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Methods, apparatus, and systems for causing fluid to flow through or into via holes, vents, and other openings or recesses that communicate with surfaces of substrates of semiconductor device components

  • US 20070190785A1
  • Filed: 02/10/2006
  • Published: 08/16/2007
  • Est. Priority Date: 02/10/2006
  • Status: Active Grant
First Claim
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1. A method for removing material from surfaces of at least a portion of at least one aperture that extends substantially through a substrate, comprising:

  • positioning the substrate substantially along a boundary within a pressurizable chamber; and

    generating a pressure differential across the boundary, the pressure differential causing fluid on a first side of the chamber at a first side of the boundary to flow into the at least one aperture of the substrate toward the a second side of the chamber at a second side of the boundary.

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