Light active sheet material

• US 20070194332A1
• Filed: 02/07/2007
• Published: 08/23/2007
• Est. Priority Date: 03/29/2004
• Status: Abandoned Application

• Current Assignee: Lumachip, Inc.
• Original Assignee: Articulated Technologies, LLC
• Inventors: Daniels, John, Nelson, Gregory
• Application Number:
  US11/704,044
• Publication Number:
  US 20070194332A1
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 5/04 of lens shape
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

Device structures for sheets of light active material. A first substrate has a transparent first conductive layer. A pattern of light active semiconductor elements are fixed to the first substrate. The light active semiconductor elements have an n-side and a p-side. Each light active semiconductor element has either of the n-side or the p-side in electrical communication with the transparent conductive layer. A second substrate has a second conductive layer. An adhesive secures the second substrate to the first substrate so that the other of said n-side or said p-side of each said light active semiconductor element is in electrical communication with the second conductive layer. Thus forming a solid-state light active device.

Claims

1. A light-to-energy device, comprising:

a first substrate;

a first conductive surface on the first substrate;

a pattern of semiconductor elements on the conductive pattern, each semiconductor element comprising a charge donor layer side and a charge acceptor side;

providing a second substrate;

a second conductive surface on the second substrate;

an adhesive fixing the first substrate to the second substrate so that either of the charge donor and the charge acceptor side of the semiconductor elements is in electrical communication with the first conductive surface and the other of the charge donor and the charge acceptor side of the semiconductor elements is in electrical communication with the second conductive surface.

2. A light-to-energy device according to claim 1;

wherein the first conductive surface is formed as a conductive pattern comprised of at least one of a conductive coating, a conductive ink and a conductive adhesive.

3. A light-to-energy device according to claim 1;

wherein at least one of the first and the second conductive surface is a transparent conductor.

4. A light-to-energy device according to claim 1;

wherein at least one of the first and the second conductive surface is preformed on the respective first and second substrate.

5. A light-to-energy device according to claim 1:

wherein the adhesive comprises at least one of the top substrate and the bottom substrate.

6. A light-to-energy device according to claim 1;

wherein the adhesive layer comprises at least one of a conductive adhesive, a semi-conductive adhesive, an insulative adhesive, a conductive polyiner, a semi-conductive polymer, and an insulative polymer.