Semiconductor Device for an Ultra Wideband Standard for Ultra-High-Frequency Communication, and Method for Producing the Same
First Claim
1. An ultra-wideband semiconductor device for an ultra-wideband standard for ultra-high-frequency communication, comprising:
- an ultra-wideband semiconductor chip;
an ultra-wideband circuit with passive devices;
a multilayer circuit substrate with at least a lower metal layer and an upper metal layer, in which the ultra-wideband circuit is arranged, and wherein the lower metal layer comprises external contact pads on which external contacts are arranged, enabling the semiconductor device to be surface-mounted on a circuit board;
an antenna operatively coupled to the semiconductor chip via the ultra-wideband circuit and arranged above the semiconductor chip and the circuit substrate; and
a shield for the ultra-wideband circuit.
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Accused Products
Abstract
A semiconductor device for an ultra-wideband standard for ultra-high-frequency communication includes an ultra-wideband semiconductor chip and a multilayer circuit substrate with at least one lower metal layer and one upper metal layer, in which an ultra-wideband circuit with passive devices is arranged. The lower metal layer has external contact pads on which external contacts are arranged, via which the semiconductor device can be surface-mounted on a circuit board. In addition, the semiconductor device has an antenna which is operatively coupled to the ultra-wideband semiconductor chip via the circuit on the circuit substrate and is arranged above the semiconductor chip and the circuit substrate.
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Citations
37 Claims
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1. An ultra-wideband semiconductor device for an ultra-wideband standard for ultra-high-frequency communication, comprising:
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an ultra-wideband semiconductor chip; an ultra-wideband circuit with passive devices; a multilayer circuit substrate with at least a lower metal layer and an upper metal layer, in which the ultra-wideband circuit is arranged, and wherein the lower metal layer comprises external contact pads on which external contacts are arranged, enabling the semiconductor device to be surface-mounted on a circuit board; an antenna operatively coupled to the semiconductor chip via the ultra-wideband circuit and arranged above the semiconductor chip and the circuit substrate; and a shield for the ultra-wideband circuit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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29. A method for producing an ultra-wideband semiconductor device, the method comprising:
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producing a circuit substrate with at least with at least a lower metal layer and an upper metal layer; connecting an ultra-wideband semiconductor chip to the circuit substrate via connecting elements; embedding the connecting elements and at least part of the semiconductor chip in an encapsulation compound; fitting an antenna above the semiconductor chip; and connecting the antenna to a contact connecting pad on the upper or lower metal layer of the circuit substrate via a connecting element. - View Dependent Claims (30, 31, 32, 33, 34, 35, 36, 37)
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Specification