THREE DIMENSIONAL MULTILAYER BARRIER AND METHOD OF MAKING

• US 20070196682A1
• Filed: 01/26/2007
• Published: 08/23/2007
• Est. Priority Date: 10/25/1999
• Status: Abandoned Application

• Current Assignee: Vitex Systems, Inc.
• Original Assignee: Vitex Systems, Inc.
• Inventors: Martin, Peter, Moro, Lorenza, Hall, Michael, Gross, Mark, Burrows, Paul, Visser, Robert, Bonham, Charles, Graff, Gordon, Mast, Eric, Bennett, Wendy
• Application Number:
  US11/627,583
• Publication Number:
  US 20070196682A1
• Time in Patent Office: Days
• US Class Current: 428/594
• CPC Class Codes: G02F 1/133337 Layers preventing ion diffusion, e.g. by ion absorption
• CPC Class Codes: H01L 23/562 Protection against mechanical damage H01L23/02, H01L23/28 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01M 50/186 characterised by the disposition of the sealing members
• CPC Class Codes: H10K 50/8445 multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
• CPC Class Codes: Y02E 60/10 Energy storage using batteries
• CPC Class Codes: Y10T 428/12347 Plural layers discontinuously bonded [e.g., spot-weld, mechanical fastener, etc.]
• CPC Class Codes: Y10T 428/24 Structurally defined web or sheet [e.g., overall dimension, etc.]

Abstract

A three dimensional multilayer barrier. The barrier includes a first barrier continuous layer adjacent to a substrate; a first discontinuous decoupling layer adjacent to the first continuous barrier layer, the first discontinuous decoupling layer having at least two sections; and a second continuous barrier layer adjacent to the first discontinuous decoupling layer, the second barrier forming a wall separating the sections of the first discontinuous decoupling layer. A method of making the three dimensional multilayer barrier is also described.

Claims

1. A three dimensional multilayer barrier comprising:

a first continuous barrier layer adjacent to a substrate;

a discontinuous decoupling layer adjacent to the first continuous barrier layer, the discontinuous decoupling layer having at least two sections; and

a second continuous barrier layer adjacent to the discontinuous decoupling layer, the second continuous barrier layer forming a wall separating the sections of the discontinuous decoupling layer.

2. The three dimensional multilayer barrier of claim 1 further comprising:

a second discontinuous decoupling layer adjacent to the second continuous barrier layer, the second discontinuous decoupling layer having at least two sections; and

a third continuous barrier layer adjacent to the second discontinuous decoupling layer, the third continuous barrier layer forming a wall separating the sections of the second discontinuous decoupling layers.

3. The three dimensional multilayer barrier of claim 2 wherein the sections of the second discontinuous decoupling layer are offset horizontally from the sections of the first discontinuous decoupling layer.

4. The three dimensional multilayer barrier of claim 2 wherein the sections of the second discontinuous decoupling layer are positioned between the sections of the first discontinuous decoupling layer.

5. The three dimensional multilayer barrier of claim 4 further comprising:

a third discontinuous decoupling layer adjacent to the third continuous barrier layer, the third discontinuous decoupling layer having at least two sections; and

a fourth continuous barrier layer adjacent to the first discontinuous decoupling layer, the fourth continuous barrier forming a wall separating the sections of the third discontinuous decoupling layer;

a fourth discontinuous decoupling layer adjacent to the fourth continuous barrier layer, the fourth discontinuous decoupling layer having at least two sections; and

a fifth continuous barrier layer adjacent to the fourth discontinuous decoupling layer, the fifth continuous barrier layer forming a wall separating the sections of the fourth discontinuous decoupling layers.

6. The three dimensional multilayer barrier of claim 5 wherein the sections of the third discontinuous decoupling layer are offset horizontally from the sections of the second discontinuous decoupling layer.

7. The three dimensional multilayer barrier of claim 5 wherein the sections of the fourth discontinuous decoupling layer are offset horizontally from the sections of the third discontinuous decoupling layer.

8. The three dimensional multilayer barrier of claim 5 wherein the sections of the fourth discontinuous decoupling layer are positioned between the sections of the third discontinuous decoupling layer.

9. The three dimensional multilayer barrier of claim 1 wherein the first or second barrier layer is made of a material selected from metals, metal oxides, metal nitrides, metal carbides, metal oxynitrides, metal oxyborides, or combinations thereof.

10. The three dimensional multilayer barrier of claim 1 wherein the first decoupling layer is made of a material selected from organic polymers, inorganic polymers, organometallic polymers, hybrid organic/inorganic polymer systems, silicates, or combinations thereof.

11. The three dimensional multilayer barrier of claim 1 wherein the oxygen transmission rate through the three dimensional multilayer barrier is less than 0.005 cc/m²/day at 23°

C. and 0% relative humidity.

12. The three dimensional multilayer barrier of claim 1 wherein the oxygen transmission rate through the three dimensional multilayer barrier is less than 0.005 cc/m²/day at 38°

C. and 90% relative humidity.

13. The three dimensional multilayer barrier of claim 1 wherein the water vapor transmission rate through the three dimensional multilayer barrier is less than 0.005 gm/m²/day at 38°

C. and 100% relative humidity.

14. The three dimensional multilayer barrier of claim 1 further comprising a discontinuous decoupling layer between the substrate and the first continuous barrier layer.

15. The three dimensional multilayer barrier of claim 1 further comprising an environmentally sensitive device between the substrate and the first continuous barrier layer.

16. The three dimensional multilayer barrier of claim 15 further comprising a second three dimensional multilayer barrier between the substrate and the environmentally sensitive device, the second three dimensional multilayer barrier comprising:

a first continuous barrier layer adjacent to the substrate;

a discontinuous decoupling layer adjacent to the first continuous barrier layer, the discontinuous decoupling layer having at least two sections; and

a second continuous barrier layer adjacent to the discontinuous layer, the second continuous barrier layer forming a wall separating the sections of the discontinuous decoupling layers, wherein the environmentally sensitive device is encapsulated between the three dimensional multilayer barrier and the second three dimensional multilayer barrier.

17. The three dimensional multilayer barrier of claim 1 further comprising a functional layer.

18. The three dimensional multilayer barrier of claim 1 further comprising at least one two dimensional barrier stack comprising at least two continuous barrier layers and at least one continuous decoupling layer positioned between the at least two continuous barrier layers, the at least two continuous barrier layers enclosing and forming a seal around the at least one continuous decoupling layer.

19. The three dimensional multilayer barrier of claim 18 wherein the at least one two dimensional barrier stack is positioned between the substrate and the first continuous barrier layer of the three dimensional multilayer barrier.

20. The three dimensional multilayer barrier of claim 18 wherein the at least one two dimensional barrier stack is positioned adjacent the second continuous barrier layer of the three dimensional multilayer barrier on a side opposite the substrate.

21. A method of making a three dimensional multilayer barrier comprising:

depositing a first continuous barrier layer adjacent to a substrate;

depositing a first discontinuous decoupling layer adjacent to the first continuous barrier layer, the first discontinuous decoupling layer having at least two sections;

depositing a second continuous barrier layer adjacent to the first discontinuous decoupling layer, the second continuous barrier layer forming a wall separating the sections of the first discontinuous decoupling layer.

22. The method of claim 21 further comprising:

depositing a second discontinuous decoupling layer adjacent to the second continuous barrier layer, the second discontinuous decoupling layer having at least two sections; and

depositing a third continuous barrier layer adjacent to the second discontinuous decoupling layer, the third continuous barrier layer forming a wall separating the sections of the second discontinuous decoupling layer.

23. The method of claim 22 wherein the sections of the second discontinuous decoupling layer are offset horizontally from the sections of the first discontinuous decoupling layer.

24. The method of claim 22 wherein the sections of the second discontinuous decoupling layer are positioned between the sections of the first discontinuous decoupling layer.

25. The method of claim 21 wherein the first or second continuous barrier layer is deposited using a vacuum process.

26. The method of claim 25 wherein the vacuum process is selected from sputtering, reactive sputtering, chemical vapor deposition, plasma enhanced chemical vapor deposition, evaporation, sublimation, electron cyclotron resonance-plasma enhanced vapor deposition (ECR-PECVD), and combinations thereof.

27. The method of claim 21 wherein the first discontinuous decoupling layer is deposited using a vacuum process.

28. The method of claim 27 wherein the vacuum process is selected from flash evaporation with in situ polymerization, or plasma deposition and polymerization, or combinations thereof.

29. The method of claim 21 wherein the first discontinuous decoupling layer is deposited using an atmospheric process.

30. The method of claim 29 wherein the atmospheric process is selected from spin coating, ink jet printing, screen printing, spraying, or combinations thereof.

31. The method of claim 21 wherein the first discontinuous decoupling layer is deposited using a mask.