Semiconductor Production Apparatus

• US 20070178610A1
• Filed: 04/05/2007
• Published: 08/02/2007
• Est. Priority Date: 03/02/2004
• Status: Abandoned Application

• Current Assignee: Kazuhiro Joo, Motohiko Yoshigai, Shigeru Nakamoto, Tatehito Usui
• Original Assignee: Kazuhiro Joo, Motohiko Yoshigai, Shigeru Nakamoto, Tatehito Usui
• Inventors: Yoshigai, Motohiko, Usui, Tatehito, Nakamoto, Shigeru, Joo, Kazuhiro
• Application Number:
  US11/696,878
• Publication Number:
  US 20070178610A1
• Time in Patent Office: Days
• US Class Current: 438/5
• CPC Class Codes: H01J 37/32972 Spectral analysis
• CPC Class Codes: H01L 21/32137 of silicon-containing layers

Abstract

A semiconductor production apparatus and method for etching a semiconductor wafer arranged in a container and having a film on the surface thereof, by use of a plasma generated in the container. A temporal change of a quantity of an interference light is detected for at least two wavelengths obtained from the surface of the wafer for a predetermined time period of an etching process of the wafer, an etching quantity of the wafer is determined, which varies as long as the etching process proceeds, based upon a particular change arising in the interference light of plural pairs of wavelengths, the plural pairs of the wavelengths corresponding to the etching quantities, respectively.

Claims

1. A semiconductor production apparatus for etching a semiconductor wafer arranged in a container and having a film on the surface thereof, by use of a plasma generated in the container, comprising:

a detector which detects a temporal change of a quantity of an interference light for at least two wavelengths obtained from the surface of the wafer for a predetermined time period of an etching process of the wafer; and

a determining device which determines an etching quantity of the wafer, which varies as long as the etching process proceeds, based upon a particular change arising in the interference light of plural pairs of wavelengths, the plural pairs of the wavelengths corresponding to the etching quantities, respectively, and the particular change being detected by using detected results obtained from the detector.

2. A semiconductor production apparatus according to claim 1, further comprising a control unit which adjusts the etching process based upon the determination of the determining device which is made after that a first etching quantity of the wafer is determined based upon the particular change arising in the interference light of a first pair of wavelengths, and based upon the particular change arising in the interference light of a second pair of wavelengths different from the first pair of wavelengths.

3. A semiconductor production apparatus according to claim 2, wherein the determining device determines the predetermined etching quantity based on a time point at which data corresponding to the interference light of one of the wavelengths assumes a maximum value and a time point at which data corresponding to the interference light of the other of the wavelengths assumes a minimum value, both of which are within a predetermined time period.

4. A semiconductor production apparatus according to claim 2, wherein the determining device determines the predetermined etching quantity based on a time point at which a differential value obtained by differentiating time series data from the detector corresponding to the interference light of one of the wavelengths makes a zero-crossing from positive to negative and a time point at which a differential value corresponding to the interference light of the other of the wavelengths makes a zero-crossing from negative to positive, both of which are within a predetermined time period.

5. A semiconductor production method for etching a semiconductor wafer arranged in a container and having a film on the surface thereof, by use of a plasma generated in the container, comprising the steps of:

detecting a temporal change of a quantity of an interference light for at least two wavelengths obtained from the surface of the wafer for a predetermined time period of an etching process of the wafer; and

determining an etching quantity of the wafer, which varies as long as the etching process proceeds, based upon a particular change arising in the interference light of plural pairs of wavelengths, the plural pairs of the wavelengths corresponding to the etching quantities, respectively, and the particular change being detected by using detected results obtained in the step of detecting.

6. A semiconductor production method according to claim 5, further comprising the step of adjusting the etching process based upon the determination of the determining device which is made after that a first etching quantity of the wafer is determined based upon the particular change arising in the interference light of a first pair of wavelengths, and based upon the particular change arising in the interference light of a second pair of wavelengths different from the first pair of wavelengths.

7. A semiconductor production method according to claim 6, wherein the step of determining includes determining the predetermined etching quantity based on a time point at which data corresponding to the interference light of one of the wavelengths assumes a maximum value and a time point at which data corresponding to the interference light of the other of the wavelengths assumes a minimum value, both of which are within a predetermined time period.

8. A semiconductor production method according to claim 6, wherein the step of determining includes determining the predetermined etching quantity based on a time point at which a differential value obtained by differentiating time series data from the detector corresponding to the interference light of one of the wavelengths makes a zero-crossing from positive to negative and a time point at which a differential value corresponding to the interference light of the other of the wavelengths makes a zero-crossing from negative to positive, both of which are within a predetermined time period.