to the circuit board;

a heat dissipating material between the heat conductive element and the processor, wherein the heat dissipating material is coupled to the heat conductive element and the processor; and

a biasing element adapted to push the circuit board towards the heat conductive element.

5. The processing device of claim 4 wherein the heat conductive element is a plate.

6. The processing device of claim 4 wherein the heat dissipating material has a heat conductance rate of 1 W/m·

K or more.

7. The processing device of claim 4 wherein the heat dissipating material is formed from a non-solid material.

8. The processing device of claim 4 wherein the heat conductive element comprises aluminum.

9. The processing device of claim 4 wherein the heat dissipating material comprises silicon rubber.

10. The processing device of claim 4 wherein the processing device is in the form of a cartridge.

11. The processing device of claim 4 wherein the circuit board is a printed circuit board.

12. The processing device of claim 4 wherein the processor is a microprocessor.

13. The processing device of claim 4 further comprising a housing configured to protect the processor.

14. The processing device of claim 4 wherein the heat conductive element is in the form of a plate, and wherein the processing device further comprises a plurality of pins coupled to the processor.

15. A processing device comprising:

a heat dissipation plate structure comprising a thermally conductive material, wherein the heat dissipation plate structure has a major portion and a perpendicular portion substantially perpendicular to the major portion;

a processor comprising a major surface, wherein said processor generates heat when energized, wherein the heat dissipation plate structure is adapted to dissipate heat from the processor, and wherein the perpendicular portion of the heat dissipation plate structure faces a side of the processor;

a heat dissipating material contacting the processor and the major portion of the heat dissipation plate structure, without contacting the perpendicular portion of the heat dissipation plate structure, wherein the heat dissipating material is disposed between the heat dissipation plate structure and the processor; and

an array of pins, wherein the pins in the array of pins are substantially parallel to each other and are substantially perpendicular to and under the major surface of the processor,

wherein the pins are capable of being electrically coupled to a printed circuit board.

16. The processing device of claim 15 further comprising a biasing element operatively coupled to the processor.

17. The processing device of claim 15 wherein the processor is a microprocessor.

18. The processing device of claim 15 wherein a structure comprising four walls is disposed around the processor.

19. The processing device of claim 15 wherein the heat dissipating material is formed from a non-solid material having a viscous liquid, putty, or grease-like state.

20. The processing device of claim 15 wherein the heat dissipation plate structure comprises aluminum.

21. The processing device of claim 15 wherein the heat dissipation plate structure and the processor are directly connected through the heat dissipating material.

22. The processing device of claim 15 wherein the heat dissipating material comprises silicone rubber.

23. The processing device of claim 15 wherein the heat dissipating material has a thermal conductance rate of 1 W/m·

K or more.

24. The processing device of claim 15 wherein the processor is a RISC type microprocessor.

25. The processing device of claim 15 further comprising a conductive structure mechanically coupled to the processor, wherein the conductive structure forms an electromagnetic shield for the processor.

26. The processing device of claim 15 further comprising a conductive structure mechanically coupled to the processor, wherein the conductive structure forms an electromagnetic shield for the processor, and wherein the conductive structure surrounds four sides of the processor.

27. The processing device of claim 15 further comprising a conductive structure mechanically coupled to the processor, wherein the conductive structure forms an electromagnetic shield for the processor, and wherein the conductive structure is grounded to a printed circuit board.

28. The processing device of claim 15 wherein the processor has an operating clock speed of at least 25 MHz.

29. A processing device comprising:

a heat dissipation plate structure comprising a thermally conductive material;

a processor comprising a major surface, wherein said processor generates heat when energized, and wherein the heat dissipation plate structure is adapted to dissipate heat from the processor;

a heat dissipating material in contact with the processor and the heat dissipation plate structure;

an array of pins, wherein the pins in the array of pins are substantially parallel to each other and are substantially perpendicular to the major surface of the processor;

a socket assembly; and

a circuit board, wherein the socket assembly is on the circuit board,

wherein the pins in the array of pins are configured to be received in the socket assembly.

30. The processing device of claim 29 further comprising a biasing element operatively coupled to the processor.

31. The processing device of claim 29 wherein the processor is a microprocessor.

32. The processing device of claim 29 wherein a structure comprising four walls is disposed around the processor.

33. The processing device of claim 29 wherein the heat dissipating material is formed from a non-solid material having a viscous liquid, putty, or grease-like state.

34. The processing device of claim 29 wherein the heat dissipation plate structure comprises aluminum.

35. The processing device of claim 29 wherein the heat dissipation plate structure and the processor are directly connected through the heat dissipating material.

36. The processing device of claim 29 wherein the heat dissipating material comprises silicone rubber.

37. The processing device of claim 29 wherein the heat dissipating material has a thermal conductance rate of 1 W/m·

K or more.

38. The processing device of claim 29 wherein the processor is a RISC type microprocessor.

39. The processing device of claim 29 further comprising a conductive structure mechanically coupled to the processor, and wherein the conductive structure forms an electromagnetic shield for the processor.

40. The processing device of claim 29 further comprising a conductive structure mechanically coupled to the processor, wherein the conductive structure forms an electromagnetic shield for the processor, and wherein the conductive structure surrounds four sides of the processor.

41. The processing device of claim 29 further comprising a conductive structure mechanically coupled to the processor, wherein the conductive structure forms an electromagnetic shield for the processor, and wherein the conductive structure is grounded to a printed circuit board.