Silicon Condenser Microphone and Manufacturing Method

• US 20070202627A1
• Filed: 04/30/2007
• Published: 08/30/2007
• Est. Priority Date: 11/28/2000
• Status: Active Grant

• Current Assignee: Knowles Electronics Llc (Knowles Corporation)
• Original Assignee: Knowles Electronics Llc (Knowles Corporation)
• Inventors: Minervini, Anthony
• Granted Patent: US 7,381,589 B2
• Time in Patent Office: Days
• US Class Current: 438/51
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2207/092 Buried interconnects in the substrate or in the lid
• CPC Class Codes: B81B 3/0021 Transducers for transforming electrical into mechanical energy or vice versa dynamo-electric machines H02K99/00; electrostatic machines H02N1/00; piezoelectric devices H10N30/00
• CPC Class Codes: B81B 7/0038 using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
• CPC Class Codes: B81B 7/0058 for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
• CPC Class Codes: B81B 7/0061 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
• CPC Class Codes: B81B 7/0064 for protecting against electromagnetic or electrostatic interferences
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: B81C 1/00158 Diaphragms, membranes manufacture process for semi-permeable inorganic membranes B01D67/0039
• CPC Class Codes: B81C 1/00301 Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
• CPC Class Codes: B81C 3/00 Assembling of devices or systems from individually processed components
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 23/15 Ceramic or glass substrates H01L23/142, H01L23/145, H01L23/147 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H04R 1/04 Structural association of microphone with electric circuitry therefor in deaf-aid sets H04R25/00
• CPC Class Codes: H04R 1/222 for microphones H04R1/24, H04R1/26 take precedence
• CPC Class Codes: H04R 1/2892 Mountings or supports for transducers
• CPC Class Codes: H04R 19/005 : using semiconductor materials
• CPC Class Codes: H04R 19/016 : for microphones
• CPC Class Codes: H04R 19/04 : Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 2201/003 : Mems transducers or their use of the electrostatic type H04R19/005
• CPC Class Codes: H04R 2225/49 : Reducing the effects of electromagnetic noise on the functioning of hearing aids, by, e.g. shielding, signal processing adaptation, selective (de)activation of electronic parts in hearing aid
• CPC Class Codes: H04R 23/00 : Transducers other than those covered by groups H04R9/00 - H04R21/00 diaphragms for transducers of the distributed-mode type H04R7/045
• CPC Class Codes: H04R 2410/03 : Reduction of intrinsic noise in microphones
• CPC Class Codes: H04R 3/00 : Circuits for transducers , loudspeakers or microphones
• CPC Class Codes: H04R 31/006 : Interconnection of transducer parts of diaphragm and outer suspension by moulding H04R31/003
• CPC Class Codes: Y10T 29/49005 : Acoustic transducer
• CPC Class Codes: Y10T 29/4908 : Acoustic transducer
• CPC Class Codes: Y10T 29/49798 : Dividing sequentially from leading end, e.g., by cutting or breaking

Abstract

A silicon condenser microphone package is disclosed. The silicon condenser microphone package comprises a transducer unit substrate, and a cover. The substrate includes an upper surface having a recess formed therein. The transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and includes an aperture.

Claims

1. A method of manufacturing a microphone comprising:

providing a first panel comprising a plurality of bottom layer portions for a corresponding plurality of microphones;

providing a second panel comprising a plurality of top layer portions for the corresponding plurality of microphones;

disposing a transducer on each of the plurality of bottom layer portions or each of the plurality of top layer portions;

securing the first panel to the second panel to form cavities defined by each top layer portion and each bottom layer portion enclosing each transducer; and

separating microphones from the joined first panel and second panel,

wherein each of the bottom layer portions or each of the top layer portions comprising an acoustic port, the transducer being coupled via the cavity to the acoustic port.

2. The method of claim 1, wherein separating microphones comprises separating microphone pairs.

3. The method of claim 1, wherein disposing the transducer comprises disposing the transducer adjacent the acoustic port.

4. The method of claim 1, comprising providing an environmental barrier within the acoustic port.

5. The method of claim 4, wherein each top layer portion and bottom layer portion comprises a laminate structure, and providing the environmental barrier within the laminate structure,

6. The method of claim 1, comprising providing a conductive portion in each top layer portion and each bottom layer portion and joining the conductive portions.

7. The method of claim 6, the conductive portions comprising conductive layers.

8. The method of claim 7, wherein each top layer portion and bottom layer portion comprises a laminate structure, the conductive layers being formed in the laminate structures.

9. The method of claim 1, wherein disposing the transducer comprises disposing the transducer over the acoustic port.

10. The method of claim 1, comprising providing the acoustic port in each top layer portion and bottom layer portion.

11. The method of claim 1, comprising providing a recess in each top layer portion or bottom layer portion and disposing the transducer comprises disposing the transducer adjacent the recess.

12. The method of claim 1, wherein securing the first panel to the second panel comprises providing a dry adhesive layer between the first panel and the second panel and activating the dry adhesive layer to secure the first panel to the second panel.