Interconnect structure for MEMS device
First Claim
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1. An electronic device, comprising:
- a substrate;
an array of interferometric light modulators formed on said substrate; and
a plurality of interconnects formed adjacent a plurality of said interferometric modulators, wherein each interconnect is configured to connect a single light modulator to a circuit.
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Abstract
An iterferometric modulator array is formed with connectors and/or an encapsulation layer with electrical connections. The encapsulation layer hermetically seals the array. Circuitry may also be formed over the array.
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Citations
46 Claims
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1. An electronic device, comprising:
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a substrate;
an array of interferometric light modulators formed on said substrate; and
a plurality of interconnects formed adjacent a plurality of said interferometric modulators, wherein each interconnect is configured to connect a single light modulator to a circuit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A method of manufacturing an electronic device, the method comprising:
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providing a substrate comprising an array of interferometric light modulators formed on said substrate; and
forming a plurality of interconnects adjacent a plurality of said interferometric modulators, wherein each interconnect is configured to connect a single light modulator to a circuit. - View Dependent Claims (21, 22, 23, 24, 25)
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26. An electronic device, comprising:
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a substrate;
an interferometric modulator disposed on said substrate, wherein said interferometric modulator comprises a cavity defined by an upper layer and a lower layer; and
an encapsulation layer formed adjacent to the interferometric modulator, said encapsulation layer comprising a sealed orifice, wherein said encapsulation layer hermetically seals said cavity from the ambient environment. - View Dependent Claims (27, 28, 29, 30, 31, 32)
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33. A method of manufacturing a light modulator device, the method comprising:
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forming an interferometric modulator, wherein said modulator comprises first and second layers defining a cavity and configured to interferometrically modulate light;
forming an encapsulation layer adjacent to the cavity, the layer comprising one or more orifices;
inducing a vacuum or inert atmosphere in the cavity; and
sealing the one or more orifices. - View Dependent Claims (34, 35, 36, 37, 38, 39, 40, 41)
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42. An electronic device, comprising:
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means for transmitting light;
an array of means for modulating light formed on said transmitting means; and
a plurality of means for interconnecting formed adjacent a plurality of said light modulating means, wherein each of said interconnecting means is configured to connect a single light modulating means to a circuit. - View Dependent Claims (43, 44, 45, 46)
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Specification