INTEGRATED VACUUM METROLOGY FOR CLUSTER TOOL

• US 20070196011A1
• Filed: 12/13/2006
• Published: 08/23/2007
• Est. Priority Date: 11/22/2004
• Status: Abandoned Application

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Thakur, Randhir, Egan, Todd, Samoilov, Arkadii, Hansson, Per-Ove, Cox, Damon
• Application Number:
  US11/610,468
• Publication Number:
  US 20070196011A1
• Time in Patent Office: Days
• US Class Current: 382/145
• CPC Class Codes: G01N 21/33 using ultraviolet light G01N21/39 takes precedence
• CPC Class Codes: H01L 21/67109 mainly by convection
• CPC Class Codes: H01L 21/67115 mainly by radiation
• CPC Class Codes: H01L 21/67161 characterized by the layout of the process chambers
• CPC Class Codes: H01L 21/67167 surrounding a central transfer chamber
• CPC Class Codes: H01L 21/67196 characterized by the construction of the transfer chamber
• CPC Class Codes: H01L 21/67207 comprising a chamber adapted to a particular process
• CPC Class Codes: H01L 21/67745 characterized by movements or sequence of movements of transfer devices

Abstract

Aspects of the invention generally provide an apparatus and method for processing substrates using a multi-chamber processing system that is adapted to process substrates and analyze the results of the processes performed on the substrate. In one aspect of the invention, one or more analysis steps and/or pre-processing steps are performed on the substrate to provide data for processes performed on subsequent substrates. In one aspect of the invention, a system controller and one or more analysis devices are utilized to monitor and control a process chamber recipe and/or a process sequence to reduce substrate scrap due to defects in the formed device and device performance variability issues. Embodiments of the present invention also generally provide methods and a system for repeatably and reliably forming semiconductor devices used in a variety of applications.

Claims

1. A substrate processing apparatus comprising:

a load lock chamber having an inlet valve and an outlet valve configured to receive at least one substrate into a vacuum environment; and

an optical inspection device disposed in the vacuum environment, wherein the optical inspection device is adapted to emit a wavelength of less than 190 nanometers and is in communication with the vacuum environment.

2. The apparatus of claim 1, further comprising:

a plurality of stacked substrate support members disposed in the vacuum environment.

3. The apparatus of claim 1, wherein the optical inspection device is a spectrometry device.

4. The apparatus of claim 1, wherein the optical inspection device measures thickness of a film located on the at least one substrate.

5. The apparatus of claim 1, wherein the optical inspection device measures stress of a film located on the at least one substrate.

8. The apparatus of claim 1, wherein the optical inspection device is coupled to a positioning device.

9. The apparatus of claim 1, wherein the optical inspection device is in communication with a plurality of processing chambers coupled to the load lock chamber by a system controller.

10. A substrate processing apparatus, comprising:

a load lock chamber having an elevator assembly disposed in an evacuable environment; and

an optical inspection device disposed above the elevator assembly in communication with the evacuable environment.

11. The apparatus of claim 10, wherein the evacuable environment is shared by the optical inspection device.

12. The apparatus of claim 10, wherein the evacuable environment is coupled to a purge gas source configured to provide an atmosphere within the evacuable environment that is substantially transparent to wavelengths between about 200 nanometers to about 600 nanometers or less.

13. The apparatus of claim 10, wherein the evacuable environment is coupled to a purge gas source configured to provide an atmosphere within the evacuable environment that is substantially transparent to wavelengths less than about 190 nanometers or less.

14. The apparatus of claim 10, wherein the elevator assembly comprises at least one substrate support.

15. A method of processing a substrate, comprising:

transferring a substrate to an evacuable chamber through an inlet valve coupled to the evacuable chamber;

providing an environment in the evacuable chamber that is non-absorbing to wavelengths less than 200 nanometers;

inspecting the substrate with an optical device that shares the environment in the evacuable chamber with the substrate; and

transferring the substrate through an outlet valve after inspection.

16. The method of claim 15, wherein the environment comprises a pressure between about ambient pressure to about 10⁻

6 Torr.

17. The method of claim 15, wherein the environment comprises an atmosphere selected from the group of nitrogen, argon, and helium.

18. The method of claim 15, wherein providing the environment further comprises:

pumping the evacuable chamber to a pressure between the range of ambient pressure to about 10<sup>−

6</sup> Torr.

19. The method of claim 15, wherein the inspection further comprises:

moving the substrate relative to the optical device.

20. The method of claim 15, wherein the inspection further comprises:

moving the optical device relative to the substrate.