Method for fabricating a three-dimensional acceleration sensor
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Abstract
According to the present invention, a method for fabricating a three-dimensional acceleration sensor, comprising: providing a semiconductor substrate having first and second surfaces; forming an insulating layer on the first surface of the semiconductor substrate; forming an active layer on the insulating layer; forming a plurality of openings on the active layer at a first region, which is to be located above a movable mass with a predetermined space; selectively removing the insulating layer located under the first region in a wet-etching process through the plurality of openings; and selectively removing the active layer to form a groove separating the first region from a movable mass.
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Citations
39 Claims
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1-29. -29. (canceled)
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30. A method for fabricating a three-dimensional acceleration sensor, comprising:
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providing a semiconductor substrate having first and second surfaces;
forming an insulating layer on the first surface of the semiconductor substrate;
forming an active layer on the insulating layer;
selectively removing the semiconductor substrate so as to define a first boundary of a movable mass;
providing a glass plate on the second surface of the semiconductor substrate;
forming a plurality of first openings on the active layer at a first region;
forming a plurality of second openings on the active layer at a second region adjacent the first region so that the second openings have larger areas than the first openings;
selectively removing the insulating layer located under the first region in a wet-etching process through the plurality of the first openings; and
after the step of removing the insulating layer located under the first region, selectively removing the insulating layer located under the second region in a wet-etching process through the plurality of the second openings. - View Dependent Claims (31, 32, 33, 34, 35, 36, 37, 38, 39)
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Specification