Nanowire device and method of making

• US 20070200187A1
• Filed: 02/28/2006
• Published: 08/30/2007
• Est. Priority Date: 02/28/2006
• Status: Abandoned Application

• Current Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Mangat, Pawitter, Amlani, Islamshah
• Application Number:
  US11/363,696
• Publication Number:
  US 20070200187A1
• Time in Patent Office: Days
• US Class Current: 257/415
• CPC Class Codes: B82Y 10/00 Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
• CPC Class Codes: H01L 29/0665 the shape of the body defining a nanostructure nanotechnology per se B82B
• CPC Class Codes: H01L 29/0673 oriented parallel to a substrate

Abstract

A method (40) for fabricating a nanoscale device, includes nano-imprinting (44) a one dimensional nanostructure (20) on a material (12), forming (46) a patterning layer (22, 26) over the one dimensional nanostructure (20) and the material (12), patterning (48) the patterning layer (22, 26) to differentiate an area over the one dimensional nanostructure (20), and etching (52, 56) the differentiated area and a portion of the material (12) to create a trench (24) under the one dimensional nanostructure (20). The one dimensional nanostructure (20) is coupled to circuitry (30) formed in the material (12).

Claims

1. A method comprising:

nano-imprinting a one dimensional nanostructure on a material;

forming a patterning layer over the one dimensional nanostructure and the material;

patterning the patterning layer to differentiate an area over the one dimensional nanostructure; and

etching the differentiated area and a portion of the material to create a trench under the one dimensional nanostructure.

2. The method of claim 1 wherein the nano-imprinting step comprises one of a subtractive process or a lift-off process.

3. The method of claim 1 wherein the forming step comprises forming a dielectric layer.

4. The method of claim 1 wherein the forming step comprises forming a photoresist layer.

5. The method of claim 4 further comprising removing the photoresist layer.

6. The method of claim 1 wherein the nano-imprinting step comprises nano-imprinting first and second conductive pads at opposed ends of the one dimensional nanostructure.

7. The method of claim 1 further comprising:

forming a first electrode coupled to the first conductive pad;

forming a second electrode coupled to the second conductive pad; and

forming circuit elements coupled to the first and second electrode for sensing environmental agents attaching to the one dimensional nanostructure.

8. The method of claim 1 wherein the nano-imprinting step comprises nano-imprinting one of a nanowire, a cantilever, an interdigited array, and a ring.

9. The method of claim 1 further comprising electropolishing the one dimensional nanostructure.

10. A method for fabricating a sensor in an integrated circuit, comprising:

providing a substrate;

forming a sensor circuit over the substrate;

nano-imprinting a nanowire over the substrate;

forming a patterning layer over the one dimensional nanostructure and the material;

patterning the patterning layer to differentiate an area over the one dimensional nanostructure;

etching the differentiated area and a portion of the substrate to create a trench under the one dimensional nanostructure; and

coupling the nanowire to the sensor circuit.

11. The method of claim 10 wherein the nano-imprinting step comprises one of a subtractive process or a lift-off process.

12. The method of claim 10 wherein forming a patterning layer comprises forming a dielectric layer.

13. The method of claim 10 wherein the forming a patterning layer comprises forming a photoresist layer.

14. The method of claim 13 further comprising removing the photoresist layer.

15. The method of claim 10 wherein the nano-imprinting step comprises nano-imprinting first and second conductive pads at opposed ends of the one dimensional nanostructure.

16. The method of claim 10 further comprising:

forming a first electrode coupled to the first conductive pad;

forming a second electrode coupled to the second conductive pad; and

forming circuit elements coupled to the first and second electrode for sensing environmental agents attaching to the one dimensional nanostructure.

17. The method of claim 10 wherein the nano-imprinting step comprises nano-imprinting one of a nanowire, a cantilever, an interdigited array, and a ring.

18. The method of claim 10 further comprising electropolishing the one dimensional nanostructure.

19. A device comprising:

a material defining a trench; and

an electronic circuit formed in the material, the electronic circuit comprising;

a one dimensional nanostructure nano-imprinted on the material and suspended over the trench.

20. The device of claim 19 further comprising a dielectric layer overlying the one dimensional nanostructure and at least a portion of the material.