COMPOSITE BOARD WITH SEMICONDUCTOR CHIPS AND PLASTIC HOUSING COMPOSITION AND METHOD
First Claim
1. A method for producing semiconductor devices, comprising:
- producing a semiconductor wafer;
separating the semiconductor wafer into a multiplicity of semiconductor chips having active top sides, edge sides and rear sides;
providing a carrier having a top side and an underside, the carrier having the form and dimensions of a wafer, and covering of its top side with an adhesive film, which is adhesive on both sides;
populating the carrier with semiconductor chips in semiconductor device positions, the semiconductor chips being fixed with their active top sides on the adhesive film in rows and columns;
providing a mould for surrounding the semiconductor chips with plastic housing composition, the mould having a lower part and an upper part and a molding cavity and the molding cavity having an upper contact area, which forms an interface with the top side of the plastic housing composition to be applied, the upper contact area being covered with a parting layer having essentially the same surface constitution and the same thermal conductivity as the adhesive film, with the result that a warpage of the composite board of less than 1% is obtained;
introducing of the carrier populated with the semiconductor chips into the molding cavity and embedding the semiconductor chips at least with their edge sides into the plastic housing composition with formation of a composite board having a top side which forms a coplanar area with the top sides of the semiconductor chips;
curing the plastic housing composition and removing the composite board from the mould;
removing the carrier with formation of a self-supporting warpage-free panel; and
separating the panel into individual semiconductor devices.
5 Assignments
0 Petitions
Accused Products
Abstract
One aspect is a composite board including semiconductor chips in semiconductor device positions and a plastic housing composition partly embedding the semiconductor chips. A mould is provided for surrounding the semiconductor chips with plastic housing composition, the mould having a lower part and an upper part and a moldings cavity and the molding cavity having an upper contact area, which forms an interface with the top side of the plastic housing composition to be applied. The upper contact area is covered with a parting layer having essentially the same surface constitution and the same thermal conductivity as an adhesive film forming an interface with the underside of the plastic housing composition, with the result that a warpage of the composite board of less than 1% is obtained.
45 Citations
20 Claims
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1. A method for producing semiconductor devices, comprising:
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producing a semiconductor wafer;
separating the semiconductor wafer into a multiplicity of semiconductor chips having active top sides, edge sides and rear sides;
providing a carrier having a top side and an underside, the carrier having the form and dimensions of a wafer, and covering of its top side with an adhesive film, which is adhesive on both sides;
populating the carrier with semiconductor chips in semiconductor device positions, the semiconductor chips being fixed with their active top sides on the adhesive film in rows and columns;
providing a mould for surrounding the semiconductor chips with plastic housing composition, the mould having a lower part and an upper part and a molding cavity and the molding cavity having an upper contact area, which forms an interface with the top side of the plastic housing composition to be applied, the upper contact area being covered with a parting layer having essentially the same surface constitution and the same thermal conductivity as the adhesive film, with the result that a warpage of the composite board of less than 1% is obtained;
introducing of the carrier populated with the semiconductor chips into the molding cavity and embedding the semiconductor chips at least with their edge sides into the plastic housing composition with formation of a composite board having a top side which forms a coplanar area with the top sides of the semiconductor chips;
curing the plastic housing composition and removing the composite board from the mould;
removing the carrier with formation of a self-supporting warpage-free panel; and
separating the panel into individual semiconductor devices. - View Dependent Claims (2, 3, 4, 5)
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6. A composite board comprising:
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a semiconductor chips in semiconductor device positions; and
an injection-molded plastic housing composition embedding at least edge sides of the semiconductor chips;
wherein a top side of the composite board forms a coplanar area with the top sides of the semiconductor chips; and
wherein the composite board has a warpage of less than 1%. - View Dependent Claims (7, 8, 9)
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10. A composite board comprising:
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semiconductor chips in semiconductor device positions; and
injection-molded means between the semiconductor device positions for embedding at least edge sides of the semiconductor chips;
wherein the composite board is formed in a molding cavity;
wherein an adhesive film is provided for carrying the semiconductor chips in the molding cavity; and
wherein the molding cavity is configured such that a parting layer of the molding cavity is comprised of a similar material to the adhesive film. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification