Electronic subsystem assembly including radio frequency interface

• US 20070178864A1
• Filed: 02/01/2006
• Published: 08/02/2007
• Est. Priority Date: 02/01/2006
• Status: Abandoned Application

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Kiehl, Oliver, Kienzl, Katja
• Application Number:
  US11/345,422
• Publication Number:
  US 20070178864A1
• Time in Patent Office: Days
• US Class Current: 455/186.100
• CPC Class Codes: G06F 13/385 for adaptation of a particular data processing system to different peripheral devices

Abstract

An electronic subsystem assembly including a subsystem circuit, a contact interface, a memory circuit, and a radio frequency interface. The subsystem circuit is configured to provide a system function. The contact interface is configured to receive input signals and output signals. The memory circuit is configured to receive the input signals via the contact interface and to transmit the output signals via the contact interface. The radio frequency interface is configured to receive data signals from the memory circuit and to provide a radio frequency transmission that includes the data signals.

Claims

1. An electronic subsystem assembly, comprising:

a subsystem circuit configured to provide a system function;

a contact interface configured to receive input signals and output signals;

a memory circuit configured to receive the input signals via the contact interface and to transmit the output signals via the contact interface; and

a radio frequency interface configured to receive data signals from the memory circuit and to provide a radio frequency transmission that includes the data signals.

2. The electronic subsystem assembly of claim 1, wherein the radio frequency interface is powered via the contact interface to provide the radio frequency transmission.

3. The electronic subsystem assembly of claim 1, wherein the radio frequency interface receives a radio frequency signal and is powered via the radio frequency signal to transmit identification data via the radio frequency interface in response to the received radio frequency signal.

4. The electronic subsystem assembly of claim 1, wherein the memory circuit stores serial presence detect and label data and is configured to provide at least some of the serial presence detect and label data in the data signals to the radio frequency interface.

5. The electronic subsystem assembly of claim 1, wherein the memory circuit stores logistics data and is configured to provide at least some of the logistics data in the data signals to the radio frequency interface.

6. The electronic subsystem assembly of claim 1, wherein the contact interface is one of an inter-integrated circuit bus interface, a peripheral component interconnect bus, and an industry standard architecture bus and the memory circuit is one of a PROM, an EPROM, a EEPROM, and a battery backed RAM.

7. The electronic subsystem assembly of claim 1, comprising a printed subsystem assembly label for backward compatibility.

8. A dual in-line memory module, comprising:

dynamic random access memories;

a contact interface; and

a radio frequency identification chip configured to communicate via the contact interface and a radio frequency interface, wherein the radio frequency identification chip receives a radio frequency signal and transmits identification data via the radio frequency interface in response to the received radio frequency signal.

9. The dual in-line memory module of claim 8, wherein the radio frequency identification chip is configured to obtain slot identification data that identifies a system slot via the contact interface and to transmit the slot identification data and memory module data in the identification data to provide power to the system slot based on the slot identification data and the memory module data.

10. The dual in-line memory module of claim 9, wherein the radio frequency identification chip is powered via the radio frequency signal.

11. The dual in-line memory module of claim 9, wherein the radio frequency identification chip is powered via the contact interface and the system slot.

12. The dual in-line memory module of claim 8, comprising:

a memory circuit that stores serial presence detect data and is configured to provide at least some of the serial presence detect data to the radio frequency identification chip, wherein the radio frequency identification chip is configured to transmit received serial presence detect data in the identification data.

13. The dual in-line memory module of claim 8, comprising:

a memory circuit that stores logistics data and is configured to provide at least some of the logistics data to the radio frequency identification chip,

wherein the radio frequency identification chip is configured to transmit received logistics data in the identification data.

14. An electronic subsystem assembly, comprising:

means for providing a system function;

means for storing subsystem assembly data;

means for making electrical contact to a system to communicate the stored subsystem assembly data; and

means for transmitting a radio frequency signal that includes at least some of the stored subsystem assembly data.

15. The electronic subsystem assembly of claim 14, comprising:

means for making electrical contact to power the means for transmitting.

16. The electronic subsystem assembly of claim 14, comprising:

means for receiving a radio frequency signal to power the means for transmitting via the received radio frequency signal.

17. The electronic subsystem assembly of claim 14, wherein the means for storing subsystem assembly data comprises:

means for storing serial presence detect and label data; and

means for providing at least some of the serial presence detect and label data to the means for transmitting.

18. The electronic subsystem assembly of claim 14, wherein the means for storing subsystem assembly data comprises:

means for storing logistics data; and

means for providing at least some of the logistics data to the means for transmitting.

19. A method of providing subsystem assembly data in a system, comprising:

providing a system function via a subsystem assembly;

storing the subsystem assembly data in the subsystem assembly;

communicating at least some of the stored subsystem assembly data from the subsystem assembly to the system via a contact interface;

receiving at least some of the stored subsystem assembly data at a radio frequency interface; and

transmitting a radio frequency signal that includes at least some of the stored subsystem assembly data via the radio frequency interface.

20. The method of claim 19, comprising:

powering the radio frequency interface via the contact interface.

21. The method of claim 19, comprising:

receiving a radio frequency signal via the radio frequency interface; and

powering the radio frequency interface via the received radio frequency signal.

22. The method of claim 19, wherein storing the subsystem assembly data includes storing at least one of serial presence detect data, label data, and logistics data and transmitting a radio frequency signal includes at least one of providing at least some of the serial presence detect data in the radio frequency signal, providing at least some of the label data in the radio frequency signal, and providing at least some of the logistics data in the radio frequency signal.

23. A method of providing dual in-line memory module identification data, comprising:

providing dynamic random access memories in a dual in-line memory module;

communicating via a contact interface with a radio frequency identification chip in the dual in-line memory module;

receiving a radio frequency signal via the radio frequency identification chip; and

transmitting the dual in-line memory module identification data via the radio frequency identification chip in response to the received radio frequency signal.

24. The method of claim 23, comprising:

obtaining slot identification data that identifies a system slot via the contact interface; and

transmitting the slot identification data in the memory module identification data to provide power to the system slot based on the slot identification data.

25. The method of claim 23, comprising at least one of:

powering the radio frequency identification chip via the radio frequency signal; and

powering the radio frequency identification chip via the contact interface.

26. The method of claim 23, comprising:

storing at least one of serial presence detect data, label data, and logistics data in a memory circuit;

providing data signals that include at least one of serial presence detect data, label data, and logistics data to the radio frequency identification chip; and

transmitting the received data signals in the dual in-line memory module identification data.

27. A dual in-line memory module, comprising:

dynamic random access memories configured to provide a system memory function;

a contact interface configured to receive input signals and output signals;

a memory circuit configured to receive the input signals via the contact interface and to transmit the output signals via the contact interface; and

a radio frequency interface configured to receive data signals from the memory circuit and to provide a radio frequency transmission that includes the data signals, wherein the memory circuit is configured to store serial presence detect data, label data, and logistics data and to provide at least some of the serial presence detect data, label data and logistics data in the data signals to the radio frequency interface.

28. A dual in-line memory module, comprising:

dynamic random access memories configured to provide a system memory function;

a contact interface; and

a radio frequency identification chip configured to communicate via the contact interface and a radio frequency interface, wherein the radio frequency identification chip is configured to receive a radio frequency signal and obtain slot identification data that identifies a system slot via the contact interface and to transmit the slot identification data and memory module identification data via the radio frequency interface in response to the received radio frequency signal to provide power to the system slot based on the slot identification data and the memory module identification data.