Method for making contactless cards

• US 20070187518A1
• Filed: 04/17/2007
• Published: 08/16/2007
• Est. Priority Date: 03/09/1998
• Status: Active Grant

• Current Assignee: Gemalto SA (Thales SA)
• Original Assignee: Gemplus (Thales SA)
• Inventors: Patrice, Philippe
• Granted Patent: US 7,494,068 B2
• Time in Patent Office: Days
• US Class Current: 235/492
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/1134 Stud bumping, i.e. using a wire-bonding apparatus
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/16238 the bump connector connecting to a bonding area protruding from the surface of the item
• CPC Class Codes: H01L 2224/8114 Guiding structures outside the body
• CPC Class Codes: H01L 2924/00013 Fully indexed content
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01057 Lanthanum [La]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49018 with other electrical component
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49149 by metal fusion bonding

Abstract

A method for, producing contact-free chip card includes embedding metallized bumps of the chip into an antenna as the chip is mounted on the antenna.

Claims

1. A contactless transponder, comprising:

a substrate having a planar surface;

an antenna made from a conductive material disposed on said substrate, said antenna having a surface remote from said substrate that defines a plane parallel to said planar surface of said substrate; and

a chip structure comprising an integrated circuit chip and electrical contacts, said chip structure being mounted on said surface of said antenna such that a portion of said chip structure is embedded in the material of said antenna, and at least a portion of said integrated circuit chip protrudes above said surface of said antenna.

2. The transponder of claim 1, wherein said conductive material comprises a thermoplastic material having metallic particles dispersed therein.

3. A contactless transponder, comprising:

an insulating substrate having a planar surface;

an antenna made from a conductive material disposed on said substrate, said antenna having a surface remote from said substrate that defines a plane parallel to said planar surface of said substrate; and

an integrated circuit chip having a surface with contacts thereon,

wherein said chip is mounted on said surface of said antenna such that at least a portion of said chip protrudes above the plane defined by said surface of said antenna and said contacts are embedded in the material of said antenna.

4. The transponder of claim 3, wherein said contacts include bumps that protrude from said surface of the chip and are embedded in the material forming said antenna.

5. The transponder of claim 4, wherein said bumps have a substantially conical shape.

6. The transponder of claim 3, wherein said conductive material comprises a thermoplastic material having metallic particles dispensed therein.

7. The transponder of claim 3, wherein said conductive material comprises a conductive polymer.

8. The transponder of claim 7, wherein said conductive polymer comprises a thermosetting polymer having metallic particles dispersed therein.

9. The transponder of claim 7, wherein said conductive polymer comprises a thermoplastic material having metallic particles dispersed therein.

10. A contactless transponder, comprising:

an insulating substrate having a planar surface;

an antenna made from a conductive polymer disposed on said substrate, said antenna having a surface remote from said substrate that defines a plane parallel to said planar surface of said substrate; and

a chip structure comprising an integrated circuit chip and electrical contacts, said chip structure being mounted on said surface of said antenna such that a portion of said chip structure is embedded in the material of said antenna, and at least a portion of said integrated circuit chip protrudes above said surface of said antenna.

11. The transponder of claim 10, wherein said conductive polymer comprises a thermosetting polymer having metallic particles dispersed therein.

12. The transponder of claim 10, wherein said conductive polymer comprises a thermoplastic material having metallic particles dispersed therein.