Method and apparatus for strain monitoring of printed circuit board assemblies
First Claim
1. A printed circuit board assembly comprising:
- a circuit board substrate;
a plurality of mounting points for receiving electrical components carried on the circuit board substrate;
a plurality of electrically conductive pathways carried on the circuit board substrate between mounting points; and
at least one strain detector mounted on the flat board, the strain detector formed of a non-ductile material.
1 Assignment
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Accused Products
Abstract
A technique of monitoring strain on a printed circuit board assembly involves the use of a strain detector mounted on a printed circuit board. The strain detector is formed of a non-ductile material. The strain detector has a narrowed portion forming a weak link that has a characteristic of breaking when a critical strain limit is exceeded. The method of monitoring can include visual or electrical inspection. The electrical inspection can include having a strain monitoring device. The strain monitoring device has a timer connected to at least one strain detector and a memory for storing results connected to the timer. The capacitance of at least one of the strain detectors is sampled and any change in capacitance is recorded to the memory. In one embodiment, a time stamp occurs in the memory based on when an electrical property changes across at least one of the strain detectors.
32 Citations
22 Claims
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1. A printed circuit board assembly comprising:
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a circuit board substrate;
a plurality of mounting points for receiving electrical components carried on the circuit board substrate;
a plurality of electrically conductive pathways carried on the circuit board substrate between mounting points; and
at least one strain detector mounted on the flat board, the strain detector formed of a non-ductile material. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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- 8. A strain detector comprising a planar body having a narrowed portion forming a weak link in the body to allow failure in a pre-defined location, the planar body composed of a non-ductile material.
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12. A method of testing a printed circuit board assembly for failure comprising the following steps:
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providing a printed circuit board;
mounting at least one strain detector having a sensing portion formed of a non-ductile material on the printed circuit board; and
monitoring the sensing portion of the strain detector on the printed circuit board to determine if strain related failure has occurred. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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Specification