Capacitor electrode formed on surface of integrated circuit chip
First Claim
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1. A sensor comprising:
- a sensor housing defining a cavity therein, said housing comprising a first wall partially defining said cavity that is deflectable under a physiologically relevant range of pressures;
an integrated circuit chip bearing electronics, said chip being fixedly mounted within said cavity, and said chip having input and output pads;
a capacitor comprising first and second capacitor plates in generally parallel, spaced-apart relation, said first capacitor plate being physically coupled to said deflectable wall so as to move as said wall deflects, and said second capacitor plate being carried by said chip; and
means for placing said second capacitor plate in electrical communication with said input pad of said chip.
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Abstract
A sensor has a sensor housing defining a cavity therein. A first wall partially defining the cavity is deflectable under a physiologically relevant range of pressures. An integrated circuit chip bearing electronics is fixedly mounted within the cavity. A capacitor comprises first and second capacitor plates in generally parallel, spaced-apart relation. The first capacitor plate is physically coupled to the deflectable wall so as to move as the wall deflects, and the second capacitor plate is carried by the chip. The second capacitor plate is in electrical communication with the input pad of the chip.
56 Citations
13 Claims
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1. A sensor comprising:
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a sensor housing defining a cavity therein, said housing comprising a first wall partially defining said cavity that is deflectable under a physiologically relevant range of pressures;
an integrated circuit chip bearing electronics, said chip being fixedly mounted within said cavity, and said chip having input and output pads;
a capacitor comprising first and second capacitor plates in generally parallel, spaced-apart relation, said first capacitor plate being physically coupled to said deflectable wall so as to move as said wall deflects, and said second capacitor plate being carried by said chip; and
means for placing said second capacitor plate in electrical communication with said input pad of said chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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Specification