Light emitting device package and method of manufacturing the same

• US 20070200131A1
• Filed: 02/16/2007
• Published: 08/30/2007
• Est. Priority Date: 02/28/2006
• Status: Active Grant

• Current Assignee: Suzhou Lekin Semiconductor Company Limited
• Original Assignee: LG Electronics, Inc. (LG Corporation), LG Innotek Company Limited (LG Corporation)
• Inventors: Kim, Geun
• Granted Patent: US 7,738,764 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting device package and a method of manufacturing the same are disclosed. The light emitting device package includes a package structure, two diffusion layers formed on the package structure such that the two diffusion layers are electrically separated from each other, and first and second electrodes insulated from the package structure by an insulation film. The first and second electrodes are electrically connected with the two diffusion layers, respectively.

Claims

1. A light emitting device package comprising:

a package structure;

two diffusion layers formed on the package structure such that the two diffusion layers are electrically separated from each other; and

first and second electrodes insulated from the package structure by an insulation film, the first and second electrodes being electrically connected with the two diffusion layers, respectively.

2. The light emitting device package according to claim 1, wherein the package structure is made of silicon, ceramic, or plastic.

3. The light emitting device package according to claim 1, wherein the package structure is provided at a first surface thereof with a mounting groove having an inclined side surface.

4. The light emitting device package according to claim 1, wherein the two diffusion layers have the same polarity.

5. The light emitting device package according to claim 4, wherein the two diffusion layers have a polarity different from that of a region of the package structure where the diffusion layers are not formed.

6. The light emitting device package according to claim 3, further comprising:

a light emitting device disposed in the mounting groove, the light emitting device being electrically connected with the first and second electrodes.

7. The light emitting device package according to claim 6, wherein the first and second electrode formed on the mounting groove reflect light emitted from the light emitting device.

8. The light emitting device package according to claim 6, wherein the light emitting device is flip-chip bonded to the mounting groove by solder.

9. The light emitting device package according to claim 6, wherein the light emitting device is connected in parallel with the first and second electrodes.

10. The light emitting device package according to claim 6, further comprising:

a molding part for filling a space defined between the light emitting device and the mounting groove and sealing the package structure.

11. The light emitting device package according to claim 10, wherein the molding part is made of a mixture including composite resin powder and fluorescent powder.

12. The light emitting device package according to claim 1, wherein the insulation film is formed at the entire surface of the package structure excluding regions where the two diffusion layers are formed.

13. A light emitting device package comprising:

a package structure;

a diffusion layer formed on the package structure; and

first and second electrodes insulated from the package structure by an insulation film, wherein

the first electrode is electrically connected with the diffusion layer.

14. The light emitting device package according to claim 13, wherein the second electrode is electrically connected with the package structure.

15. A method of manufacturing a light emitting device package, comprising:

forming at least one diffusion layer on a first surface of a substrate; and

forming first and second electrodes such that the first and second electrodes are insulated from the substrate and are electrically connected with the at least one diffusion layer.

16. The method according to claim 15, further comprising:

applying a mask on a second surface of the substrate, exposing the substrate to light, and selectively etching the substrate to form a mounting groove having an inclined side surface.

17. The method according to claim 16, further comprising:

flip-chip bonding a light emitting device to the mounting groove via solder such that the light emitting device is electrically connected with the first and second electrodes.

18. The method according to claim 15, further comprising:

forming a plurality of light emitting device packages on the substrate by unit of a wafer; and

separating the light emitting device packages from each other.

19. The method according to claim 18, further comprising:

etching the substrate in a wet-type etching fashion through a bulk micro machining process to form through-holes through the substrate such that the light emitting device packages are divided from each other by the through-holes and to form a mounting groove in each light emitting device package.