CPU cooler

• US 20070188994A1
• Filed: 02/14/2006
• Published: 08/16/2007
• Est. Priority Date: 02/14/2006
• Status: Active Grant

• Current Assignee: Hua-Hsin Tsai
• Original Assignee: Hua-Hsin Tsai
• Inventors: Tsai, Ming-Kun
• Granted Patent: US 7,352,580 B2
• Time in Patent Office: Days
• US Class Current: 361/701
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28F 13/08 by varying the cross-section of the flow channels
• CPC Class Codes: F28F 3/12 Elements constructed in the shape of a hollow panel, e.g. with channels F28D1/02, F28D1/03 take precedence
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A CPU cooler includes a heat-conducting unit and a heat-dissipating unit. The heat-conducting unit consists of a heat-conducting block, a heat-conducting piping, an inflow pipe and an outflow pipe. The heat-conducting block is closely positioned on the CPU and the heat-conducting piping is disposed in the heat-conducting block for making liquid to flow therethrough. The heat-conducting piping has its inflow port connected with the inflow pipe and its outflow port connected with the outflow pipe, and the inflow port of the heat-conducting piping is positioned lower than the outflow port. The heat-dissipating unit has one end communicating with the outflow pipe and the other end communicating with the inflow pipe for dissipating the heat and lowering the temperature of the liquid, able to incessantly repeat the cycle of heat dissipation and temperature reduction.

Claims

1. A CPU cooler comprising a heat-conducting unit and a heat-dissipating unit, said heat-conducting unit composed of a heat-conducting block, a heat-conducting piping, an inflow pipe and an outflow pipe, said heat-conducting piping disposed in the interior of said heat-conducting block for making liquid to flow therethrough, said heat-conducting piping having its inflow port connected with said inflow pipe and its outflow port connected with said outflow pipe, said inflow port positioned lower than said outflow port, said heat-dissipating unit having one end communicating with said outflow pipe and the other end communicating with said inflow pipe, said heat-dissipating unit dissipating the heat and lowering the temperature of said liquid, said liquid flowing through said heat-conducting block to be heated and vaporized, the vapor obliquely flowing through said heat-conducting piping, said vapor then condensed into liquid by said heat-dissipating unit and flowing back to said heat-conducting unit, able to incessantly repeat the cycle of heat dissipation and temperature reduction.

2. The CPU cooler as claimed in claim 1, wherein said heat-conducting piping is composed of a plurality of vertical pipes and horizontal pipes crossing and communicating with each other for said liquid flow therethrough.

3. The CPU cooler as claimed in claim 2, wherein said vertical and said horizontal pipes are formed by having the openings of the vertical and the horizontal passageways of said heat-conducting block respectively sealed up by a choking member.

4. The CPU cooler as claims in claim 1, wherein the diameter of said inflow pipe is smaller than that of said outflow pipe.

5. The CPU cooler as claimed in claim 1, wherein said heat-dissipating unit is composed of a cooling piping and a plurality of cooling fins, said cooling fins spaced apart equidistantly and combined on the circumferential edge of said cooling piping.

6. The CPU cooler as claimed in claim 5, wherein said cooling piping of said heat-dissipating unit is an accommodating chamber having one end connected with said outflow pipe and the other end connected with said inflow pipe, and the sectional area of said cooling pipe is larger than that of said outflow pipe and said inflow pipe.

7. The CPU cooler as claimed in claim 5, wherein said cooling pipe of said heat-dissipating unit has a conical passageway with one end connected to said outflow pipe and the other end connected to said inflow pipe.

8. The CPU cooler as claimed in claim 5, wherein said heat-dissipating piping of said heat-dissipating unit is composed of a plurality of vertical pipes and horizontal pipes crossing and communicating with each other, and the diameter of said cooling piping is gradually contracted from said outflow pipe to said inflow pipe.