Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semicondutor chip on the interconnection board
First Claim
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1. A method of forming an interconnection board, wherein during formation of said interconnection board, said interconnection board remains securely fixed to a high rigidity plate being higher in rigidity than said interconnection board for suppressing said interconnection board from being bent.
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Abstract
In accordance with the present invention, during formation of the interconnection board, the interconnection board remains securely fixed to a high rigidity plate being higher in rigidity than the interconnection board for suppressing the interconnection board from being bent.
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20 Claims
- 1. A method of forming an interconnection board, wherein during formation of said interconnection board, said interconnection board remains securely fixed to a high rigidity plate being higher in rigidity than said interconnection board for suppressing said interconnection board from being bent.
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