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LIGHT EMITTING DIODES (LEDS) WITH IMPROVED LIGHT EXTRACTION BY ROUGHENING

  • US 20070190676A1
  • Filed: 03/23/2007
  • Published: 08/16/2007
  • Est. Priority Date: 01/11/2005
  • Status: Active Grant
First Claim
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1. A method comprising:

  • providing a light-emitting diode (LED) wafer assembly having a plurality of LED stacks disposed above a conductive substrate, each of the LED stacks comprising;

    a p-doped layer disposed above the conductive substrate;

    an active layer for emitting light disposed above the p-doped layer; and

    an n-doped layer disposed above the active layer;

    applying a protective layer covering a selected portion of a surface of the n-doped layer for each of the plurality of LED stacks;

    altering the surface of the n-doped layer by at least one of roughening and texturing, wherein the protective layer shields the selected portion of each of the plurality of LED stacks during the altering; and

    removing the protective layer.

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