Light emitting diode package and method of manufacturing the same

• US 20070194333A1
• Filed: 02/23/2007
• Published: 08/23/2007
• Est. Priority Date: 02/23/2006
• Status: Active Grant

• Current Assignee: Suzhou Lekin Semiconductor Company Limited
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: Son, Won-Jin
• Granted Patent: US 8,115,214 B2
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/49107 on the semiconductor or solid-state body
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/38 with a particular shape
• CPC Class Codes: H01L 33/48 characterised by the semiconductor body packages
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

Provided is a light emitting diode package and a method of manufacturing the same. The light emitting diode package includes a package main body with a cavity, a plurality of light emitting diode chips, a wire, and a plurality of lead frames. The plurality of light emitting diode chips are mounted in the cavity. The wire is connected to an electrode of at least one light emitting diode chip. The plurality of lead frames are formed in the cavity, and at least one lead frame is electrically connected to the light emitting diode chip or a plurality of wires.

Claims

1. A light emitting diode package comprising:

a package main body with a cavity;

a plurality of light emitting diode chips mounted in the cavity;

a wire connected to an electrode of at least one light emitting diode chip; and

a plurality of lead frames formed in the package main body, wherein at least one lead frame is electrically connected to the light emitting diode chip or a plurality of wires.

2. The light emitting diode package according to claim 1, wherein the plurality of light emitting diode chips are light emitting diode chips of three colors (red, green, and blue) or blue light emitting diode chips.

3. The light emitting diode package according to claim 1, comprising a mold member formed in the cavity.

4. The light emitting diode package according to claim 1, comprising a mold member formed in the cavity and including a phosphor absorbing some of lights generated from the light emitting diode chip to emit light having other wavelength.

5. The light emitting diode package according to claim 3, wherein the mold member is formed of silicon or epoxy resin and has one of a flat shape, a concave lens shape, and a convex lens shape.

6. The light emitting diode package according to claim 1, wherein the plurality of light emitting diode chips include a horizontal light emitting diode chip with two electrodes disposed in a horizontal structure, and/or a vertical light emitting diode chip with electrodes disposed in a vertical structure.

7. The light emitting diode package according to claim 1, wherein at least one of the light emitting diode chips includes a P electrode or an N electrode die-bonded to the lead frame.

8. The light emitting diode package according to claim 1, wherein at least one of the lead frame are electrically connected to N electrodes or P electrodes of two or more light emitting diode chips.

9. The light emitting diode package according to claim 1, wherein the plurality of light emitting diode chips are connected with each other in series.

10. The light emitting diode package according to claim 1, wherein the number of the plurality of lead frames are smaller than the number of electrodes of the light emitting diode chips by one.

11. The light emitting diode package according to claim 1, wherein the plurality of lead frames are disposed in a line such that they are spaced from each other in the cavity of the package main body, and the package main body outside from a bottom surface of the cavity.

12. The light emitting diode package according to claim 1, wherein the package main body is formed by performing injection-molding using one material selected from the group consisting of PC (polycarbonate), PCABS (polycarbonate acrylonitrile butadiene styrene), PPA (polyphthalamide), nylon, PET (polyethylene terephtalate), and PBT (polybutylene terephtalate).

13. The light emitting diode package according to claim 1, wherein each side surface of the cavity is formed so as to lean outward at 105-120 degree angle

14. The light emitting diode package according to claim 1, wherein the plurality of lead frames include a lead frame that is not connected to the wire and connected to at least one light emitting diode chip to emit heat of the light emitting diode chip.

19. The light emitting diode package according to claim 14, wherein the plurality of light emitting diode chips are connected with each other in series.

20. The light emitting diode package according to claim 14, wherein the number of the plurality of lead frames is smaller than the number of electrodes of the light emitting diode chips by one, and the lead frames are disposed such that they are spaced from each other in the cavity of the package main body.

15. A method of manufacturing a light emitting diode package, the method comprising:

forming a package main body including a cavity with a plurality of lead frames formed therein;

attaching a plurality of light emitting diode chips into the cavity; and

bonding a light emitting chip and/or one or more wires to at least one lead frame.

16. The method according to claim 15, comprising molding a mold member that includes or does not include a phosphor within the cavity.

17. The method according to claim 15, wherein the plurality of light emitting diode chips emit one or more colors, and include a horizontal light emitting diode chip with two electrodes disposed in a horizontal structure and/or a vertical light emitting diode chip with two electrodes disposed in a vertical structure.

18. The method according to claim 15, wherein the plurality of light emitting diode chips include light emitting diode chips of which two or more P electrodes or N electrodes are connected to any one lead frame.