POWER SURFACE MOUNT LIGHT EMITTING DIE PACKAGE
First Claim
Patent Images
1. A light emitting die package, comprising:
- a substrate having traces, a light emitting diode (LED) mounted on the substrate and connected to the traces, an encapsulant covering the LED, and a lens sitting on the encapsulant and substantially covering the LED, the lens free to move relative to the substrate.
3 Assignments
0 Petitions
Accused Products
Abstract
A light emitting die (LED) package is provided which includes a substrate having traces, a LED mounted on the substrate and connected to the traces, and an encapsulant covering the LED. The package includes a lens sitting on the encapsulant and substantially covering the LED. The lens is free to move relative to the substrate.
-
Citations
17 Claims
-
1. A light emitting die package, comprising:
-
a substrate having traces, a light emitting diode (LED) mounted on the substrate and connected to the traces, an encapsulant covering the LED, and a lens sitting on the encapsulant and substantially covering the LED, the lens free to move relative to the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
-
-
11. A light emitting die package, comprising:
-
a substrate including traces for connecting to an LED chip on the substrate, and an encapsulant covering the LED chip, and a lens covering the LED chip and sitting on the encapsulant, the lens free to move as the encapsulant expands and contracts. - View Dependent Claims (12, 13, 14, 15, 16, 17)
-
Specification