Z offset MEMS device

• US 20070193380A1
• Filed: 02/23/2006
• Published: 08/23/2007
• Est. Priority Date: 02/23/2006
• Status: Active Grant

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Williams, Mark, Foster, Michael, Magendanz, Galen, LaFond, Peter, Klein, Jonathan
• Granted Patent: US 7,516,661 B2
• Time in Patent Office: Days
• US Class Current: 73/866.1
• CPC Class Codes: B81B 2201/033 Comb drives
• CPC Class Codes: B81B 7/0077 Other packages not provided for in groups B81B7/0035 - B81B7/0074
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 15/18 in two or more dimensions
• CPC Class Codes: Y10T 74/22 Miscellaneous

Abstract

A microelectromechanical system (MEMS) device with a mechanism layer having a first part and a second part, and at least one cover for sealing the mechanism layer. The inner surface of at least one of the covers is structured such that a protruding structure is present on the inner surface of the cover and wherein the protruding structure mechanically causes the first part to be deflected out of a plane associated with the second part.

Claims

1. A microelectromechanical (MEMS) device comprising:

a mechanism layer comprising;

a first part; and

a second part; and

at least one cover for sealing at least a portion of the mechanism layer, the at least one cover comprising;

an inner surface;

an outer surface; and

a structure protruding from the inner surface of the at least one cover, wherein the structure mechanically causes the first part to be deflected out of a plane associated with the second part when the at least one cover is attached to the mechanism layer.

2. The device of claim 1, wherein the first part and the second part include a comb structure.

3. The device of claim 1, wherein one of the at least one covers and the structure protruding therefrom are formed of a monolithic material.

4. The device of claim 1, wherein one of the at least one covers and the structure protruding therefrom are formed of different materials.

5. The device of claim 1, wherein the structure has been attached to the cover.

6. A microelectromechanical (MEMS) device comprising:

a mechanism layer comprising;

a first part;

a second part; and

a third part; and

a top cover having a first surface;

a bottom cover having a first surface;

a first structure protruding from the first surface of the top cover, the first structure causes the first part to mechanically deflect out of a plane associated with the second part when the top cover is attached to the mechanism layer; and

a second structure protruding from the first surface of the bottom cover, the second structure causes the third part to mechanically deflect out of the plane associated with the second part when the bottom cover is attached to the mechanism layer.

7. The device of claim 6, wherein one of the covers and the associated structure protruding therefrom are formed of a monolithic material.

8. The device of claim 6, wherein one of the covers and the associated structure protruding therefrom are formed of different materials.

9. The device of claim 6, wherein the structures have been attached to the covers.

10. The device of claim 6, wherein the mechanism layer further comprises at least one additional part and the device further comprises at least one additional structure protruding from the inner surface of at feast one of the top cover or the bottom cover, the at least one additional structure causes a corresponding one of the at least one additional parts to mechanically deflect out of the plane associated with the second part when the cover from which it is protruding is attached to the mechanism layer.

11. The device of claim 6, wherein the first part, the second part, and the third part form a comb structure.

12. The device of claim 11, wherein the first part, the second part, and the third part sense acceleration in a direction orthogonal to the plane associated with the second part.

13. A method of sensing an external influence with a microelectromechanical (MEMS) device, the MEMS device includes a mechanism layer having first and second parts and one or more covers for encasing the first and second parts, the method comprising:

deflecting the first part out of a plane associated with the second part by mechanical contact with a structure attached to the one or more covers when the one or more covers are attached to the mechanism layer; and

measuring a change in a value associated with a movement orthogonal to the plane associated with the second part of the second part in relation to the first part.

14. The method of claim 13, wherein one of the one or more covers and the structure protruding therefrom are formed out of a monolithic material.

15. The method of claim 13, wherein one of the one or more covers and the structure protruding therefrom are formed of different materials.

16. The method of claim 13, wherein deflecting the first part comprises:

attaching the structure to the one or more covers.

17. A method of sensing an external influence with a microelectromechanical (MEMS) device, the MEMS device includes a mechanism layer having a first part, a second part, and a third part, a top cover, and a bottom cover for encasing the first fixed part, the second fixed part, and the movable part, the method comprising:

deflecting the first part out of a plane associated with the third part by mechanical contact with a structure attached to the top cover when the top cover is attached to the mechanism layer;

deflecting the second part out of the plane associated with the third part by mechanical contact with a structure attached to the bottom cover when the bottom cover is attached to the mechanism layer; and

measuring a change in a value associated with a movement orthogonal to the plane associated with the third part of the third part in relation to the first part and the second parts.