Semiconductor device

• US 20070181875A1
• Filed: 02/05/2007
• Published: 08/09/2007
• Est. Priority Date: 02/08/2006
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Yamazaki, Shunpei, Dairiki, Koji
• Granted Patent: US 8,138,614 B2
• Time in Patent Office: Days
• US Class Current: 257/40
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01L 2224/16237 the bump connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/0101 Neon [Ne]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01018 Argon [Ar]
• CPC Class Codes: H01L 2924/01023 Vanadium [V]
• CPC Class Codes: H01L 2924/01024 Chromium [Cr]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/0103 Zinc [Zn]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/0104 Zirconium [Zr]
• CPC Class Codes: H01L 2924/01041 Niobium [Nb]
• CPC Class Codes: H01L 2924/01042 Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01044 Ruthenium [Ru]
• CPC Class Codes: H01L 2924/01045 Rhodium [Rh]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01056 : Barium [Ba]
• CPC Class Codes: H01L 2924/01058 : Cerium [Ce]
• CPC Class Codes: H01L 2924/0106 : Neodymium [Nd]
• CPC Class Codes: H01L 2924/01067 : Holmium [Ho]
• CPC Class Codes: H01L 2924/01068 : Erbium [Er]
• CPC Class Codes: H01L 2924/01072 : Hafnium [Hf]
• CPC Class Codes: H01L 2924/01073 : Tantalum [Ta]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01076 : Osmium [Os]
• CPC Class Codes: H01L 2924/01077 : Iridium [Ir]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/07811 : Extrinsic, i.e. with electrical conductive fillers
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/10329 : Gallium arsenide [GaAs]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15788 : Glasses, e.g. amorphous oxides, nitrides or fluorides
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19043 : being a resistor

Abstract

It is an object to provide a semiconductor device capable of transmitting and receiving data with a reader/writer and reducing breakdown or interference due to static electricity. A semiconductor device includes a semiconductor integrated circuit, a conductive layer serving as an antenna that is connected to the semiconductor integrated circuit, and a substrate interposing the semiconductor integrated circuit and the conductive layer, where at least one of a layer forming the semiconductor integrated circuit, a layer covering the semiconductor integrated circuit, and the substrate is formed from a conductive polymer. In accordance with the above structure, wireless communication with a reader/writer is possible, and breakdown or malfunction in the semiconductor integrated circuit due to static electricity is reduced.

Claims

1. A semiconductor device comprising:

a semiconductor integrated circuit;

an antenna comprising a conductive layer that is electrically connected to the semiconductor integrated circuit; and

at least one substrate provided to cover the semiconductor integrated circuit and the conductive layer,

wherein the at least one substrate contains a conductive polymer.

2. A semiconductor device according to claim 1, wherein the at least one substrate contains a cellulosic fiber and a conductive polymer fiber.

10. A semiconductor device according to any one of claims 1, 3, 4, 5, 6, 8 and 9, wherein a volume resistivity of the conductive polymer is greater than or equal to 10⁻

3 Ω

·

cm and less than or equal to 10¹² Ω

·

cm.

11. A semiconductor device according to any one of claims 1, 3, 4, 5, 6, 8 and 9, wherein, the semiconductor device is one selected from the group consisting of an IC card, an RFID tag, an IC tag, an ID tag, a transponder, an IC chip, and an ID chip.

12. A semiconductor device according to any one of claims 1, 3, 4, 5, 6, 8 and 9, wherein, the semiconductor device is incorporated in one selected from the group consisting of an identification certificate, a recording media, a container for package, a vehicle, and a baggage tag.

3. A semiconductor device comprising:

a semiconductor integrated circuit;

an antenna comprising a conductive layer that is electrically connected to the semiconductor integrated circuit;

at least one substrate provided to cover the semiconductor integrated circuit and the conductive layer; and

an adhesive for bonding the semiconductor integrated circuit and the at least one substrate,

wherein the adhesive contains a composition including a conductive polymer.

4. A semiconductor device comprising:

a semiconductor integrated circuit;

an antenna comprising a conductive layer that is electrically connected to the semiconductor integrated circuit; and

a layer covering the semiconductor integrated circuit,

wherein the layer covering the semiconductor integrated circuit contains a conductive polymer.

5. A semiconductor device comprising:

a semiconductor integrated circuit;

an antenna comprising a conductive layer that is electrically connected to the semiconductor integrated circuit; and

a layer covering the semiconductor integrated circuit and the antenna,

wherein the layer covering the semiconductor integrated circuit and the antenna contains a conductive polymer.

6. A semiconductor device comprising:

a semiconductor integrated circuit;

a connection terminal electrically connected to the semiconductor integrated circuit;

a layer covering a part of the connection terminal, which is formed over the semiconductor integrated circuit;

a substrate provided with an antenna that comprises a conductive layer; and

an anisotropic conductive adhesive including a conductive particle for electrically connecting the connection terminal and the antenna, and for bonding the substrate and the semiconductor integrated circuit,

wherein the layer covering a part of the connection terminal contains a conductive polymer.

7. A semiconductor device according to claim 6, wherein the connection terminal contains plural, the layer covering a part of the connection terminal is divided, and the divided layer covering a part of the connection terminal is not connected to the two or more of the connection terminals.

8. A semiconductor device comprising:

a semiconductor integrated circuit;

a connection terminal electrically connected to the semiconductor integrated circuit;

a substrate provided with an antenna that comprises a conductive layer;

a layer covering a part of the antenna; and

an anisotropic conductive adhesive including a conductive particle for electrically connecting the connection terminal and the antenna, and for bonding the substrate and the semiconductor integrated circuit,

wherein the layer covering a part of the antenna contains a conductive polymer.

9. A semiconductor device comprising:

a semiconductor integrated circuit;

a connection terminal electrically connected to the semiconductor integrated circuit;

a substrate provided with an antenna that comprises a conductive layer; and

an anisotropic conductive adhesive including a conductive particle for electrically connecting the connection terminal and the antenna, and for bonding the substrate and the semiconductor integrated circuit,

wherein the anisotropic conductive adhesive contains a composition including a conductive polymer.