Optical Sensor Using a Laser Mounted on Top of a Semiconductor Die
First Claim
Patent Images
1. A semiconductor device, comprising:
- an integrated circuit die; and
an electronic component mounted to the integrated circuit die, the electronic component comprising a light emitting active region.
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Abstract
A semiconductor device comprising an integrated circuit die and an electronic component mounted to the integrated circuit dies wherein the electronic component comprises a light emitting active area arranged to emit light.
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Citations
21 Claims
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1. A semiconductor device, comprising:
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an integrated circuit die; and an electronic component mounted to the integrated circuit die, the electronic component comprising a light emitting active region. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A system, comprising:
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an integrated circuit die; and an electronic component mounted to the integrated circuit die, the electronic component comprising a light emitting active region - View Dependent Claims (9, 10, 11)
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12. A method of assembling a semiconductor device, the method comprising:
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mounting an electronic component onto an integrated circuit die, wherein the electronic component comprises a light emitting active region; coupling an anode and a cathode to a respective anode connector and a cathode connector via wire bonds, wherein both the anode connector and cathode connector are located on the integrated circuit die; and encapsulating the integrated circuit die and the electronic component with a mold of a transparent material. - View Dependent Claims (13, 14)
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15. A method of mounting a device on a base, the method comprising:
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placing an electronic component onto an integrated circuit die, wherein the electronic component comprises a light emitting active region; and bonding a cathode and an anode to the integrated circuit die. - View Dependent Claims (16, 17, 18, 19, 20, 21)
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Specification