Method for managing tools using statistical process control

• US 20070191980A1
• Filed: 12/12/2006
• Published: 08/16/2007
• Est. Priority Date: 02/16/2006
• Status: Abandoned Application

• Current Assignee: Powerchip Semiconductor Corporation (Powerchip Technology Corporation)
• Original Assignee: Powerchip Semiconductor Corporation (Powerchip Technology Corporation)
• Inventors: Chen, Chien-Chung, Ho, Yu-Wen, Hsu, Tung-Pin
• Application Number:
  US11/637,105
• Publication Number:
  US 20070191980A1
• Time in Patent Office: Days
• US Class Current: 700/110
• CPC Class Codes: G05B 19/41875 characterised by quality surveillance of production
• CPC Class Codes: G05B 2219/31304 Identification of workpiece and data for control, inspection, safety, calibration
• CPC Class Codes: G05B 2219/32191 Real time statistical process monitoring
• CPC Class Codes: G05B 2219/45031 Manufacturing semiconductor wafers
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

A method for managing tools using statistical process control. Process progression for a wafer in a chamber of a process tool is recorded. When a wafer process is complete and the wafer leaves the chamber, the wafer is transferred to a measurement tool. A wafer ID of the wafer is obtained using the measurement tool. A chamber ID is obtained according to the wafer ID and a chart point corresponding to the wafer ID and the chamber ID is generated according to measurement results. A plurality of generated chart points are grouped according to a plurality of obtained wafer IDs and a plurality of chamber IDs corresponding to the wafer IDs to split a control chart corresponding to the process tool into a plurality of separate control charts. Statistical process control analysis is implemented according to the generated control charts and alarms are issued according to the analysis results to adjust an abnormal chamber.

Claims

1. A method for managing tools using statistical process control, comprising:

recording process progression for a wafer in a chamber of a process tool;

when a wafer process is complete and the wafer leaves the chamber, transferring the wafer to a measurement tool;

obtaining a wafer ID of the wafer using the measurement tool;

obtaining a chamber ID according to the wafer ID and generating a chart point corresponding to the wafer ID and the chamber ID according to measurement results;

grouping a plurality of generated chart points according to a plurality of obtained wafer IDs and a plurality of chamber IDs corresponding to the wafer IDs to split a control chart corresponding to the process tool into a plurality of separate control charts; and

implementing statistical process control analysis according to the generated control charts and issuing alarms according to the analysis results to adjust an abnormal chamber.

2. The method for managing tools using statistical process control as claimed in claim 1, further comprising recording process progressions for each wafer in a chamber of the process tool.

3. The method for managing tools using statistical process control as claimed in claim 2, further comprising:

recording a chamber ID when a wafer enters one of the chambers of the process tool; and

recording process progression when the wafer enters and leaves the chamber of the process tool.

4. The method for managing tools using statistical process control as claimed in claim 3, further comprising grouping chart points corresponding to identical chamber IDs in a lot level or wafer level SPC control chart to split the SPC control chart into the separate control charts.

5. The method for managing tools using statistical process control as claimed in claim 4, further comprising reflecting performance variations of different chambers of the process tool according to the split control charts.

6. A computer-readable storage medium storing a computer program providing a method for managing tools using statistical process control, comprising using a computer to perform the steps of:

recording process progression for a wafer in a chamber of a process tool;

when a wafer process is complete and the wafer leaves the chamber, transferring the wafer to a measurement tool;

obtaining a wafer ID of the wafer using the measurement tool;

obtaining a chamber ID according to the wafer ID and generating a chart point corresponding to the wafer ID and the chamber ID according to measurement results;

grouping a plurality of generated chart points according to a plurality of obtained wafer IDs and a plurality of chamber IDs corresponding to the wafer IDs to split a control chart corresponding to the process tool into a plurality of separate control charts; and

implementing statistical process control analysis according to the generated control charts and issuing alarms according to the analysis results to adjust an abnormal chamber.

7. The computer-readable storage medium as claimed in claim 6, further comprising recording process progressions for each wafer in a chamber of the process tool.

8. The computer-readable storage medium as claimed in claim 7, further comprising:

recording a chamber ID when a wafer enters one of the chambers of the process tool; and

recording process progression when the wafer enters and leaves the chamber of the process tool.

9. The computer-readable storage medium as claimed in claim 8, further comprising grouping chart points corresponding to identical chamber IDs in a lot level or wafer level SPC control chart to split the SPC control chart into the separate control charts.

10. The computer-readable storage medium as claimed in claim 9, further comprising reflecting performance variations of different chambers of the process tool according to the split control charts.