Organic electroluminescence display device and manufacturing method thereof

• US 20070194710A1
• Filed: 09/29/2006
• Published: 08/23/2007
• Est. Priority Date: 02/20/2006
• Status: Active Grant

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Samsung Mobile Display Company Limited (Samsung Electronics Co. Ltd.)
• Inventors: Song, Seung, Kim, Deuk
• Granted Patent: US 7,564,185 B2
• Time in Patent Office: Days
• US Class Current: 313/512
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 50/87 Arrangements for heating or cooling
• CPC Class Codes: H10K 59/131 Interconnections, e.g. wiring lines or terminals
• CPC Class Codes: H10K 59/179 Interconnections, e.g. wiring lines or terminals
• CPC Class Codes: H10K 59/8722 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/8794 Arrangements for heating and cooling

Abstract

An organic electroluminescence display device, and a manufacturing method thereof. An organic electroluminescence display device includes a first substrate formed with an organic electroluminescence element having a first electrode, an organic thin film layer and a second electrode and a metal wiring for transmitting signals to the organic electroluminescence element, a second substrate arranged in an upper side of the first substrate, a frit provided between the first substrate and the second substrate, a reflective layer and a protective film provided between the metal wiring and the frit, wherein the first substrate and the second substrate are attached to each other by the frit.

Claims

1. An organic electroluminescence display device comprising:

a first substrate formed with an organic electroluminescence element,

a metal wiring for conducting signals to the organic electroluminescence element,

a second substrate arranged on an upper side of the first substrate,

a frit provided between the first substrate and the second substrate, and

a reflective layer formed between the metal wiring and the frit.

2. The organic electroluminescence display device as claimed in claim 1, wherein at least either one of the first substrate and the second substrate comprises a transparent material.

3. The organic electroluminescence display device as claimed in claim 1, wherein the metal wiring comprises a scan line, a data line, and a power supply line.

4. The organic electroluminescence display device as claimed in claim 1, wherein the reflective layer is further formed on a remaining region excluding a region formed with the organic electroluminescence element.

5. The organic electroluminescence display device as claimed in claim 1, wherein the reflective layer is formed of one or more selected from a group consisting of Cu, Au, Al, and Ag.

6. The organic electroluminescence display device as claimed in claim 1, wherein the frit comprises at least one dopant made of transition metal.

7. The organic electroluminescence display device as claimed in claim 1, further comprising a transistor for controlling the operation of the organic electroluminescence element.

8. The organic electroluminescence display device as claimed in claim 1, further comprising a protective film formed on the reflective layer.

9. The organic electroluminescence display device as claimed in claim 1, wherein the frit comprises one or more materials selected from the group consisting of magnesium oxide (MgO), calcium oxide (CaO), barium oxide (BaO), lithium oxide (Li2O), sodium oxide (Na2O), potassium oxide (K2O), boron oxide (B2O3), vanadium oxide (V2O5), zinc oxide (ZnO), tellurium oxide (TeO2), aluminum oxide (Al2O3), silicon dioxide (SiO2), lead oxide (PbO), tin oxide (SnO), phosphorous oxide (P2O5), ruthenium oxide (Ru2O), rubidium oxide (Rb2O), rhodium oxide (Rh2O), ferrite oxide (Fe2O3), copper oxide (CuO), titanium oxide (TiO2), tungsten oxide (WO3), bismuth oxide (Bi2O3), antimony oxide (Sb2O3), lead-borate glass, tin-phosphate glass, vanadate glass, and borosilicate.

10. A manufacturing method of an organic electroluminescence display device, method comprising:

providing an organic electroluminescence element on a pixel region of a first substrate and providing a wiring connected to the organic electroluminescence element on a non-pixel region of the first substrate,

providing a reflective layer on an upper surface of the non-pixel region including the wiring,

forming a frit along a surrounding of the second substrate, and

arranging the second substrate on an upper side of the first substrate and attaching the frit to the first substrate.

11. The manufacturing method of an organic electroluminescence display device as claimed in claim 10, further comprising:

providing a first electrode on the first substrate of the pixel region,

providing an insulating film on an upper side of the pixel region,

patterning the insulating film so that at least a part of the first electrode is exposed to define a pixel,

providing an organic thin film layer on the exposed first electrode,

providing a separation film on the upper side of the pixel region and patterning the separation film so that the organic thin film layer is at least partially exposed, and

providing a second electrode on the organic thin film layer.

12. The manufacturing method of an organic electroluminescence display device as claimed in claim 10, wherein the wiring is formed of one or more selected from a group consisting of Cr, Mo, Ti and ITO.

13. The manufacturing method of an organic electroluminescence display device as claimed in claim 10, further comprising:

after providing the reflective layer, patterning so that the reflective layer remains substantially only on the wiring.

14. The manufacturing method of an organic electroluminescence display device as claimed in claim 10, wherein the frit is fused and attached to the first substrate by irradiation with at least one of a laser beam and infrared ray.

15. The manufacturing method of an organic electroluminescence display device as claimed in claim 10, wherein the frit comprises at least one dopant comprising at least one transition metal.

16. The manufacturing method of an organic electroluminescence display device as claimed in claim 10, further comprising providing a transistor for controlling the organic electroluminescence element.

17. The manufacturing method of an organic electroluminescence display device as claimed in claim 15, further comprising:

providing a buffer layer on a first substrate including a pixel region and a non-pixel region,

providing a semiconductor layer on the buffer layer of the pixel region and providing a gate insulating film on the upper surface of the pixel region including the semiconductor layer,

providing a gate electrode and a first metal wiring on the gate insulating film of the pixel region and providing on the buffer layer of the non-pixel region the first metal wiring extended from the first metal wiring of the pixel region,

providing a between-layer insulating film on the upper surface of the pixel region including the gate electrode,

providing on the between-layer insulating film of the pixel region a source and drain electrodes and a second metal wiring connected to the semiconductor layer and providing on the buffer layer of the non-pixel region the second metal wiring extended from the second metal wiring of the pixel region,

providing a flattened layer on the upper surface of the pixel region, and

providing on the flattened layer the organic electroluminescence element comprising a first electrode, an organic thin film layer and a second electrode connected to the source and drain electrodes.

18. An organic electroluminescence display device comprising:

a first substrate formed with an organic electroluminescence element comprising a first electrode, an organic thin film layer and a second electrode and a metal wiring for conducting signals to the organic electroluminescence element,

a second substrate arranged at a upper side of the first substrate,

a frit provided between the first substrate and the second substrate,

a reflective layer provided between the metal wiring and the frit, and

a protective film formed on the reflective film.

19. The organic electroluminescence display device as claimed in claim 18, wherein the protective film is formed of a first electrode material and separated from the first electrode.

20. The organic electroluminescence display device as claimed in claim 18, further comprising a transistor for controlling the organic electroluminescence element.

21. A manufacturing method of an organic electroluminescence display device comprising:

providing a buffer layer on a first substrate including a pixel region and a non-pixel region,

providing a semiconductor layer on the buffer layer of the pixel region and providing a gate insulating film on the upper surface of the non-pixel region,

providing a gate electrode and a first metal wiring on the gate insulating film of the pixel region and providing on the gate insulating film of the non-pixel region the first metal wiring extended from the first metal wiring of the pixel region,

providing a between-layer insulating film on the upper surface of the pixel region and providing a contact hole so that a portion of the semiconductor layer is exposed,

providing on the between-layer insulating film of the pixel region a source and drain electrodes and a second metal wiring connected through the contact hole to the semiconductor layer and providing on the gate insulating film of the non-pixel region the second metal wiring extended from the second metal wiring of the pixel region,

providing a reflective layer on the upper surface of the non-pixel region including the first and second metal wirings,

providing a flattened layer on the upper surface of the pixel region and providing a via hole so that the source and drain electrodes are exposed,

providing an inorganic electrode layer on the upper surface of the pixel region and non-pixel region and then patterning the inorganic electrode layer, with a first electrode formed on the pixel region, the first electrode connected through the via hole to the source or drain electrode, and with a protective film formed on the non-pixel region,

providing an organic thin film layer and a second electrode on the first electrode,

forming a frit along a surrounding of the second substrate, and

arranging the second substrate on an upper surface of the first substrate and then attaching the frit to the first substrate.