Please download the dossier by clicking on the dossier button x
×

Connection Structure and Method for Connecting flexible Printed Circuit to Main Substrate

  • US 20070194428A1
  • Filed: 02/02/2007
  • Published: 08/23/2007
  • Est. Priority Date: 02/03/2006
  • Status: Active Grant
First Claim
Patent Images

1. A connection structure, comprising:

  • a main substrate on which a wiring pattern is formed;

    a flexible printed circuit provided with a plurality of connection terminals for connecting the wiring pattern of the main substrate, a plurality of wiring patterns connected to each of the plurality of connection terminals and a through-hole formed between the plurality of wiring patterns; and

    potting resin provided in and around the through-hole in such a way as to reach the main substrate.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×