Light emitting device package and method of manufacturing the same

• US 20070194336A1
• Filed: 09/14/2006
• Published: 08/23/2007
• Est. Priority Date: 02/17/2006
• Status: Abandoned Application

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Shin, Su-ho, Choi, Seung-tae, Kwon, Ki-hwan, Choi, Jin-seung, Moon, Chang Youl, Shin, Kyu Ho, Kweon, Soon Cheol
• Application Number:
  US11/520,834
• Publication Number:
  US 20070194336A1
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements
• CPC Class Codes: H01L 33/641 characterized by the materials

Abstract

A light emitting device package including: a heat dissipating substrate including a cavity; a first conductive pattern formed on the cavity; a light emitting device installed on the first conductive pattern; and a second conductive pattern formed on the heat dissipating substrate at a periphery of the first conductive pattern. The second conductive pattern is electrically separated from the first conductive pattern, and the first and second conductive patterns supply power required for operating the light emitting device.

Claims

1. A light emitting device package comprising:

a heat dissipating substrate including a cavity;

a first conductive pattern disposed on the cavity;

a light emitting device disposed on the first conductive pattern; and

a second conductive pattern disposed on the heat dissipating substrate at a periphery of the first conductive pattern;

wherein the second conductive pattern is electrically separated from the first conductive pattern and wherein the first conductive pattern and the second conductive pattern supply power required for operating the light emitting device.

2. The package of claim 1, wherein the heat dissipating substrate is a metal, and wherein the package further comprises an insulating layer disposed on a surface of the heat dissipating substrate.

3. The package of claim 2, wherein the heat dissipating substrate is aluminum or an aluminum alloy, and the insulating layer is an oxidized layer.

4. The package of claim 1, wherein the first conductive pattern comprises a reflective surface, which is optically treated, formed at a periphery of the light emitting device.

5. The package of claim 4, wherein the reflective surface is optically treated by adding a reflective coating layer on the first conductive pattern.

6. The package of claim 1, wherein the first conductive pattern comprises a single metal layer or multiple metal layers of an electro-conductive material.

7. The package of claim 1, wherein the first conductive pattern is entirely disposed on a bottom and sides of the cavity.

8. The package of claim 1, further comprising a connecting conductive pattern, disposed on the heat dissipating substrate, which is electrically connected to the first conductive pattern.

9. The package of claim 8, wherein the connecting conductive pattern extends from the first conductive pattern as a signal body.

10. The package of claim 1, further comprising a first bonding wire which electrically connects the light emitting device and the second conductive pattern.

11. The package of claim 10, further comprising a second bonding wire which electrically connects the light emitting device and the first conductive pattern.

12. The package of claim 1, wherein an adhesive layer, comprising an electro-conductive material, is interposed between the light emitting device and the first conductive pattern, thereby electrically connecting the light emitting device and the first conductive pattern.

13. The package of claim 1, further comprising a protection layer which electrically insulates at least one of a surface of the first conductive pattern and a surface of the first bonding wire.

14. The package of claim 1, further comprising a heat sink formed as a single body on the heat dissipating substrate.

15. The package of claim 1, further comprising a lens disposed above the cavity.

16. The package of claim 15, further comprising a transparent resin filling a part or an entirety of a space formed between the cavity and the lens.

17. The package of claim 15, further comprising at least one projection formed on any one of mutual contact surfaces of the lens and the radiating substrate, and at least one corresponding groove formed on the other surface of the mutual contact surfaces of the lens and the heat dissipating substrate, to contain the projection.

18. The package of claim 1, wherein:

a plurality of the cavities are separated from each other at a predetermined interval; and

a plurality of the light emitting devices are formed corresponding to each of the cavities.

19. A light emitting device package comprising:

a heat dissipating substrate, formed of a metal, including a cavity therein;

an oxidized layer formed on a surface of the heat dissipating substrate

a first conductive pattern, comprising a reflecting surface formed by reflection processing, disposed on the cavity;

a connecting conductive pattern disposed on the heat dissipating substrate, which is electrically connected to the first conductive pattern;

a light emitting device installed on the first conductive pattern; and

a second conductive pattern disposed on the heat dissipating substrate at a periphery of the first conductive pattern;

wherein the second conductive pattern is electrically separated from the first conductive pattern and wherein the first conductive pattern and the second conductive pattern supply power required for operating the light emitting device.

20. A method of manufacturing a light emitting device package, the method comprising:

providing a heat dissipating substrate having a cavity therein;

forming a first conductive pattern on the cavity;

forming a second conductive pattern on the heat dissipating substrate at a periphery of the first conductive pattern, wherein the second conductive pattern is electrically separated from the first conductive pattern; and

installing a light emitting device on the first conductive pattern.

21. The method of claim 20, wherein the heat dissipating substrate comprises a metal, and the method further comprises forming an insulating layer is on a surface thereof of the heat dissipating substrate.

22. The method of claim 21, wherein the metal is aluminum or an aluminum alloy, and the insulating layer is an oxidized layer made by anodizing.

23. The method of claim 21, wherein the forming a first conductive pattern comprises:

forming a conductive layer, comprising a conductive material, on a surface of the insulating layer;

forming a mask pattern on the conductive layer;

removing a part of the conductive layer by using the mask pattern; and

removing the mask pattern.

24. The method of claim 21, wherein the forming a first conductive pattern comprises:

forming a mask pattern on a surface of the insulating layer;

forming a conductive layer, comprising a conductive material, on the mask pattern and the insulating layer; and

removing the mask pattern and a part of the conductive layer overlaid on the mask pattern.

25. The method of claim 20, wherein the first conductive pattern comprises a single metal layer or multiple metal layers of an electro-conductive material.

26. The method of claim 20, wherein the forming a first conductive pattern further comprises forming a reflective coating layer, comprising a reflecting material, on a top of the first conductive pattern.

27. The method of claim 20, further comprising electrically connecting the light emitting device and the second conductive pattern via a first bonding wire.

28. The method of claim 27, further comprising electrically connecting the light emitting device and the first conductive pattern via a second bonding wire.

29. The method of claim 27, further comprising forming a protection layer on at least one of a surface of the first conductive pattern, and a surface of the first bonding wire, thereby electrically insulating the at least one of a surface of the first conductive pattern and a surface of the first bonding wire.

30. The method of claim 20, wherein the installing the light emitting device comprises interposing an electro-conductive adhesive layer between the light emitting device and the first conductive pattern.

31. The method of claim 20, wherein the providing a heat dissipating substrate comprises forming a heat sink as a single body on the heat dissipating substrate.

32. The method of claim 20, further comprising filling a part or an entirety of a space formed between the heat dissipating substrate including the cavity and a lens with a transparent resin.

33. The method of claim 32, further comprising coupling the lens with the heat dissipating substrate, thereby covering the cavity.

34. A method of manufacturing a light emitting device package, the method comprising:

providing a heat dissipating substrate, comprising a base metal, including a cavity therein;

forming an insulating layer on a surface of the heat dissipating substrate

forming a conductive layer, comprising a conductive material, on a surface of the insulating layer;

forming a mask pattern on a surface of the conductive layer;

forming a first conductive pattern and a second conductive pattern by removing a part of the conductive layer by using the mask pattern;

removing the mask pattern; and

installing a light emitting device on the first conductive pattern.

35. The method of claim 34, wherein the forming a first conductive pattern and a second conductive pattern comprises forming a connecting conductive pattern as a single body with the first conductive pattern.