POWER SURFACE MOUNT LIGHT EMITTING DIE PACKAGE
First Claim
Patent Images
1. A light emitting die package, comprising:
- a substrate having a first surface, a first conductive lead on the first surface that is insulated from the substrate by an insulating film, the first conductive lead forming a mounting pad for mounting a light emitting device, and a lead electrically connected to the first conductive lead and extending away from the first surface.
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Abstract
A light emitting die package is provided which includes a metal substrate having a first surface and a first conductive lead on the first surface. The first conductive lead is insulated from the substrate by an insulating film. The first conductive lead forms a mounting pad for mounting a light emitting device. The package includes a metal lead electrically connected to the first conductive lead and extending away from the first surface.
142 Citations
49 Claims
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1. A light emitting die package, comprising:
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a substrate having a first surface, a first conductive lead on the first surface that is insulated from the substrate by an insulating film, the first conductive lead forming a mounting pad for mounting a light emitting device, and a lead electrically connected to the first conductive lead and extending away from the first surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A light emitting die package, comprising:
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a substrate having a first surface and a second surface opposite the first surface, a via hole through the substrate, a conductive lead extending from the first surface to the second surface, the conductive lead insulated from the substrate by an insulating film, and a metal contact pad on one of the first and second surfaces electrically connected to the conductive lead, the metal contact pad having a light emitting diode (LED) mounted thereon. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25)
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26. A light emitting die package, comprising:
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a substrate having a first surface and a second surface opposite the first surface, a first conductive lead on the first surface that is insulated from the substrate by a first insulating film, the first conductive lead forming a mounting pad for mounting a light emitting device, and at least one via hole formed through the substrate, a surface of the via hole being coated with a second insulating film. - View Dependent Claims (27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41)
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42. A light emitting die package, comprising:
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a substrate having a top surface and a bottom surface, at least one conductive element on the top surface connected to a light emitting device and at least one conductive element attached to the bottom surface, and at least two via holes formed through the substrate, each via hole including an electrical conductor therein which electrically connects the at least one conductive elements on the top and bottom surfaces of the substrate. - View Dependent Claims (43, 44, 45, 46, 47, 48, 49)
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Specification