Electronic device

• US 20070201215A1
• Filed: 02/08/2007
• Published: 08/30/2007
• Est. Priority Date: 02/27/2006
• Status: Abandoned Application

• Current Assignee: DENSO Corporation
• Original Assignee: DENSO Corporation
• Inventors: Ito, Atsushi, Honda, Takayoshi
• Application Number:
  US11/703,660
• Publication Number:
  US 20070201215A1
• Time in Patent Office: Days
• US Class Current: 361/760
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H05K 1/111 Pads for surface mounting, e.g. lay-out
• CPC Class Codes: H05K 1/114 Pad being close to via, but not surrounding the via
• CPC Class Codes: H05K 2201/09663 Divided layout, i.e. conductors divided in two or more parts branched layout H05K2201/09254
• CPC Class Codes: H05K 2201/09681 Mesh conductors, e.g. as a ground plane
• CPC Class Codes: H05K 2201/09709 Staggered pads, lands or terminals; Parallel conductors in different planes
• CPC Class Codes: H05K 2201/10689 Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
• CPC Class Codes: H05K 2201/10727 Leadless chip carrier [LCC], e.g. chip-modules for cards
• CPC Class Codes: H05K 2201/10969 Metallic case or integral heatsink of component electrically connected to a pad on PCB
• CPC Class Codes: H05K 3/341 Surface mounted components
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

In an electronic device, a QFN is surface-mounted on a printed board. The QFN includes a main body containing an IC chip, a reinforcement portion, and multiple terminal portions. The reinforcement portion is exposed from a bottom portion of the main body and mechanically coupled with multiple reinforcement lands on the printed board. The multiple terminal portions are exposed from a peripheral of the main body and electrically coupled with multiple lands on the printed board. In the printed board, the multiple lands are connected with multiple conductive wires. Some of the multiple conductive wires are outside of the surface-mounted area. The others are inside of the surface-mounted area to face the reinforcement lands. This enhances a mounting efficiency in the printed board.

Claims

1. An electronic device comprising:

an electronic component including

a main body,

an IC chip contained in the main body, and

a plurality of terminal portions exposed from the main body; and

a printed board, to which the main body of the electronic component is mounted, the printed board including

a plurality of lands electrically coupled with the terminal portions of the electronic component,

a plurality of conductive wires electrically coupled with the lands, and

a connection member, which mechanically connects the printed board with a surface of the main body, the surface facing the printed board, to thereby mount the electronic component to the printed board,

wherein the conductive wires include a first conductive wire, which is arranged within a surface area of the printed board, the surface area facing the main body of the electronic component, and

wherein the connection member is configured to have a shape to correspond to the first conductive wire arranged within the facing area of the printed board.

2. The electronic device of claim 1,

wherein the conductive wires include a plurality of first conductive wires, which are arranged inside of the facing area, and a plurality of second conductive wires, which are arranged outside of the facing area.

3. The electronic device of claim 2,

wherein the first conductive wires and the second conductive wires are alternately arranged along a peripheral line of the facing area.

4. The electronic device of claim 2, wherein

an elemental component for decreasing noises is electrically mounted to bridge the adjacent second conductive wires.

5. The electronic device of claim 2, wherein

the electronic component includes a reinforcement portion, which supports the IC chip and is exposed from the main body and mechanically connected with the connection member in the printed board.

6. The electronic device of claim 5, wherein

the connection member includes four corner connection sub-members, which are arranged to individually face four corners of the reinforcement portion of the electronic component,

the second conductive wires include corner outside conductive wires, which are arranged to oppose each corner connection sub-member via a peripheral line of the facing area with no first conductive wires intervening.

7. The electronic device of claim 6, wherein

an interval between adjacent two wires of the corner outside conductive wires is larger than an interval between two adjacent conductive wires other than the corner outside conductive wires.

8. The electronic device of claim 6, wherein

one of the corner outside conductive wires is electrically coupled with at least two lands for large current to flow.

9. The electronic device of claim 6, wherein

the connection member further includes a central connection sub-member arranged in a central portion of the facing area, and

first conductive wires are arranged in the facing area to intervene between the central connection sub-member and a peripheral line of the facing area.

10. The electronic device of claim 9, wherein

the central connection sub-member is electrically coupled with a ground.

11. The electronic device of claim 1, wherein

all of the conductive wires are first conductive wires, which are arranged within the facing area.

12. The electronic device of claim 1, wherein

the conductive wires include a plurality of first conductive wires, which are arranged in the facing area to adjoin each other.

13. The electronic device of claim 1, wherein

wherein the connection member includes a reinforcement land and a solder resist.

14. The electronic device of claim 1, wherein

the facing area is approximately rectangular.

15. The electronic device of claim 14, wherein

each of the lands is arranged to cross a peripheral line of the facing area.