Method of depositing Ru films having high density

• US 20070190782A1
• Filed: 02/14/2007
• Published: 08/16/2007
• Est. Priority Date: 02/15/2006
• Status: Active Grant

• Current Assignee: ASM Korea Ltd. (ASM International NV)
• Original Assignee: Asm Genitech Korea Ltd. (ASM International NV)
• Inventors: Park, Hyung-Sang
• Granted Patent: US 7,541,284 B2
• Time in Patent Office: Days
• US Class Current: 438/686
• CPC Class Codes: C23C 16/18 from metallo-organic compounds
• CPC Class Codes: C23C 16/45527 characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations
• CPC Class Codes: C23C 16/45536 Use of plasma, radiation or electromagnetic fields
• CPC Class Codes: H01L 21/28562 Selective deposition
• CPC Class Codes: H01L 21/76846 Layer combinations

Abstract

A ruthenium film deposition method is disclosed. In one embodiment of the method, a first ruthenium film is deposited by using a PEALD process until a substrate is substantially entirely covered with the first ruthenium film. Then, a second ruthenium film is deposited on the first ruthenium film by using a thermal ALD process having a higher deposition speed than that of the PEALD process. In the method, a ruthenium metal film having a high density is formed in a short time by combining a PEALD process of depositing a ruthenium film at a low deposition speed and a deposition process of depositing a ruthenium film at a higher deposition speed. Accordingly, it is possible to form a ruthenium film having high density, a smooth surface, good adhesiveness, and a short incubation period. Therefore, according to the embodiment, in comparison to cases of using only a PEALD process or an ALD process that has a long incubation period, it is possible to obtain a ruthenium film having a large thickness and a high density in the same time interval. As a result, the ruthenium film formed by the ruthenium film deposition method according to the embodiment is more suitable for electrode structures of semiconductor devices than the ruthenium films formed by using conventional methods.

Claims

1. A method of depositing a ruthenium film, the method comprising:

loading a substrate into a reactor;

depositing a first ruthenium layer over the substrate by a plasma enhanced atomic layer deposition (PEALD) process; and

depositing a second ruthenium layer over the first ruthenium layer by an atomic layer deposition (ALD) process without using plasma.

2. The method of claim 1, wherein depositing the first ruthenium layer comprises depositing the first ruthenium layer at a first deposition rate, and wherein depositing the second ruthenium layer comprises depositing the second ruthenium layer at a second deposition rate greater than the first deposition rate.

3. The method of claim 1, wherein depositing the first ruthenium layer comprises a plurality of cycles comprising:

supplying a first ruthenium source gas to the reactor;

purging the first ruthenium source gas from the reactor;

supplying a first reaction gas to the reactor; and

purging the first reaction gas from the reactor, and

wherein depositing the first ruthenium layer is repeated until a surface of the substrate is substantially entirely covered with ruthenium.

4. The method of claim 3, wherein supplying the first reaction gas comprises activating the first reaction gas with plasma.

5. The method of claim 3, wherein the first ruthenium source gas comprises a ruthenium compound represented by the formula of Ru[C₅H₃R¹R²] [C₅H₃R³R⁴], wherein each of R¹, R², R³, and R⁴ is H or an alkyl group C_nH_2n+1, and wherein n is an integer of 1 to 4.

6. The method of claim 3, wherein the first reaction gas comprises at least one of N₂/H₂ and ammonia gas (NH₃).

7. The method of claim 3, wherein depositing the first ruthenium layer further comprises, after purging the first reaction gas:

supplying a second reaction gas to the reactor; and

purging the second reaction gas from the reactor.

8. The method of claim 7, wherein supplying the first reaction gas does not comprise activating the first reaction gas with plasma, and wherein supplying the second reaction gas comprises activating the second reaction gas with plasma.

9. The method of claim 7, wherein the first reaction gas comprises oxygen gas.

10. The method of claim 7, wherein the second reaction gas comprises hydrogen gas.

11. The method of claim 3, wherein depositing the second ruthenium layer comprises:

supplying a second ruthenium source gas to the reactor; and

supplying a third reaction gas to the reactor.

12. The method of claim 11, wherein depositing the second ruthenium layer further comprises:

purging the second ruthenium source gas from the reactor after supplying the second ruthenium source gas; and

purging the third reaction gas from the reactor after supplying the third reaction gas.

13. The method of claim 12, wherein purging the second ruthenium source gas comprises supplying an inert gas to the reactor, and wherein purging the third reaction gas comprises supplying an inert gas to the reactor.

14. The method of claim 11, wherein the second ruthenium source gas comprises a ruthenium compound represented by the formula of Ru[C₅H₃R¹R²] [C₅H₃R³R⁴], wherein each of R¹, R², R³, and R⁴ is H or an alkyl group C_nH_2n+1, and wherein n is an integer of 1 to 4.

15. The method of claim 11, wherein the third reaction gas comprises oxygen gas.

16. The method of claim 15, wherein the first reaction gas comprises at least one of N₂/H₂ and NH₃.

17. The method of claim 15, wherein depositing the first ruthenium layer further comprises supplying a second reaction gas to the reactor after purging the first reaction gas, wherein the first reaction gas comprises oxygen gas, and wherein the second reaction gas comprises hydrogen gas.

18. The method of claim 1, wherein depositing the first ruthenium layer comprises depositing the first ruthenium layer to a thickness of about 5 nm or less.

19. The method of claim 1, wherein depositing the second ruthenium layer comprises depositing the second ruthenium layer to a thickness of about 5 nm to about 50 nm.

20. The method of claim 1, wherein depositing the second ruthenium layer comprises depositing the second ruthenium layer for a period of about 2 seconds or less.

21. The method of claim 1, wherein depositing the first ruthenium layer comprises depositing the first ruthenium layer at a temperature of about 400°

C. or less, and wherein depositing the second ruthenium layer comprises depositing the second ruthenium layer at a temperature of about 400°

C. or less.

22. The method of claim 21, wherein depositing the first ruthenium layer comprises depositing the first ruthenium layer at a temperature of about 250°

C. to about 350°

C., and wherein depositing the second ruthenium layer comprises depositing the second ruthenium layer at a temperature of about 250°

C. to about 350°

C.

23. The method of claim 1, further comprising continuously supplying an inert gas to the reactor.

24. An electronic device comprising:

a substrate; and

a ruthenium film formed over the substrate, the film being made by the method of claim 1.

25. The electronic device of claim 24, wherein the ruthenium film has a density of about 10 g/cm³ to about 13 g/cm³.

26. A semiconductor device, comprising:

a substrate; and

a ruthenium film formed over the substrate, the film comprising;

a first ruthenium layer formed over the substrate; and

a second ruthenium layer formed on the first ruthenium layer,

wherein each of the first and second ruthenium layers has a density of about 10 g/cm³ to about 13 g/cm³.

27. A ruthenium bilayer structure comprising:

a first ruthenium layer formed over a substrate; and

a second ruthenium layer formed directly on the first ruthenium layer,

wherein each of the first and second ruthenium layers has a density of about 10 g/cm³ to about 13 g/cm³.

28. A method of depositing a ruthenium film, the method comprising:

providing a substrate into a reactor;

depositing a first ruthenium layer over the substrate at a first deposition rate by a plasma enhanced atomic layer deposition (PEALD) process; and

depositing a second ruthenium layer over the first ruthenium layer at a second deposition rate by an atomic layer deposition (ALD) process, the second deposition rate being greater than the first deposition rate.

29. The method of claim 28, wherein depositing the first ruthenium layer comprises depositing the first ruthenium layer substantially without supplying oxygen gas to the reactor;

and wherein depositing the second ruthenium layer comprises supplying oxygen gas to the reactor.

30. The method of claim 28, wherein the ALD process comprises a thermal ALD process.

31. A method of depositing a ruthenium film, the method comprising:

providing a substrate into a reactor;

depositing a first ruthenium layer over the substrate by a plasma enhanced atomic layer deposition (PEALD) process; and

depositing a second ruthenium layer over the first ruthenium layer by a non-plasma process, wherein the second ruthenium layer has substantially the same density as that of the first ruthenium layer.

32. The method of claim 31, wherein each of the first and second ruthenium layers has a density of about 10 g/cm³ to about 13 g/cm³.

33. The method of claim 31, wherein the non-plasma process comprises a thermal ALD process.

34. The method of claim 31, wherein the non-plasma process comprises a CVD process.