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Method of fabricating backside illuminated image sensor

  • US 20070207566A1
  • Filed: 03/06/2006
  • Published: 09/06/2007
  • Est. Priority Date: 03/06/2006
  • Status: Active Grant
First Claim
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1. A method for fabricating a back-side illuminated image sensor, comprising:

  • providing a semiconductor substrate having a front surface and a back surface;

    forming a plurality of transistors, metal interconnects, and metal pads on the front surface of the substrate;

    bonding a supporting layer to the front surface of the substrate;

    thinning-down the semiconductor substrate from the back surface;

    clearing-out a region of the substrate from the back surface that covers a fine alignment mark by performing registration from the back surface and using a global alignment mark as a reference; and

    processing the back surface of the substrate by performing registration from the back surface and using the fine alignment mark as a reference.

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