Nitride semiconductor component and process for its production
First Claim
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1. Process for the production of a layer structure of a nitride semiconductor component on a silicon surface, including the steps:
- provision of a substrate that has a silicon surface;
deposition of an aluminium-containing nitride nucleation layer on the silicon surface of the substrate;
optional;
deposition of an aluminium-containing nitride buffer layer on the nitride nucleation layer;
deposition of a masking layer on the nitride nucleation layer or, where present, on the first nitride buffer layer;
deposition of a gallium-containing first nitride semiconductor layer on the masking layer,wherein the masking layer is deposited in such a way that, in the deposition step of the first nitride semiconductor layer, initially separate crystallites grow that coalesce above a coalescence layer thickness and occupy an average surface area of at least 0.16 μ
m2 in a layer plane of the coalesced nitride semiconductor layer that is perpendicular to the growth direction.
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Abstract
The invention relates to a process for the production of a layer structure of a nitride semiconductor component on a silicon surface, comprising the steps:
- provision of a substrate that has a silicon surface;
- deposition of an aluminium-containing nitride nucleation layer on the silicon surface of the substrate;
- optional: deposition of an aluminium-containing nitride buffer layer on the nitride nucleation layer;
- deposition of a masking layer on the nitride nucleation layer or, if present, on the first nitride buffer layer;
- deposition of a gallium-containing first nitride semiconductor layer on the masking layer,
wherein the masking layer is deposited in such a way that, in the deposition step of the first nitride semiconductor layer, initially separate crystallites grow that coalesce above a coalescence layer thickness and occupy an average surface area of at least 0.16 μm2 in a layer plane of the coalesced nitride semiconductor layer that is perpendicular to the growth direction.
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Citations
56 Claims
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1. Process for the production of a layer structure of a nitride semiconductor component on a silicon surface, including the steps:
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provision of a substrate that has a silicon surface; deposition of an aluminium-containing nitride nucleation layer on the silicon surface of the substrate; optional;
deposition of an aluminium-containing nitride buffer layer on the nitride nucleation layer;deposition of a masking layer on the nitride nucleation layer or, where present, on the first nitride buffer layer; deposition of a gallium-containing first nitride semiconductor layer on the masking layer, wherein the masking layer is deposited in such a way that, in the deposition step of the first nitride semiconductor layer, initially separate crystallites grow that coalesce above a coalescence layer thickness and occupy an average surface area of at least 0.16 μ
m2 in a layer plane of the coalesced nitride semiconductor layer that is perpendicular to the growth direction.- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
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16. Process for the production of a nitride semiconductor component, comprising the steps:
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production of a layer structure of a nitride semiconductor component on a silicon surface according to claim 1; bonding of the layer structure to a carrier in such a way that the growth upper side of the layer structure is facing the carrier; either complete or partial removal of the substrate; production of a contact structure.
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17. Process according to claim 16, with a step involving the deposition of an electrically conducting contact layer on the growth upper side of the layer structure.
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18. Process according to claim 17, in which for the contact layer a material is used that has a higher refractive index than the p-doped nitride semiconductor cover layer.
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19. Process according to one of claim 16, with a step, carried out before the bonding, involving metallisation of the growth upper side of the layer structure or, if present, of the contact layer.
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20. Process according to claim 16, in which a carrier is used whose surface that is employed for the bonding is electrically conducting or reflecting or metallic.
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21. Process according to claim 18, in which the nitride semiconductor cover layer of the layer structure is deposited in a thickness of
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22. Process according to claim 17, in which a material is used for the contact layer that has a smaller refractive index than the p-doped nitride semiconductor cover layer.
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23. Process according to claim 22, in which the nitride semiconductor cover layer of the layer structure is deposited in a thickness of
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24. Process according to one of claim 16 in which the bonding is carried out at a temperature in the range between 280 and 500°
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25. Process according to one of claim 16, in which the step of removing the substrate is carried out by grinding or by combined grinding and etching.
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26. Process according to claim 16, in which the step of removing the substrate is carried out solely by etching.
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27. Process according to claim 16, in which the growth rear side exposed by the removal of the substrate is structured for the formation of an anti-reflection-acting layer.
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28. Nitride semiconductor component with
a gallium-containing first nitride semiconductor layer that has a structure of coalesced crystallites that occupy an average surface area of at least 0.16 μ - m2 in a layer plane perpendicular to the growth direction,
an aluminium-containing nitride intermediate layer that adjoins the first nitride semiconductor layer, and a gallium-containing further, second nitride semiconductor layer adjoining the last layer. - View Dependent Claims (29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47)
- m2 in a layer plane perpendicular to the growth direction,
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48. Nitride semiconductor product with
a substrate that has a silicon surface, an aluminium-containing nitride nucleation layer adjoining the silicon surface, optional: - an aluminium-containing nitride buffer layer adjoining the nitride nucleation layer,
a masking layer on the nitride nucleation layer or, if present, on the nitride buffer layer, and with a gallium-containing first nitride semiconductor layer arranged adjoining the masking layer and having a structure of coalesced crystallites, in which the crystallites above a coalescence layer thickness and in a layer plane perpendicular to the growth direction occupy an average surface area of at least 0.16 μ
m2. - View Dependent Claims (49, 50, 51, 52, 53, 54, 55, 56)
- an aluminium-containing nitride buffer layer adjoining the nitride nucleation layer,
Specification