Exposure apparatus, exposure method, and method for producing device

• US 20070195301A1
• Filed: 04/19/2007
• Published: 08/23/2007
• Est. Priority Date: 06/10/2004
• Status: Active Grant

• Current Assignee: Nikon Corporation, Nikon Engineering Co. Ltd. (Nikon Corporation)
• Original Assignee: Nikon Corporation, Nikon Engineering Co. Ltd. (Nikon Corporation)
• Inventors: Nagasaka, Hiroyuki
• Granted Patent: US 8,373,843 B2
• Time in Patent Office: Days
• US Class Current: 355/53
• CPC Class Codes: G03F 7/70341 Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply chemical composition of immersion liquids G03F7/2041

Abstract

A lithographic apparatus includes a substrate table to hold a substrate and a projection system to project a patterned radiation beam onto a target portion of the substrate. A liquid supply system at least partly fills a space between the projection system and the substrate with a liquid, and has a liquid confinement structure to at least partly confine the liquid within the space. An outlet removes a mixture of liquid and gas passing through a gap between the liquid confinement structure and the substrate. An evacuation system draws the mixture through the outlet, and includes a separator tank to separate liquid from gas in the mixture and a separator tank pressure controller, connected to a non-liquid-filled region of the separator tank, to maintain a stable pressure within the non-liquid-filled region.

Claims

1. A lithographic apparatus comprising:

an illuminator configured to condition a radiation beam;

a support constructed to hold a patterning device, the patterning device configured to impart the radiation beam with a pattern in its cross-section to form a patterned radiation beam;

a substrate table constructed to hold a substrate;

a projection system configured to project the patterned radiation beam onto a target portion of the substrate;

a liquid supply system configured to at least partly fill a space between the projection system and the substrate with a liquid, the liquid supply system comprising a liquid confinement structure configured to at least partly confine the liquid within the space;

an outlet configured to remove a mixture of liquid and gas passing through a gap between the liquid confinement structure and the substrate; and

an evacuation system configured to draw the mixture through the outlet, the evacuation system comprising a separator tank arranged to separate liquid from gas in the mixture and a separator tank pressure controller, connected to a non-liquid-filled region of the separator tank, configured to maintain a stable pressure within the non-liquid-filled region.

2. The lithographic apparatus according to claim 1, wherein the evacuation system further comprises:

a purge tank, situated lower than the separator tank and connected thereto via an opening in a lower portion of the separator tank and an opening in an upper portion of the purge tank, the connection being controllable via a purge valve; and

a pressure equalization connection, controllable by a pressure equalization valve, configured to connect respective upper portions of the separator and purge tanks to facilitate flow of separated liquid from the separator tank to the purge tank without a change in pressure in the separator tank,

wherein the purge tank is configured so that liquid can be removed therefrom, during a liquid removal phase, by closing the purge valve, closing the pressure equalization valve and opening the purge tank to a liquid sink via a liquid sink valve.

3. The lithographic apparatus according to claim 2, wherein the evacuation system further comprises a high pressure gas source connectable to the purge tank and configured to force liquid from the purge tank to the liquid sink at an increased rate.

4. The lithographic apparatus according to claim 3, wherein the evacuation system further comprises a liquid pump configured to pump liquid from the separator tank to the liquid sink, the liquid pump comprising a gas jet pump powered by the high pressure gas source.

5. The lithographic apparatus according to claim 2, wherein the purge valve, the liquid sink valve, or both comprises a check valve configured to prevent backflow.

6. The lithographic apparatus according to claim 1, wherein the evacuation system further comprises:

a purge tank, situated lower than the separator tank and connected thereto via an opening in a lower portion of the separator tank and an opening in an upper portion of the purge tank, the connection being controllable via a purge valve; and

a limited flow connection configured to connect respective upper portions of the separator and purge tanks and comprising a flow restriction device arranged to provide a flow impedance,

wherein the purge tank is configured so that liquid can be removed therefrom, during a liquid removal phase, by closing the purge valve and opening the purge tank to a liquid sink via a liquid sink valve, and the flow impedance is selected to equalize the pressures of the separator and purge tanks, after the liquid removal phase, without causing a fluctuation of the pressure in the separator tank that exceeds a threshold value.

7. The lithographic apparatus according to claim 6, wherein the flow impedance is also selected to allow liquid to flow from the separator tank to the purge tank at a rate above a minimum transfer rate.

8. The lithographic apparatus according to claim 6, wherein the evacuation system further comprises a high pressure gas source connectable to the purge tank and configured to force liquid from the purge tank to the liquid sink at an increased rate.

9. The lithographic apparatus according to claim 6, wherein the purge valve, the liquid sink valve, or both comprises a check valve configured to prevent backflow.

10. The lithographic apparatus according to claim 1, wherein the evacuation system further comprises:

a purge tank, situated lower than the separator tank and connected thereto via an opening in a lower portion of the separator tank and an opening in an upper portion of the purge tank, the connection being controllable via a purge valve;

a limited flow connection configured to connect respective upper portions of the separator and purge tanks and comprising a flow restriction device arranged to provide a flow impedance; and

a pressure equalization connection, controllable by a pressure equalization valve, configured to connect respective upper portions of the separator and purge tanks to facilitate flow of separated liquid from the separator tank to the purge tank without a change in pressure in the separator tank,

wherein the purge tank is configured so that liquid can be removed therefrom, during a liquid removal phase, by closing the purge valve and opening the purge tank to a liquid sink via a liquid sink valve, and the flow impedance is selected to equalize the pressures of the separator and purge tanks, after the liquid removal phase, without causing a fluctuation of the pressure in the separator tank that exceeds a threshold value.

11. The lithographic apparatus according to claim 10, wherein the evacuation system further comprises a high pressure gas source connectable to the purge tank and configured to force liquid from the purge tank to the liquid sink at an increased rate.

12. The lithographic apparatus according to claim 10, wherein the purge valve, the liquid sink valve, or both comprises a check valve configured to prevent backflow.

13. The lithographic apparatus according to claim 1, wherein the evacuation system further comprises a liquid pump configured to pump liquid from the separator tank to the liquid sink.

14. The lithographic apparatus according to claim 1, wherein the separator tank pressure controller comprises:

a main pumping line connected to a two-phase compatible pump configured to pump the mixture; and

a backup line connectable to a shared vacuum facility configured to pump gas only,

wherein the main pumping and backup lines are connected to the separator tank, and the two-phase compatible pump being configurable to provide a deeper vacuum than the shared vacuum facility.

15. The lithographic apparatus according to claim 14, wherein the main pumping line is connected to a lower, predominantly liquid filled portion of the separator tank, and the backup line is connected to an upper, predominantly gas filled portion of the separator tank.

16. The lithographic apparatus according to claim 14, wherein the main and backup pumping lines are each fitted with check valves to prevent one pumping line from drawing on the other pumping line.

17. The lithographic apparatus according to claim 14, wherein the backup line comprises a hydrophobic filter configured to prevent liquid from reaching the shared vacuum facility.

18. The lithographic apparatus according to claim 14, wherein the main pumping line, the backup line, or both, comprise a back-pressure regulator configured to control the pumping power provided by the two-phase compatible pump, the shared vacuum facility, or both, as a function of the pressure on a separator tank side of the back-pressure regulator.

19. The lithographic apparatus according to claim 14, wherein the two-phase compatible pump is configured both to maintain a vacuum level in a non-liquid-filled portion of the separator tank via the main pumping line and to extract liquid from a lower, predominantly liquid filled portion of the separator tank via a lower separator tank pumping line, wherein a check valve is positioned between the main pumping line and the lower separator tank pumping line so as to prevent the shared vacuum facility from pumping on the liquid.

20. An apparatus, comprising:

a pressurized gas input configured to provide gas under pressure to an interface region of a container from which liquid may escape;

a stabilized evacuation system configured to provide controlled removal of a mixture of liquid and gas from the region, the flow of gas caused by the pressurized gas input coupled with the stabilized evacuation system being configured to limit the escape of liquid from the container through the interface region, the stabilized evacuation system comprising a separator tank arranged to separate liquid from gas in the mixture and a separator tank pressure controller, connected to a non-liquid-filled region of the separator tank, configured to maintain a stable pressure within the non-liquid-filled region.

21. A lithographic apparatus, comprising:

an illuminator configured to condition a radiation beam;

a support constructed to hold a patterning device, the patterning device configured to impart the radiation beam with a pattern in its cross-section to form a patterned radiation beam;

a substrate table constructed to hold a substrate;

a projection system configured to project the patterned radiation beam onto a target portion of the substrate;

a liquid supply system configured to at least partly fill a space between the projection system and the substrate with a liquid, the liquid supply system comprising a liquid confinement structure configured to at least partly confine the liquid within the space;

an outlet configured to remove a mixture of liquid and gas passing through a gap between the liquid confinement structure and the substrate; and

an evacuation system configured to draw the mixture through the outlet, the evacuation system comprising a two-phase compatible pump and a liquid/gas homogenizer arranged between the gap and the two-phase compatible pump, the liquid/gas homogenizer being arranged to provide a uniform mixture of liquid and gas to the two-phase compatible pump.

22. The lithographic apparatus according to claim 21, wherein the liquid/gas homogenizer comprises a holding tank and a porous block, the porous block configured to homogenize the mixture as it is passed into the holding tank.

23. A lithographic apparatus, comprising:

an illuminator configured to condition a radiation beam;

a support constructed to hold a patterning device, the patterning device configured to impart the radiation beam with a pattern in its cross-section to form a patterned radiation beam;

a substrate table constructed to hold a substrate;

a projection system configured to project the patterned radiation beam onto a target portion of the substrate;

a liquid supply system configured to at least partly fill a space between the projection system and the substrate with a liquid, the liquid supply system comprising a liquid confinement structure configured to at least partly confine the liquid within the space;

an outlet configured to remove a mixture of liquid and gas passing through a gap between the liquid confinement structure and the substrate; and

an evacuation system configured to draw the mixture through the outlet, the evacuation system, comprising;

a main pumping line connected to a two-phase compatible pump configured to pump the mixture,

a backup line connectable to a shared vacuum facility configured to pump gas only and arranged to backup the two-phase compatible pump, the two-phase compatible pump being configurable to provide a deeper vacuum than the shared vacuum facility, and

a two-phase-compatible pressure regulator connected to the main pumping line and the backup line.

24. The lithographic apparatus according to claim 23, wherein the backup line comprises a hydrophobic filter configured to prevent liquid from reaching the shared vacuum facility.

25. A device manufacturing method, comprising:

providing a liquid to a space between a projection system of a lithographic apparatus and a substrate, the liquid being confined to the space at least in part by a liquid confinement structure;

removing a mixture of liquid and gas passing through a gap between the liquid confinement structure and the substrate;

separating, in a separator tank, liquid from gas in the mixture;

pumping on a non-liquid-filled region of the separator tank so as to maintain a stable pressure within the separator tank; and

projecting a patterned beam of radiation, using the projection system, through the liquid onto the substrate.

26. A device manufacturing method, comprising:

providing a flow of gas under pressure to an interface region of a container from which liquid may escape;

controlled removing of a mixture of liquid and gas from the region, the flow of gas coupled with the controlled removal of the mixture being configured to limit the escape of liquid from the container through the interface region;

separating, in a tank, liquid from gas in the mixture; and

pumping on a non-liquid-filled region of the tank so as to maintain a stable pressure within the non-liquid-filled region.

27. A device manufacturing method, comprising:

providing a liquid to a space between a projection system of a lithographic apparatus and a substrate, the liquid being confined to the space at least in part by a liquid confinement structure;

removing a mixture of liquid and gas passing through a gap between the liquid confinement structure and the substrate using a two-phase compatible pump;

homogenizing the mixture before it reaches the two-phase compatible pump; and

projecting a patterned beam of radiation, using the projection system, through the liquid onto the substrate.

28. A device manufacturing method, comprising:

providing a liquid to a space between a projection system of a lithographic apparatus and a substrate, the liquid being confined to the space at least in part by a liquid confinement structure;

removing a mixture of liquid and gas, the mixture passing through a gap between the liquid confinement structure and the substrate, through a main pumping line using a two-phase compatible pump;

removing gas from the mixture through a backup line using a shared vacuum facility as a backup to the two-phase compatible pump, the two-phase compatible pump providing a deeper vacuum than the shared vacuum facility;

regulating the main pumping line and the backup line using a two-phase-compatible pressure regulator; and

projecting a patterned beam of radiation, using the projection system, through the liquid onto the substrate.