Method of manufacturing semiconductor device and display device
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Abstract
To provide a method of forming a wiring for the purpose of providing a semiconductor device, which is superior in reliability and cost performance. Further, to provide methods of manufacturing a semiconductor device and a display device by using the method of forming the wiring according to the present invention. According to the present invention, when a wiring material and the like is directly patterned on a substrate mainly having an insulating surface by droplet discharging method, a wiring is formed at a position including at least an opening in contact with an underlying portion on an insulating film provided with the opening by dropping a liquid droplet containing a conductive composition by droplet discharging method. By heating the substrate with the wiring formed thereon, a surface of the wiring on the opening and a surface of the wiring other than the wiring on the opening are approximately leveled, and the opening is filled.
31 Citations
65 Claims
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1-42. -42. (canceled)
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43. A method of manufacturing a semiconductor device comprising of:
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forming a semiconductor layer over a substrate;
forming an insulating film over the semiconductor layer;
forming an opening in the insulating film over the semiconductor layer;
dropping a liquid droplet, containing a conductive composition, by a droplet discharging method over the substrate, wherein a wiring is then formed at a location over the substrate including at least in the opening; and
performing a heat treatment, wherein the wiring extends to a bottom portion of the opening and the wiring is electrically connected to the semiconductor layer. - View Dependent Claims (44, 45, 46, 47, 48, 49, 50, 51, 52)
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53. A method of manufacturing a semiconductor device comprising of:
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forming a gate electrode over a substrate;
forming a gate insulating film over the substrate;
forming a semiconductor layer having an amorphous structure over the gate electrode;
forming a semiconductor layer doped with an n-type or p-type conductivity over the semiconductor layer having the amorphous structure;
forming source and drain electrodes over the semiconductor layer doped with the n-type or p-type conductivity;
forming an insulating film over the source and drain electrodes;
forming an opening in the insulating film over the source and drain electrodes;
dropping a liquid droplet, containing a conductive composition, by a droplet discharging method over the substrate, wherein a wiring is then formed at a location over the substrate including at least in the opening; and
performing a heat treatment, wherein the wiring extends to a bottom portion of the opening and the wiring is electrically connected to the semiconductor layer. - View Dependent Claims (54, 55, 56, 57, 58)
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59. A method of manufacturing a semiconductor device comprising of:
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forming a semiconductor layer over a substrate;
forming an insulating film over the semiconductor layer;
forming an opening in the insulating film over the semiconductor layer;
dropping a liquid droplet, containing a conductive composition, by a droplet discharging method over the substrate, wherein a wiring is then formed at a location over the substrate including at least in the opening;
performing a heat treatment, wherein the wiring extends to a bottom portion of the opening and the wiring is electrically connected to the semiconductor layer;
forming a pixel electrode by a droplet discharging method over the substrate; and
forming a light emitting layer over the pixel electrode. - View Dependent Claims (60, 61, 62, 63, 64, 65)
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Specification