SEALANT MATERIAL

• US 20070193171A1
• Filed: 03/15/2007
• Published: 08/23/2007
• Est. Priority Date: 07/21/2004
• Status: Active Grant

• Current Assignee: Zephyros, Inc.
• Original Assignee: Zephyros, Inc.
• Inventors: Kassa, Abraham, Finerman, Terry
• Granted Patent: US 7,838,589 B2
• Time in Patent Office: Days
• US Class Current: 52/459
• CPC Class Codes: B05D 3/108 Curing
• CPC Class Codes: C08G 59/18 Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
• CPC Class Codes: C09D 5/34 Filling pastes materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12
• CPC Class Codes: C09K 2200/0647 Polyepoxides
• CPC Class Codes: C09K 3/10 Materials in mouldable or extrudable form for sealing or packing joints or covers filling pastes C09D5/34

Abstract

There is disclosed a sealant material for providing sealing to a substrate and preferably an interface. The sealant material may also include a material, shape, ingredient or otherwise for inhibiting the flow of bubbles throught the material.

Claims

1. A method of sealing an interface, the method comprising:

providing a sealant material;

locating the sealant material adjacent to the interface;

exposing the sealant material to an elevated temperature such that the sealant material flows adjacent the interface; and

curing the sealant material to seal the interface.

2. A method as in claim 1 wherein the sealant material includes:

i. an epoxy resin;

ii. an epoxy/elastomer adduct;

iii. a rheology modifier selected from an olefinic, a styrenic, an acrylic, an unsaturated carboxylic acid or an ester of a carboxylic ester;

iv. a curing agent; and

v. a filler.

3. A method as in claim 1 wherein the interface is created by two panels of an automotive vehicle.

4. A method as in claim 3 further comprising:

prior to exposing the sealant material to an elevated temperature, coating a surface of the sealant material with a curing agent or curing agent accelerator for hardening the surface of the sealant material.

5. A method as in claim 3 further comprising:

prior to exposing the sealant material to an elevated temperature, coating or spraying a liquid material upon a surface of the sealant material such that the liquid material cures, hardens and coats the surface of the material.

6. A method as in claim 3 wherein the step of providing the sealant material includes coextruding a layer of first material with a mass of the sealant material and wherein the layer of first material is configured to maintain a higher viscosity during the exposing step or the layer of first material is configured to cure faster than the sealant material during the curing step.

7. A method as in claim 3 wherein the exposing step and the curing step are at least partially simultaneous and the sealant material is thermoset upon curing.

8. A method as in claim 3 wherein the sealant material includes an ingredient such that the sealant material, during the exposing step, maintains a surface energy that is no more than 25% greater or less than the surface energy of the panels at the interface.

9. A method as in claim 3 wherein the sealant material is configured to, during the exposing step, maintain a viscosity of below about 5000 centipoise for between about 15 seconds and about 5 minutes.

10. A method as in claim 9 wherein the sealant material includes an encapsulated curing agent or curing agent accelerator.

11. A method as in claim 3 wherein the sealant material is located upon a surface of one of the panels, but spaced away from the interface, and, during the exposing step flows to cover the interface.

12. A method as in claim 3 wherein the sealant material is attached to a trim piece during locating of the sealant material adjacent the interface.

13. A method as in claim 3 wherein the sealant material includes magnetic particles for assisting in locating the sealant material adjacent the interface.

14. A method of sealing an interface, the method comprising:

providing a sealant material;

locating the sealant material adjacent to the interface, the sealant material including pieces of blocking material;

exposing the sealant material to an elevated temperature such that the sealant material flows adjacent the interface wherein the pieces of blocking material prevent bubbles from penetrating through the sealant material to an outwardly facing surface of the sealant material; and

curing the sealant material to seal the interface.

15. A method as in claim 14 wherein the pieces are selected from flakes or platelets.

16. A method as in claim 14 wherein the pieces are formed at least partially of PTE, polyamide, glass or ceramic.

17. A method of sealing an interface of a substrate, the method comprising:

providing a sealant material including a contact surface;

locating the sealant material adjacent to the interface such that the contact surface contacts a first portion of the surface of the substrate;

exposing the sealant material to an elevated temperature such that the sealant material flows adjacent the interface and contacts a second portion of the surface of the substrate progressively outward from the first portion; and

curing the sealant material to seal the interface.

18. A method as in claim 17 wherein the sealant material has a U-shaped cross-section.

19. A method as in claim 17 wherein the sealant material, upon placement adjacent the interface, has a cantilevered portion.

20. A method as in claim 17 wherein the sealant material has braided configuration.