Semiconductor device
First Claim
1. A semiconductor device comprising:
- a first substrate;
a pixel portion formed over the first substrate; and
a sound signal circuit comprising a rectifier circuit formed over the first substrate.
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Abstract
A rectifier circuit configured with a conventional configuration using an operational amplifier and a diode by a thin film transistor over an insulating substrate cannot exhibit the performance of a rectifier circuit due to the low stability of operational amplifier and the low high-frequency characteristic. Therefore, the rectifier circuit requires to be configured by using an IC outside of the insulating substrate in order to rectify a high-frequency signal. According to the invention, an amplifier circuit and a waveform shaping circuit are configured with a thin film transistor and a non-rectified signal is switched by a signal thereof, so that a rectifier circuit with the excellent high-frequency characteristic can be realized.
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Citations
20 Claims
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1. A semiconductor device comprising:
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a first substrate;
a pixel portion formed over the first substrate; and
a sound signal circuit comprising a rectifier circuit formed over the first substrate. - View Dependent Claims (4, 7, 10, 13, 16)
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2. A semiconductor device comprising:
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a first substrate;
a pixel portion formed over the first substrate; and
a sound signal circuit comprising;
a rectifier circuit formed over the first substrate; and
an amplifier circuit formed over the first substrate. - View Dependent Claims (5, 8, 11, 14, 17, 19, 20)
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3. A semiconductor device comprising:
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a first substrate; and
a pixel portion formed over the first substrate;
a sound signal circuit comprising;
a rectifier circuit formed over the first substrate;
a main amplifier circuit formed over the first substrate; and
a preamplifier circuit formed over the first substrate. - View Dependent Claims (6, 9, 12, 15, 18)
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Specification