Connection Structure and Method for Connecting flexible Printed Circuit to Main Substrate

• US 20070194428A1
• Filed: 02/02/2007
• Published: 08/23/2007
• Est. Priority Date: 02/03/2006
• Status: Active Grant

• Current Assignee: Kabushiki Kaisha Toyota Jidoshokki (Toyota Motor Corporation)
• Original Assignee: Kabushiki Kaisha Toyota Jidoshokki (Toyota Motor Corporation)
• Inventors: Ito, Satoshi, Maeno, Kazuhiro, Sato, Kunikazu, Nodo, Takamasa
• Granted Patent: US 7,705,474 B2
• Time in Patent Office: Days
• US Class Current: 257/686
• CPC Class Codes: H05K 2201/048 Second PCB mounted on first PCB by inserting in window or holes of the first PCB
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 2201/09172 Notches between edge pads
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/305 Affixing by adhesive
• CPC Class Codes: H05K 3/363 by soldering

Abstract

A main substrate is provided with a wiring pattern on its surface and in the inner layer. A wiring pattern for connecting the signal line or power line of the main substrate to an external circuit is formed on the flexible printed circuit. A connection terminal to which a corresponding wiring pattern is connected is formed at the tip of the flexible printed circuit. A through-hole is formed between the wiring patterns. Potting resin is potted in each through-hole and around it. When the resin hardens, the potting resin joints the main substrate and the flexible printed circuit.

Claims

1. A connection structure, comprising:

a main substrate on which a wiring pattern is formed;

a flexible printed circuit provided with a plurality of connection terminals for connecting the wiring pattern of the main substrate, a plurality of wiring patterns connected to each of the plurality of connection terminals and a through-hole formed between the plurality of wiring patterns; and

potting resin provided in and around the through-hole in such a way as to reach the main substrate.

7. The connection structure according to claim 1, wherein

the flexible printed circuit is further provided with an outside through-hole in outside area of the plurality of wiring pattern and

the potting resin is provided in the through-hole, in the outside through-hole and around the through-holes in such a way as to reach the main substrate.

8. The connection structure according to claim 7, wherein

the area of the outside through-hole is larger than that of the through-hole formed between the plurality of wiring patterns.

2. A connection structure, comprising:

a main substrate on which a wiring pattern is formed;

a flexible printed circuit, the tip of which is formed in a comb-shape and which is provided with a plurality of connection terminals for connecting the wiring pattern of the main substrate at the tip of each projection of the comb-shaped part; and

potting resin provided in the comb-shaped part in such a way as to reach the main substrate.

9. The connection structure according to claim 2, wherein

the flexible printed circuit is further provided with a concave part in outside areas of the plurality of connection terminals at an tip of the projection and

the potting resin is provided with the comb-shaped part, the concave part and around them in such a way as to reach the main substrate.

10. The connection structure according to claim 9, wherein

the area of the concave part in outside area of the plurality of connection terminals is larger than that of the concave part of the comb-shaped part.

3. A connection structure, comprising:

a main substrate;

a flexible printed circuit, in a prescribed part of the end of which a notch is formed; and

potting resin provided in and around the notch in such a way as to reach the main substrate.

4. A connection structure, comprising:

a main substrate on which a through-hole is formed;

a flexible printed circuit connected to the main substrate in a state where an tip of the flexible printed circuit passes through the through-hole; and

potting resin provided in the through-hole and around it in such a way as to reach the flexible printed circuit.

5. A connection structure, comprising:

a main substrate on which a wiring pattern and a through-hole are formed;

a flexible printed circuit provided with a plurality of connection terminals for connecting the wiring pattern provided on the main substrate, in a tip of the flexible printed circuit; and

potting resin provided in the through-hole and around it in such a way as to reach the flexible printed circuit in a state where the flexible printed circuit is connected to the main substrate using the plurality of connection terminals.

6. A connection method for connecting a flexible printed circuit provided with a plurality of connection terminals for connecting a wiring pattern on a main substrate and a plurality of wiring patterns each connected to the plurality of connection terminals, to the main substrate on which a wiring pattern is formed, comprising:

forming a through-hole between the plurality of wiring patterns on the flexible printed circuit;

connecting each of the wiring patterns of the main substrate and the each of the wiring patterns of the flexible printed circuit by solder; and

providing potting resin in and around the through-hole in such a way as to reach the main substrate.